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2005-06-06	Zuken claims 3-D routing checker cuts design time up to 6 weeks Zuken has introduced a two- and three-dimensional routing checker for high-voltage PCBs that the company claims cuts typical design time by six weeks
2008-10-31	Ziptronix heralds 3-D chip stacking technique Ziptronix unveiled details of its patented Direct Bond Interconnect (DBI) technology, which employs a low-temperature process for 3-D chip stacking without thermal compression.
2012-03-09	Wide I/O driving 3-D with TSV Find out how wide I/O is leading the way to through-silicon vias-based heterogeneous die stacks.
2002-06-11	RVSI receives order for 3-D wafer inspection system Robotic Vision Systems Inc. has received an order for a WS series bumped wafer inspection system from an undisclosed major supplier of materials for BGA semiconductors.
2006-09-18	OPC tool has mask 3-D imaging effects Brion Technologies introduced Tachyon M3D that promises more accurate OPC implementation and verification by incorporating mask three-dimensional imaging effects.
2004-09-23	Nvidia adds 3-D engine to wireless processor Nvidia has added a 3-D core to its GoForce wireless media processor line, giving designers an ability to add gaming capabilities to handheld systems.
2007-02-22	New platform rolls for in-line 3-D SMT inspection Promising a new level of speed, accuracy and flexibility, the SVS Ascent form GSI Group improves 3-D SMT inspection in terms of price-over-performance for boards up to 50.8-by-61cm.
2005-12-08	Japanese researchers unveil 3-D stack for chip integration Japanese researchers have come up with a new three-dimensional integration technology called Super-Smart-Stack that uses a self-assembly technique to maintain chip alignment accuracy to within 1?m.
2012-08-16	Initial draft of 3-D DRAM specs released to HMCC members The Hybrid Memory Cube Consortium has release a draft of interface specifications for its 3-D DRAM memory stack.
2007-07-06	3-D EMF simulator handles massive, complex models Ansoft has released a new version of its EMF simulation software that allows customers to perform massive simulations of structures that were simply too large to solve previously.
2002-12-05	3-d coordinate transforms with the pdsp16330 This article shows how the Pythagoras Processor PDSP16330 can be used for three dimensional transforms.
2012-09-14	X-Fab claims the first open platform MEMS 3D process X-Fab's 3-D sensor process is suitable for applications ranging from mobile devices, consumer goods, games and toys, automotive, robotics, industrial and medical equipment.
2004-10-25	System General, Matrix team up in programming solutions Taiwan-based System General Corp., a provider of device programming instruments, has collaborated with Matrix Semiconductor to develop content programming solutions for Matrix 3-D Memory (3DM).
2005-06-27	Simulator leaps to 64 bits Better accuracy, higher capacity, and quicker results are promised with a 64-bit version of Agilent Technologies' Momentum 3-D planar electromagnetic simulator software.
2007-07-02	Image chip makes car vision affordable the Swiss Center for Electronics and CSEM S.A. claim to have the technology to lower the cost of automotive vision systems from thousands of dollars to hundreds.
2012-07-06	Hybrid Memory Cube group adds ARM, HP, SK Hynix Hewlett-Packard and SK Hynix join Micron and Samsung in an effort to achieve an open interface for stacked memory.
2004-03-02	Hitachi develops omnidirectional 3D display Hitachi has developed a prototype 3D display that can show an object from any and all directions, a full 360°.
2007-12-19	Class D audio subsystems render 3D stereo sound Maxim Integrated Products has introduced the MAX9775/MAX9776 highly efficient Class D audio subsystems that provide 3D stereo enhancement.
2004-01-21	C&C Battery GEL, AGM products suit electric vehicles C&C Battery Co. Ltd has rolled out its GEL and AGM batteries that are designed for use in electric vehicles such as golf cars and fork-lift trucks.
2004-10-08	ARM NEON tech targets mobile, multimedia products ARM has launched its NEON technology, a media and signal processing solution designed to accelerate a broad range of applications.
2012-11-16	Altera, Huawei incorporate FPGA, memory in 2.5-D tech The new device will significantly reduce board space while increasing performance.
2012-08-14	AKM keeps top spot in magnetic sensor market With a revenue of $372 million, Japan-based AKM claims almost one-quarter of the industry's $1.5 million total.
2005-05-27	Video converter renders dual images National Semiconductor introduced what it claims is the first dual-channel video format converter for high-definition television that features two video conversion channels and a dual 3-D architecture
2014-07-09	Sand is the holy grail of Li-ion anodes When processed, sand becomes a pure nano-silicon formed in a very porous 3-D silicon—believed to be the key to expanding the expected lifespan of Si-based batteries up to 3 times or more.
2013-02-19	Paper tackles 3D IC temperature solutions The methodology flow presented in the paper will demonstrate the link between the 3-D IC package thermal simulations with the system thermal simulation.
2004-01-09	Nvidia joins cellphone 3D group as first chipsets roll PC graphics leader Nvidia Corp. announced it is joining the Khronos Group, an ad hoc organization defining a subset for cellular phones of the OpenGL 3-D graphics application programming interface.
2008-08-22	Intel's Canmore connects TV, CE devices to Internet Intel's new media processor (previously codenamed "Canmore") combines CE features for high-definition video support, home-theater quality audio and advanced 3-D graphics, with the performance, flexibility and compatibility of IA-based hardware and software
2012-09-05	IBM, STM to create NEMS-based logic process The goal of NEMIAC project is to develop a logic process based on nanometer-scale relays suited for embedded systems and allowing 3-D integration with CMOS.
2012-09-24	Globalfoundries to offer 14nm process tech Globalfoundries unexpectedly announced its plans to offer 14-nm process technology featuring FinFET 3-D transistors in 2014 in a bid to leapfrog rival foundries.
2011-08-31	Ensuring accuracy of angle estimation in eCompass Know the relationship between errors in the outputs from accelerometer and magnetometer sensors and the resulting errors in the roll, pitch and yaw angles computed by a tilt-compensated electronic compass or 3-D Pointer application.