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2011-04-11 What's behind TSMC's 450mm move
Aside from reducing production costs and keeping the company ahead of its rivals, TSMC's move into 450mm would allow it to hire 7,000 fewer engineers over a 10-year period
2010-06-01 VLSI: 450mm has a long way to go
Countering some reports, the move to 450mm fabs is still unlikely for the foreseeable future due to costs, according to VLSI Research Inc
2011-03-04 TSMC details 450mm fab plans
TSMC will install a 450mm pilot line in Fab 12 in Hsinchu then bring the line up in Taichung to process devices at the 14nm node. It aims to produce 14nm FinFETs at its Taichung fab by 2015 or 2016.
2011-02-03 TSMC bares plan to build 450mm fab
TSMC's announcement that it will build a 450mm fab could push rivals Samsung and GlobalFoundries to follow suit and include 450mm into their plans immediately.
2007-10-08 Toshiba mulls over 450mm fab, EUV litho
Aiming to maintain its edge in the IC market, Japan's Toshiba Corp. is exploring several new chip-production technologies, including 450-mm fabs and EUV lithography.
2008-12-19 Tech firms deliberate shift to 450mm
Panelists at the IEDM agreed to disagree about the future of fabs, including the shift towards 450mm plants, which could cost a staggering $10 billion if or when these giant facilities get built
2012-06-14 Taiwan OKs TSMC's 450mm fab
The plan, approved by the Council for Economic Planning and Development, has a total investment cost estimated at between $8 billion and $10 billion.
2010-05-27 Semico: Shift to 450mm is inevitable
The probability that the semiconductor industry will shift to 450mm silicon wafers in manufacturing has increased significantly, however, the chance of achieving volume production by the original target date of 2012 is remote
2008-07-14 Sematech: 450mm program is on track
International Sematech is moving full speed ahead with its 450mm programs, but the question is whether the industry can meet its lofty goals in building 450mm fabs by 2012
2009-10-27 Sematech installs tools in 450mm prototype fab
International Sematech has moved into the "test wafer generation" stage and installed the first tools in its 450mm prototype clean room, including metrology and wet-clean systems
2007-07-19 Sematech doubles 450mm efforts
International Sematech has announced the launch of a new and dedicated 450mm fab R&D program.
2009-07-06 Sematech continues 450mm campaign
Despite the current downturn, International Sematech claims it continues to make progress on 450mm tool technology by announcing several new efforts in the arena
2008-06-12 Samsung gains edge in 450mm technology
Sources said the first 450mm tool, which is believed to be a R&D prototype, is said to go to South Korea's Samsung Electronics Co. Ltd
2007-07-25 Foundry tool makers cool to Sematech 450mm plan
Sematech's announcement of a plan to hasten the industry's move to 450mm wafers has driven a wedge between the semiconductor equipment community and some chipmakers
2007-10-31 Fab tool vendors on 450mm move: 'Flawed and misguided'
Fab tool vendors called Sematech's 450mm fab program flawed and misguided, and argued that moving to the next-generation wafer size would yield little or no cost benefit.
2011-02-04 Fab firms' focus on 450mm could disrupt supply chain
Analysts fear there is not enough 300mm capacity today and 450mm plants under construction may not start mass production until 2017 or 2018, a scenario that could trigger disruptions in the IC supply chain
2010-01-15 Downturn, low support further delay 450mm
Despite rumblings about possible delays for the next-generation wafer size, leading fab tool companies still resist to support 450mm technology.
2009-04-20 Analyst: Stay away from 450mm
Semiconductor equipment vendors should boycott development of tools for the transition to 450mm wafers, The Information Network analyst warned, saying chip gear vendors were the losers in the transition to 300mm wafers and would likely not benefit from the next move to larger wafers
2007-10-26 AMD puts 450mm fab transition on hold
Adopting a different approach than rival Intel Corp., Advanced Micro Devices Inc. (AMD) is set on maximizing utilization of existing 300mm fabs before moving to the larger 450mm wafer size
2008-10-24 450mm wafer standard gets industry nod
Hoping to accelerate the development of 450mm fabs, International Sematech and others have formulated a preliminary standard for 450mm silicon wafers
2007-10-30 450mm tool testing facility in Sematech's agenda
Sematech is proposing to establish a "factory integration test bed" facility for the development of 450mm fab tools.
2009-01-19 450mm fab spins new round of debate
The Industry Strategy Symposium (ISS) witnessed the next round of the 450mm fab debate.
2008-07-21 450mm debate remains in the hot seat
The 450mm debate rages on. At the Semicon West Trade Show, SEMI and many fab-tool vendors earlier this week telegraphed their position on 450mm, reiterating that the economics do not add up for the next-generation wafer size.
2008-06-16 UMC tips roadmap, veers away from 450mm
Taiwan foundry United Microelectronics Corp. has outlined its process roadmap and disclosed several alliances with the EDA community at the Design Automation Conference (DAC).
2008-05-07 TSMC, Intel, Samsung join hands on 450mm shift
Intel, Samsung and TSMC have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012
2011-12-16 TSMC preps for $26B fab
TSMC is building a $26 billion fab on a 50-hectare plot at Central Taiwan Science Park in Taichung, Taiwan
2005-08-19 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2005-08-22 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025 ? a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2011-06-10 SEMI: 2011 fab tool spending to hit record $44B
This year, fab equipment spending will grow 31 percent due to companies' increased capex guidance, while spending on new fabs will drop 3 percent due to the historically low volume of new fab construction
2014-10-17 Samsung to build $14.7B IC fab
In order to maintain leadership in memory IC sales and support new markets, Samsung is building a new wafer fab in South Korea, estimated at $14.7 billion
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