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2011-04-11 What's behind TSMC's 450mm move?
Aside from reducing production costs and keeping the company ahead of its rivals, TSMC's move into 450mm would allow it to hire 7,000 fewer engineers over a 10-year period.
2010-06-01 VLSI: 450mm has a long way to go
Countering some reports, the move to 450mm fabs is still unlikely for the foreseeable future due to costs, according to VLSI Research Inc.
2008-06-16 UMC tips roadmap, veers away from 450mm
Taiwan foundry United Microelectronics Corp. has outlined its process roadmap and disclosed several alliances with the EDA community at the Design Automation Conference (DAC).
2008-05-07 TSMC, Intel, Samsung join hands on 450mm shift
Intel, Samsung and TSMC have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012.
2011-03-04 TSMC details 450mm fab plans
TSMC will install a 450mm pilot line in Fab 12 in Hsinchu then bring the line up in Taichung to process devices at the 14nm node. It aims to produce 14nm FinFETs at its Taichung fab by 2015 or 2016.
2011-02-03 TSMC bares plan to build 450mm fab
TSMC's announcement that it will build a 450mm fab could push rivals Samsung and GlobalFoundries to follow suit and include 450mm into their plans immediately.
2007-10-08 Toshiba mulls over 450mm fab, EUV litho
Aiming to maintain its edge in the IC market, Japan's Toshiba Corp. is exploring several new chip-production technologies, including 450-mm fabs and EUV lithography.
2008-12-19 Tech firms deliberate shift to 450mm
Panelists at the IEDM agreed to disagree about the future of fabs, including the shift towards 450mm plants, which could cost a staggering $10 billion if or when these giant facilities get built.
2012-06-14 Taiwan OKs TSMC's 450mm fab
The plan, approved by the Council for Economic Planning and Development, has a total investment cost estimated at between $8 billion and $10 billion.
2008-02-22 Survey reveals mixed signals for 450mm
Will the IC industry ever build 450mm fabs? The results are mixed, according to a report from Wright Williams & Kelly, a U.S.-based cost management software and consulting firm.
2005-08-19 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2005-08-22 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025 ? a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2010-05-27 Semico: Shift to 450mm is inevitable
The probability that the semiconductor industry will shift to 450mm silicon wafers in manufacturing has increased significantly, however, the chance of achieving volume production by the original target date of 2012 is remote.
2008-07-14 Sematech: 450mm program is on track
International Sematech is moving full speed ahead with its 450mm programs, but the question is whether the industry can meet its lofty goals in building 450mm fabs by 2012.
2009-10-27 Sematech installs tools in 450mm prototype fab
International Sematech has moved into the "test wafer generation" stage and installed the first tools in its 450mm prototype clean room, including metrology and wet-clean systems.
2007-07-19 Sematech doubles 450mm efforts
International Sematech has announced the launch of a new and dedicated 450mm fab R&D program.
2009-07-06 Sematech continues 450mm campaign
Despite the current downturn, International Sematech claims it continues to make progress on 450mm tool technology by announcing several new efforts in the arena.
2008-06-12 Samsung gains edge in 450mm technology
Sources said the first 450mm tool, which is believed to be a R&D prototype, is said to go to South Korea's Samsung Electronics Co. Ltd.
2012-08-09 Nikon, Intel to develop 450mm wafer steppers
The Japanese firm is going to work with Intel to develop the next generation semiconductor manufacturing equipment capable of handling 450mm wafers that Nikon plans to commercialize by 2018.
2013-01-22 Molecular Imprints comes first in 450mm race
Molecular Imprints Inc. has recently disclosed that one of their machines are being used by an unnamed semiconductor company to support the development of 450mm diameter wafers.
2010-10-18 Korea co. makes 450mm wafers
South Korea silicon wafer maker LG Siltron Inc. is developing 450mm substrates in anticipation of a migration to the arena.
2012-07-11 Intel purchases ASML shares to dev't 450mm wafer
Intel has agreed to take a 15 percent stake in ASML Holding NV to accelerate the development of 450mm wafers and extreme ultraviolet lithography.
2007-11-21 Intel CEO to tool makers: 'Let's cooperate on 450mm'
Despite some resistance for 450mm fabs in the market, Intel is moving ahead with 450mm technology and would like to cooperate with the IC-equipment industry in the arena, according to Paul Otellini, president and CEO of the chip giant.
2013-04-12 InnoLas completes second 450mm system installation
As an optional Bridge-Tool Variant, InnoLas Semiconductor's new system can mark 450mm and 300mm wafers on either side.
2006-01-12 Industry not ready for 450mm, says Applied
Applied Materials' president warned that the semiconductor equipment industry is not ready to move full speed ahead and develop next-gen, 450mm tools due to a funding shortfall in the overall business.
2007-07-25 Foundry tool makers cool to Sematech 450mm plan
Sematech's announcement of a plan to hasten the industry's move to 450mm wafers has driven a wedge between the semiconductor equipment community and some chipmakers.
2009-07-17 Foundry panel: 450mm can wait
With chip companies and their suppliers fighting for their lives amidst a brutal industry downturn, the migration to 450mm wafersand the enormous R&D costs it will take to get therecan wait, according to executives from several foundries speaking at Semicon West.
2007-10-31 Fab tool vendors on 450mm move: 'Flawed and misguided'
Fab tool vendors called Sematech's 450mm fab program flawed and misguided, and argued that moving to the next-generation wafer size would yield little or no cost benefit.
2011-02-04 Fab firms' focus on 450mm could disrupt supply chain
Analysts fear there is not enough 300mm capacity today and 450mm plants under construction may not start mass production until 2017 or 2018, a scenario that could trigger disruptions in the IC supply chain.
2010-01-15 Downturn, low support further delay 450mm
Despite rumblings about possible delays for the next-generation wafer size, leading fab tool companies still resist to support 450mm technology.
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