Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > 450mm

450mm Search results

?
?
total search132 articles
2009-06-15 Top 10 electronics blunders
Every once in awhile, electronics firms or individuals who work for them do something that makes everyone else in the industry scratch their heads and, perhaps, wince. These are actions and decisions thatwhile they may seem perfectly logical to those making the decisionsdon't really add up in the minds of most people.
2011-12-23 Technion, Cornell picked for tech campus
New York City plans a $2 billion science and engineering campus that could serve 2,500 students and 280 faculty by 2043.
2014-03-13 STATS ChipPAC unveils novel wafer level manufacturing
FlexLine claims to provide freedom from wafer diameter constraints while enabling supply chain simplification and cost reductions that are not possible with a conventional manufacturing flow.
2012-07-25 SRC sensor significantly reduces water loss in wafer cleaning
Cleaning sensor determines precisely when a wafer is clean; wireless version available in 2013.
2012-09-20 Slow but strong growth expected for IC market
Though IC unit growth is expected to slow, the IC ASP is expected to jump into the positive range, and help boost average annual IC market growth to eight per cent per year from 2011-2021.
2012-05-28 SIA drafts global tariff policy
"We were able to agree that for the good of the industry and the growth of the semiconductor industry we should petition respective governments to eliminate tariffs all chips including multichip packages," said Brian Toohey, president of the SIA.
2015-09-24 Semiconductor market forecasts and trends
IC Insights revealed that the semiconductor market is expected to be nearly flat this year up two percent to $362 billion, rising just 4.9 per cent on a compound basis through 2019 to $450 billion.
2014-01-23 Semiconductor industry feels ripple effect of Intel's troubles
The need for Intel to cut costs in many areas, even investment in future process technology will impact the semiconductor market significantly.
2010-11-18 Semiconductor equipment industry flounders
The semiconductor equipment industry has been experiencing tough times since 2007 and is in a difficult position to face today's challenging economic conditions.
2011-06-10 SEMI: 2011 fab tool spending to hit record $44B
This year, fab equipment spending will grow 31 percent due to companies' increased capex guidance, while spending on new fabs will drop 3 percent due to the historically low volume of new fab construction.
2003-11-25 Sematech sets up manufacturing subsidiary
International Sematech is creating a subsidiary organization that will focus on manufacturing infrastructure, methods, standards and productivity - including the shift to the next wafer size, the consortium announced.
2009-11-25 Sematech expands, muses fabless push
Sematech is looking at ways to bring fabless companies into the fold and is hoping to expand its collaborative efforts with fab tool makers,
2009-08-20 SanDisk CEO offers NAND forecast
SanDisk Corp. founder, chairman and CEO Eli Harari warned that the NAND industry is at the "crossroads," as there is a "disconnect" between future capacity requirements and demand.
2014-01-20 Samsung, TSMC, Micron lead IC industry by capacity
The top 10 companies now hold 67 percent of worldwide IC industry capacity, up from 54 percent in 2009.
2008-06-27 Samsung, Hynix partner on STT-MRAM
The world's two largest memory chip makers forged an alliance Wednesday to develop next-generation semiconductors so South Korea can stay ahead of foreign rivals, according to an Agence France Presse report.
2014-10-17 Samsung to build $14.7B IC fab
In order to maintain leadership in memory IC sales and support new markets, Samsung is building a new wafer fab in South Korea, estimated at $14.7 billion.
2010-05-21 Samsung readies large-screen OLED TVs
Samsung is increasingly confident in the future of OLEDsnot just for smart phone displays but also for large-size TVs, especially 3D TV.
2015-02-05 Rudolph sends JetStep for fan-out packaging apps
The JetStep Advanced Packaging Lithography System handles both warped wafers and flexible substrates. It offers 52mm x 66mm field view and 30-reticle library.
2013-09-05 Rudolph rolls NSX tool for IC, MEMS and LED packaging
The NSX 220 is an automated macro defect inspection system that uses grey-scale image analysis to provide accurate inspection and metrology in final manufacturing applications for wafers up to 300mm in size.
2012-12-24 Rudolph buys Azores, enters back-end litho market
Rudolph has entered the back-end advanced packaging lithography market with the new JetStep Lithography System, a disruptive innovation featuring a 2X reduction stepper.
2011-09-22 Rough year for the chip industry
The sluggish IC market sales this year will be mainly due to the uncertain future of the global economy and mobile system transitions.
2005-09-01 Road map rethinks process reductions
The ITRS draft scraps nodes and embraces 'cycles' for more incremental transitions.
2013-05-29 Removing field failures at wafer level (Part 1)
Here's a look at Sonoscan's new automated wafer inspection system and its advantages.
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging.
2010-04-27 Novellus' Hill: IC market set for four-year growth cycle
Novellus is back on track after being hit hard by the downturn last year. The IC industry is set for a new and healthy three-to-four year growth cycle, according to Novellus CEO Rick Hill.
2011-05-13 Novellus subsidiary develops new gap measurement tech
Novellus' Peter Wolters subsidiary has developed an innovative gap measurement technology for double-side wafer polishing, resulting in outstanding control of wafer quality.
2013-12-17 Moore's Law may not be a dead end after all
Henry Samueli, co-founder of Broadcom, said that on a positive note, the looming certainty of Moore's Law could push companies such as Broadcom to be more clever about design possibilities.
2015-04-22 Moore's law and 5G: Out with old, in with the new?
In order for 5G to happen, there needs to be a collective effort to shy away from 20nm CMOS and Moore's law and look toward next generation technology for increased speed and lower power.
2015-02-26 Monopoly capitalism could slay high-tech electronics
As an example of monopoly killing technology and evidence of how monopoly in oil industry thwarts fracking technology, the same scenario is also entirely possible for semiconductors and electronics.
2010-07-21 Migration to 450-mm: To be or not to be?
While no major 450-mm announcements were made at Semicon West, fab tool makers are anticipating a major development to either fast-track or push out plans for the next-gen wafers.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top