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2002-05-15 Midas Touch to release film-to-plastic touch panels in June
Midas Touch Technologies Corp. has revealed plans to introduce its latest film-to-plastic touchscreen panels in June 2002.
2004-10-08 Matsushita joins Sematech manufacturing initiative
The Semiconductor Company of Matsushita Electric Industrial Co. Ltd has joined the International Sematech Manufacturing Initiative (ISMI) effective Friday Oct. 1, Sematech said Tuesday (Oct. 5).
2013-11-21 Malaysia foundry ready to take X-Fab to 180nm, 130nm
X-Fab Silicon's Rudi De Winter talks to EE Times Europe about his company's acquisition of 1st Silicon in Malaysia and its transition to 200mm wafer manufacturing.
2009-06-25 Intel: Fab tool market savior?
Intel Corp. continues to fund technologies and procure fab-equipment, but behind the scenes, the company is investing in some companies and brokering deals for others, reportedly including ASM International NV and NuFlare Technology Inc., sources said.
2011-09-30 Intel, IBM invest $4.4B in R&D facility
Intel and IBM are leading the development of a chip R&D center in New York that focuses on next-generation ICs and process technologies.
2007-07-20 Intel, AMD pitch divergent formulas for industry progress
In their keynotes at Semicon West, executives from rivals Intel and AMD explored differing recipes for the survival of the semiconductor industry.
2011-02-23 Intel to build new 300mm fab
Intel has announced plans to invest $5 billion in a new factory to process wafers at the 14nm node that is expected to be completed in 2013.
2007-11-05 Intel pushes for common platform in fabs
Intel is interested in having a common and standard "vacuum processing platform" throughout its fabs.
2014-07-08 Intel brings Panasonic on board its 14nm foundry
The Japanese company will have its future SoCs fabricated at Intel's custom foundry in the low-power 14nm process, which is expected to deliver improved performance and power advantages.
2011-11-04 Imec's open innovation finds government support
Imec is planning to build a 16-floor tower to expand its facilities.
2010-06-15 IMEC expands cleanroom, lab in Belgium campus
IMEC has officially opened the extension of its cleanroom at its campus in Belgium and kicked off the construction of a new office building fitting in its plan for further expanding its high-tech ecosystem.
2013-11-07 Imec demos III-V FinFET devices on 300mm Si wafers
The devices enable continual CMOS scaling down to 7nm and below, and also enable new heterogeneous system opportunities in hybrid CMOS-RF and CMOS-optoelectronics.
2012-09-06 IC R&D spending to grow by 10 percent in 2012, says report
Analysis of data taken from IC Insights shows that a dozen semiconductor companies spent more than $1.0 billion each on R&D in 2011 for the first time ever.
2014-07-04 IBM's custom silicon requires impetus
An anonymous IBM employee from the microelectronics division wrote this opinion article in response to the series published earlier here regarding the outlook for IBM as a chip maker.
2008-08-13 High-res 3D display allows view zone selection
Epson has created a high-resolution (equivalent to QVGA) autostereoscopic 3D LCD that gives freedom of viewing position compared to common 3D displays, without any special glasses.
2007-12-06 High-k process for CMOS cancels gate leakage
A high-k dielectric process for CMOS transistors promises to turn the International Semiconductor Roadmap into a freeway by eliminating the gate-leakage problem at advanced nodes down to 10nm.
2012-12-17 Globalfoundries CEO: Time for foundry 2.0
Globalfoundries' CEO accosted critics who claim that the fabless era is done and insisted that the foundry model is still experiencing huge growth rates.
2008-01-16 Gartner gives grim chip outlook
Gartner Inc. forecasts that the semiconductor market will grow less than 5 percent over the 2006 to 2011 period, but what's more troubling is the news that the traditional difficulties of the memory-chip sector are likely to flare up into a major crisis during the period.
2008-10-31 Future casts a dreary outlook for industry
For most observers, currently the financial crisis looks like the toughest challenge for the semiconductor industry. But there are others, and some with similar impact.
2010-01-06 Fearless IC forecasts for 2010
2010 is just beginning to unfold in the electronics industry and there is already uncertainty in the air. EE Times' Mark LaPedus offers his chip forecasts and other prediction for 2010.
2009-01-16 Fab tool execs brace for longer downturn
Fab tool vendor executives have warned that the current IC downturn will be long and painful, causing more consolidation in the market and stress in the supply chain.
2009-07-22 Fab tool collaboration: Mission impossible?
Will the day come when rival fab tool vendors will throw out the rule book and collaborate with each other on new equipment R&D projectsjust to help the industry keep pace on Moore's Law?
2008-11-17 Fab tech roll call: survival of the fittest
Manufacturers are rolling out 45nm ICs, with 32nm designs in the works; 22nm and even smaller devices are in R&D. But delivery of chips at 32nm and beyond won't be a cool breeze.
2014-04-11 Experts express hope, concern for IC future
While it is said that defect rates for new nodes are declining faster, the IC industry still has to regard its future in relation to the future nodes and existing technologies like FD-SOI and FinFETs.
2007-01-01 End of Moore's Law prompts technology search
The search is on for a technology that could replace today's workhorse CMOS-based silicon.
2011-01-21 Does the fab tool business model need mending?
Fewer fabs coupled with cyclical downturns have caused massive consolidation in the fab tool industry. While some insist the industry should further consolidate to make it more efficient, others fear that fewer players could lead to higher tool costs and monopolies.
2013-12-20 CyberOptics expands WaferSense line with 450nm devices
WaferSense products are wireless, wafer-shaped, real-time measurement devices that travel through fabrication tools similar to actual wafers.
2014-03-28 CMOS or FinFET: Exploring cost-effective solutions
The 16/14nm FinFET and 20nm bulk high-K metal gate CMOS next-gen processes deliver small transistors at a price higher that the current 28nm bulk HKMG CMOS.
2003-07-21 Chip roadmap to get wireless upgrade
Semiconductor industry representatives from around the world gathered to consider changes to the chip roadmap at the 2003 International Technology Roadmap meet.
2013-02-08 Chip R&D spending beats weak market with 7% growth
IC Insights revealed that semiconductor firms' R&D spending reached $53 billion last year that climbed to 16.7 per cent of total semiconductor sales.
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