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2012-12-24 | Easing system simulation with hardware models Hardware models can accelerate integration and system verification tasksif they are available early enough in the design flow. |
2007-01-10 | Devt platform eases MCU USB interface design FTDI's DLP-VLOG provides a complete reference design on which to base new Vinculum development as well as being a starting point for similar logging applications. |
2012-04-23 | Design platform for high-res 4K2K displays Xilinx announced the Display Targeted Design Platform (TDP) built around the company's Kintex-7 family of FPGA devices based on 28nm technology. |
2009-04-07 | Debug tech support caters to MIPS32 24KE Macraigor Systems LLC has announced the On-Chip Debug Technology (OCDemon) support for the MIPS32 24KE, a high-performance RISC core family with DSP enhancements. |
2006-01-23 | Cypress unveils new dual-port interconnects Cypress introduced a family of asynchronous dual-port interconnects with what it touts as the industry's lowest power consumption and smallest footprint. |
2015-04-09 | Compact line scan cameras come in GigE vision models The recently released Linea GigE cameras from Teledyne DALSA promise to offer high speed and flexibility, and help minimise the cost of inspection for various applications. |
2008-06-24 | CMOS sensor works in HD broadcasting video camera Aptina Imaging presents its latest CMOS image sensor, which was designed to accommodate super high-definition (HD) projects for NHK. |
2014-10-13 | CMOS cameras focus on machine vision apps The 8k line scan camera from Teledyne flaunts high responsivity in the visible and NIR wavelengths; multiple user coefficient and FFC calibration sets; and support of camera link cables up to 10m. |
2015-02-26 | Chipsets quadruple spectral efficiency for microwave backhaul Broadcom's BCM85650 flaunts integrated XPIC and LoS-MIMO functionalities while the BCM85820 uses advanced digital RF correction mechanisms such as ADPD functionary to attain high system gain. |
2011-07-11 | Chip resistors offer 1% tolerance Stackpole's RPC series film based chip resistors offer 1 percent tolerance with precision and pulse handling, which is achieved by using a more robust film element with a limited laser trim. |
2014-02-25 | Chip makers battle it out in the octa-core SoC arena Qualcomm, MediaTek and Allwinner presented their octa-core solutions aimed at different segments in the mobile market at the MWC. |
2007-07-02 | Chip displays 4,096x2,400 resolution at 20,000:1 ratio JVC has developed what it claims is the industry's highest pixel density projection chip that will enable future 4K2K projectors to be smaller, lighter and more affordable. |
2015-12-09 | Chinese companies ride IoT bandwagon According to IHS, China is a promising market for many existing and potential Internet of Things applications such as industrial automation, smart cities and connected home. |
2006-08-01 | China writes its own DTV standard After years of rivalry and numerous delays, China is poised to roll out a long-awaited standard for terrestrial DTV. The standard signals the beginning of the end for small Chinese trials of Europe's DVB-T standard, and it adds another rival to the mix for mobile-TV services in China. |
2006-06-28 | China comes up with own DTV standard China's terrestrial DTV standard is finally coming out, and it will cover fixed and mobile terminals, eventually serving half of the country's TV viewers. |
2013-08-07 | Ceva adds DVS software module to its imaging platforms The DVS module is optimised to run in real-time using minimal processing workloads and very low memory bandwidth on the CEVA-MM3000 platforms. |
2015-06-01 | CES Asia: Riding China's consumer electronics wave The latest CES Asia saw a plethora of products from a number of startups, as well as from long-standing companies, evidently showing a close proximity between product design and manufacturing. |
2003-04-23 | Centillium packs 1,008 channels in VoP chip Centillium Communications is upping the ante in the VoP arena with the release of Entropia III. |
2014-01-07 | CE industry to expand path for wearables, sensors in 2014 The CES 2014 will feature more personalized devices while moving away from larger, more traditional CES staples such as televisions and PCs, according to an Accenture executive. |
2013-05-23 | Can UHD TVs accomplish what 3D TVs failed to do? IHS said TV panel makers are betting on a high rate of growth for UHD LCD TVs in the next four years, expecting to ship about 943,000 UHD LCD panels this year, up from less than 33,000 units in 2012. |
2009-10-15 | Camera processor IP core supports 18MP Silicon Image Inc.'s camerIC-18 IP core integrates into DSC and video SoC application processors for mobile devices. |
2014-07-14 | Calibration of gain, timing errors in ADCs Here's a look at a novel background calibration method for gain and timing mismatch errors through low complexity digital signal processing algorithms. |
2008-08-18 | Bulk metal resistor offers improved load-life stability Vishay Intertechnology Inc. today introduced the new VSMP0603 ultra-high-precision Bulk Metal Z-Foil (BMZF) wraparound surface-mount resistor. |
2015-01-30 | Broadcom woos cable, over-the-air boxes Broadcom's DOCSIS 3.1 cable modem SoC is the basis for its set top box vision, combing dual-band Wi-Fi and a custom applications processor to reach 5Gbit/s downstream speeds and 2Gbit/s upstream. |
2012-12-10 | Broadcom projects increased 20nm, 14nm costs CEO Scott McGregor expects that Broadcom will move closer to leading-edge processes in 2013 as it moves towards integrated mobile SoCs. |
2013-01-14 | Broadcom points to Gb wireless as CES 2013 star Broadcom CTO Henry Samueli identified Ultra HDTV, gigabit wireless and "Wi-Fi in everything" as three key trends in this year's CES. |
2015-01-13 | Broadcom moves past LTE, 5G cellular to refocus in broadband After dropping its smartphone modem business, which was eating away about $2 million a day from Broadcom, CEO McGregor said his company if now focusing on the broadband and connectivity. |
2015-08-05 | Binding the world under one tech: Can USB Type C do it? Armed with MHL and now with SuperMHL technologies, both from Silicon Image, Lattice introduced its superMHL chips designed to work over USB Type C connectors. |
2014-04-15 | Battery sensor supports vehicle reliability with AEC-Q100 Freescale's battery sensor integrates MCU, CAN, and three measurement channels, with AEC-Q100 qualification to meet stringent automotive standards for ESD, EMC and zero defect quality levels. |
2004-12-20 | Automotive family of serial EEPROMs introduced Integrated Silicon Solution announced a complete line of serial EEPROM devices for the automotive market. |
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