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2015-05-11 FCC gets serious on LTE-Unlicensed appropriation oversight
Qualcomm and Broadcom are at odds over the LTE-U issue, while Wi-Fi Alliance members are actively pushing for details on the LTE-U standard and its specific attributes.
2007-03-15 Fanless computer withstands extended temperatures, vibration
Contec has announced the release of its new 800MHz Celeron M Fanless Box Computers that feature extended operating temperatures of -20 to 60C.
2003-03-11 Fairchild expands China presence, targets power electronics
Fairchild Semiconductor has announced that the first phase of its 800,000ft assembly, test, and warehouse facility in Suzhou, China is underway, and is expected to be completed by Q2 2003.
2015-09-22 Examining the most underrated FPGA design tool ever
There is a design tool that is being quietly adopted by FPGA engineers because, in many cases, it produces results that are better than hand-coded counterparts.
2003-03-05 Etron PSRAM draws 45?A during standby
Etron Technology Inc. has introduced a 16Mb Pseudo SRAM that draws a standby current of 45?A and exhibits a cycle time of 50ns.
2009-11-23 Ethernet switches speed up mobile, broadband services
Service providers are challenged to provide 'on demand' connectivity and a better user experience on 3G and future 4G networks.
2010-06-02 Ethernet controller IP enables efficient AV networking
Synopsys Inc. is rolling out the DesignWare Ethernet QoS controller IP that implements the new IEEE specifications for audio video bridging (AVB) features.
2004-07-01 Ericsson, Telenor sign global microwave transmission deal
Ericsson has been chosen as a supplier of microwave transmission for the Norwegian operator Telenor.
2004-07-13 Ericsson signs GPRS/MMS contract with MobiCom
Ericsson has signed a supply agreement with MobiCom.
2004-03-01 Ericsson picks up Sharp as new licensee
Ericsson's Mobile Platforms unit will supply Sharp Corp. with 3G mobile phone platforms under a licensing deal.
2007-11-05 Elpida announces 512Mbit DDR2 Mobile RAM
Elpida Memory, Inc. announced that it has developed the world's first 512Mbit DDR2 Mobile RAM operating at an ultra-low voltage of 1.2V.
2008-09-15 Dual-axis accelerometers improve ESC systems
The dual-axis inertial sensors from Freescale Semiconductor aimed at electronic stability control systems are claimed to deliver more intelligence to automotive safety systems.
2006-05-18 DSP core, platform for wireless apps
CEVA introduced the CEVA-X1622 DSP core and the CEVA-XS1102 system platform.
2009-02-13 DSP architecture aims at 4G
Ceva Inc. has started sampling to select customers CEVA-XC, the programmable DSP architecture that supports full transceiver processing for multiple air interfaces in software, targeting 4G terminals and infrastructure.
2003-06-16 DSP apps facilitate next-gen cellphones01
The article provides an overview of how DSP solutions enable and enhance the capabilities of the wireless handsets.
2008-11-06 Downconversion mixer is highly integrated
Maxim Integrated Products introduces the MAX19985A 700MHz to 1000MHz, dual, downconversion mixer that integrates an LO switch, buffer, and splitter.
2004-01-28 DisplaySearch raises 2004 TFT-LCD equipment spending forecast
According to DisplaySearch's latest
2010-08-27 DesignWare MIPI M-PHY IP now in 40-nm process tech
Synopsys, Inc. has just announced availability of the DesignWare MIPI M-PHY IP for next-generation high-speed interfaces based on the newly ratified MIPI Alliance M-PHY specification. Both DesignWare DigRF v4 controller and M-PHY IP answer the demand for higher throughput in LTE and WiMAX mobile devices .
2010-05-06 DesignWare controller IP suits LTE, WiMAX apps
Synopsys Inc. has is offering the DesignWare MIPI (Mobile Industry Processor Interface) 4G DigRF Master Controller IP compliant with the recently ratified MIPI DigRF v4 1.00 specification.
2006-09-15 Cypress unrolls connectivity chips for 3G smart phones
Cypress said its More Battery Life (MoBL) dual ports integrate an address/data multiplexed (ADM) interface for next-generation smart phones.
2006-05-12 CSR, Freescale team up on Bluetooth reference designs
CSR and Freescale are collaborating to provide mobile phone makers with full-feature, high-performance, low-power Bluetooth reference designs.
2004-11-08 CPT to postpone equipment installation at 6G plant
Panel maker Chunghwa Picture Tubes Ltd (CPT) plans to postpone its second- and third-stage equipment installation at its 6G plant, although the first-stage installation is currently being completed.
2005-05-17 CPT ramps up 17-inch, 19-inch monitor panel output
Chunghwa Picture Tubes Ltd (CPT) of Taiwan announced that it will ramp up its output for 17in and 19in monitor and LCD panels by year-end.
2005-04-20 CPT increases shipment of LCD panels
Panel maker Chunghwa Picture Tubes Ltd (CPT) claims that large orders of LCD TV panels from Europe-based companies are pushing the company to increase shipments for the products.
2004-09-21 Corning sets up LCD plant in Taichung
Corning Inc. has commenced the construction of its second facility in Taiwan.
2005-01-19 Corning offers 7G glass substrates
Corning Inc. has disclosed its first TFT 7G glass substrates for active-matrix (LCD).
2004-02-09 Corning bares LCD capacity expansion plan
Corning announced that its board of directors has approved a $600M capital expenditure plan to further expand the company's LCD glass substrates manufacturing capacity in Taiwan and Japan.
2008-07-16 Conquer ULC handset design challenges
Ultralow-cost (ULC) handsets have been a hot topic in the past three years. ULC today refers to handsets that can be built for $20 or less. They represent a unique segment of the cellular market and require a unique set of strategies for success.
2007-06-22 Connectors stack up for increased functionality
One of the challenges faced by design engineers of electronic equipment is how to manage the tangle of individual wires that provide power and control signals for various system functions.
2005-02-09 Conduction-cooled VME board packs dual PMC sites and VITA 31.1
Concurrent Technologies is debuting a ruggedized conduction-cooled VME bus single board computer supporting dual PMC sites.
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