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2015-01-07 4x4 WiFi chips boast dedicated DSP
Broadcom's BCM4366 for gateways and STBs incorporates multiple 802.11ac Wave 2 features including radio optimisation for high quality video over a wireless network.
2015-03-09 15 innovative things seen at MWC 2015
Here is a presentation of 15 curious things spotted at the recently concluded Mobile World Congress in Spain, which highlighted many connected devices and technologies.
2016-03-23 WIN Semiconductors enters optical device market with foundry services
The company is adding optical device production capabilities to its portfolio, to provide large-scale manufacturing of complex laser and photodiode designs for 2.5G, 10G and 25G data rates.
2004-07-26 USDTV to team with LG on digital TV
U.S. Digital Television Inc. (USDTV) has announced a technology partnership with LG Electronics and LG Innotek to supply 5G 8-VSB chips and ATSC tuners for use in USDTV's set-top boxes.
2003-04-04 Toppoly to expand monthly LCD capacity
Toppoly Optoelectronics Corp. has disclosed plans to increase monthly capacity of 620mm-by-750mm glass substrates at its 3.5G plant to 40,000 units.
2003-11-04 TI, Sun Micro partner on wireless solutions
Texas Instruments Inc. (TI) and Sun Microsystems Inc. have collaborated to jointly deliver optimized end-to-end wireless solutions for 2.5G and 3G networks in the second quarter of 2004.
2004-11-12 TI rolls 90nm Bluetooth chip for mobiles
Texas Instruments announced that it has developed a single-chip 90nm Bluetooth radio for 2.5G and 3G mobile phone architectures.
2005-07-01 TI offers new jitter cleaner with 'lowest phase in class noise'
Texas Instruments Inc. recently unveiled a clock synthesizer and jitter cleaner that offers one of the lowest phase noise and jitter in its class. According to the company, this new product addresses customers' growing requirement for higher performance and increased design flexibility in applications such as 2.5G/3G wireless base stations, data communications, medical imaging, and test and measurement.
2005-08-19 TI achieves Bluetooth v2.0, enhanced data rate certification
Texas Instruments announced that the company's 5G Bluetooth solution has passed the qualification for Bluetooth specification v2.0 and enhanced data rate by the Bluetooth Special Interest Group.
2004-10-04 Tektronix unveils new test suite version for K15 platform
The new version of Tektronix's software test suite for its K15 platform promises to provide enhanced productivity when testing 3G, 2G and 2.5G mobile services.
2005-01-17 Tackling push-to-talk challenges in handsets
As the available bandwidth for cellular devices increases with 2.5G and 3G wireless networks, the market potential for packet-based applications such as PoC is expected to develop rapidly.
2004-06-16 Sorting through GSM codecs
This article provides a look inside how compression technologies to analyze and compress speech works. This will also examine how the codecs need to evolve in order to meet the demands of 2.5G and 3G wireless networks.
2003-04-25 Samsung develops RS-MMC for 3G mobile phones
Samsung Electronics Co. Ltd has announced the production of its 128MB reduced-size MultiMedia Card (RS-MMC) device for use in 2.5G and 3G mobile phones.
2006-05-29 RTLinux-powered cellphones may be in production soon, says FSMLabs
RTLinux-powered 2.5G and 3G cellphones may be in production soon, said FSMLabs.
2003-12-09 RayComm RF modules meet ETSI standards
RayComm Microwave Technologies Corp. has introduced its Paeonia series of 2.5G/2G GSM/GPRS 900/1800/1900 triple-band LTCC RF modules.
2005-06-28 Quanta begins test production of LCD panels at 6G plant
Quanta Display Inc. stated that it has commenced test production of LCD monitor panels at its 6G plant, while simultaneously boosting capacity at its 5G facility.
2002-09-09 Philips reaffirms relationship with Ericsson Mobile Platforms
Royal Philips Electronics and Ericsson Mobile Platforms have signed an agreement which reinforces their partnership to develop 2.5G and 3G handset technologies utilizing Philips' semiconductor capabilities.
2002-09-12 Obo ships three-in-one telephone receiver
The OBO-MR24008-1 three-in-one telephone receiver integrates a speaker, a receiver, and a buzzer inside a 24(x)-by-2.85mm package that weighs 1.5g, making it suitable for use in cellphones and PDAs.
2008-11-13 NTU introduces blink of the eye transmission speed SoC
Professor Jri Lee of the National Taiwan University (NTU) and UCLA PhD conferred has created a SOC with transmission speeds 100 times faster than WiFi and 350 times faster than 3.5G cell phones.
2003-07-31 New group to define interfaces for mobile processors
What began last December as an agreement between TI and STMicro to standardize interfaces for apps processors targeting 2.5G and 3G mobile phones has grown into a broader industry consortium called the MIPI Alliance.
2003-10-16 New DIP-IPM for high-performance motor control
Mitsubishi's new version of IPM series employs the latest 5G IGBT, not only achieved an improvement in the static and dynamic performance, but also extended the power capacity to up to 3.7kW.
2002-07-10 NanoAmp rolls 16Mb PSRAMs
NanoAmp Solutions Inc. has released its family of asynchronous single-transistor PSRAMs targeted at 2.5G and 3G mobile phones.
2007-09-07 Multimode RF transceiver IC supports TD-SCDMA
Quorum Systems Inc. has introduced an ultralow-power, multi-band, multi-mode RF transceiver, the Sereno QS3200, adding TD-SCDMA support to its existing 2G/2.5G/3G RF transceiver family.
2012-03-09 Modulators, demodulators operate up to 2.4GHz
Richardson RFPD's offerings target wireless infrastructure applications such as 2G, 2.5G and 3G base station radios, high-capacity radio links, WLAN, and aerospace and defense equipment.
2013-01-30 Mobile baseband chip integrates wireless connectivity
The SC6531 from Spreadtrum Communications integrates FM and Bluetooth and delivers a high level of integration for 2.5G feature phone handset makers.
2005-08-23 Mixer targets 2.5 and 3G apps
WJ Communications introduced the MH205A mixer for 2.5G and 3G wireless apps that delivers up a 35dBm input third-order intercept point (IIP3), L-I isolation of 50dB and operates from 800MHz to 960MHz
2002-07-15 Matsushita licenses Nokia platform for multimedia handsets
In an effort to bring interoperable handsets and applications to the 2.5G and 3G mobile phone markets, Nokia has licensed its Series 60 cell phone platform to Matsushita Communication Industrial.
2004-08-06 Mainland China LCD industry on fast track to growth
Mainland China's LCD industry is expected to continue flourishing. Local manufacturers Shanghai SVA NEC Liquid Crystal Display Ltd and BOE Technology Group Co. Ltd have started construction of 5G TFT-LCD production lines.
2015-04-06 Less is more: Integrated RF-SOI faces new challenge
The RF-SOI challenge is no longer simply to beat traditional JFET GaAs and Silicon-on-Sapphire processes in performance and cost. That's done. Now, the goal is to use RF-SOI's performance to fit cellular 4G, 4.5G requirements without extra cost and insertion loss.
2002-02-08 Interworks offers solution for Agere's Payload Plus chipset
Interworks has offered a memory partitioning solution for Agere's 2.5G Payload Plus network processor chipset, an approach claimed to ease space constraints, add flexibility and reduce development time for the chipset.
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