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2014-12-09 TSMC guns for 7nm with EUV scanners
ASML said on November 24 that TSMC has ordered two NXE:3350B EUV systems for delivery in 2015 with the intention to use the systems in production.
2014-09-17 Squeezing in Moore: Steppers for 10nm, EUV for 7nm
Considering the slow progress of EUV systems, manufacturers may have to make do with immersion steppers to fabricate 10nm chips, but once ready, EUV can be used for 7nm chip production.
2014-09-03 Samsung funds research for 7nm
The South Korean tech giant is financing Pennsyvania State University's work on III-V, which explores FinFET fabrication using the combination of silicon and indium gallium arsenide.
2015-10-09 Organic electronics to push Moore's Law beyond 7nm
TU Dresden expressed its commitment to the gamble, going "all in" for using organic devices with government funding of $38 million through 2017, and is teaming up with 11 institutions on the initiative.
2014-09-12 Intel plans to extend Moore's Law to 7nm
Chipmakers generally don't expect the much-delayed extreme ultraviolet lithography in time for 10nm chips, but many still hold out hopes it could be ready for a 7nm generation.
2011-07-22 Intel eyes 7nm tech, extends x86 architecture
Intel is increasing its capital expenses this year to pave the way for its own 7nm process technology. The company hopes that this move will bolster its efforts in tablets and ultrabooks.
2013-02-08 IBM: EUV lithography not ready until 7nm node
IBM warns that EUV lithography will not be ready until the 7nm node but Globalfoundries and Samsung say they are on track to offer 14nm FinFET manufacturing by 2014.
2015-07-13 IBM surpasses Intel with 7nm node tech
IBM Research claims to have perfected the extreme ultra-violet (EUV) lithography and using silicon-germanium channels for its finned field-effect transistors (FinFETs).
2016-03-17 ARM, TSMC to collaborate on 7nm FinFET process tech
The two companies inked a multi-year agreement that will advance process technologies beyond mobile, and build on previous generations of 16nm and 10nm FinFET process technology.
2014-05-26 7nm, 5nm scaling compels adoption of new materials
Shifting advanced nodes involve exploring alternativesfrom silicon to graphene, FinFET to SOIand considering how to apply the strengths associated with 3D device architectures to new technologies.
2015-09-21 TSMC heats up 10nm engine, preps 16nm for 2017
TSMC has gotten off to a slow start with its 16nm FinFET process and has also announced plans for specialty RRAM and MRAM memories that would act as alternatives to embedded flash.
2015-04-20 Multipurpose module predicts IC failure
The Multipurpose Electromigration (MPEM) module provides a low-cost user-friendly test suite for evaluating reliability of copper lines in modern integrated circuits.
2014-07-11 IBM invests $3B in R&D to take on cloud, Big Data systems
Tech giant IBM is set to channel billions of funds into two research initiatives to push the limits of chip technology needed to meet the demands of cloud computing and Big Data systems.
2015-10-05 GlobalFoundries to develop 7/10nm process tech in-house
GlobalFoundries has decided to develop its 7nm and 10nm process technology internally instead of relying on licensing from Samsung, believing it is more cost-effective to do so.
2015-05-22 Why Moore's Law is nowhere near ready to meet its maker
In 2003, Intel predicted an end to Moore's Law shortly after hitting the anticipated 16nm node, but today it seems we're on track for 10nm fairly soon with 7nm not far off.
2016-03-21 TSMC unveils silicon plans
TSMC will enable silicon interposers larger than 1,200mm21.5x the reticle sizeat 7nm to enable giant 2.5-D stacks of logic and memory for the next gen of Cowos- chip on wafer on substrate.
2015-07-08 Trends, challenges for EUV lithography
Imec said cutting costs per transistor at the next-generation, the 10nm node, will be tricky, and even more challenging will be getting extreme ultraviolet lithography ready to enable a full 7nm node.
2014-03-28 On-chip interconnect costs head for further study
With 16nm chips moving to production this year, companies are actively developing the 10nm and 7nm technology nodes.
2013-12-16 Imec unveils strained germanium FinFETs
The device, fabricated with a Si Fin replacement process on 300mm Si wafers, shows a possible evolution of the FinFET/trigate architecture for 7nm and 5nm CMOS technologies.
2013-11-07 Imec demos III-V FinFET devices on 300mm Si wafers
The devices enable continual CMOS scaling down to 7nm and below, and also enable new heterogeneous system opportunities in hybrid CMOS-RF and CMOS-optoelectronics.
2014-12-18 What's hot at IEDM 2014?
The 2014 International Electron Devices Meeting proved that Moore's Law is still alive. The event was a victory lap for Intel, which gave more details on the 14nm finFET process.
2013-05-10 What's for dinner? Microwaved semiconductors
A team of metallurgists from the University of Utah used an old microwave oven to make a nanocrystal faster than how it is normally produced.
2015-10-30 UMC hits 28nm target amid falling demand
Sales of products made with what the company claims as its most advanced technology node dropped to 10 per cent of its $1.1 billion in revenue for 3Q15 from 11 per cent in Q2
2015-04-17 TSMC slashes $1B to 2015 capex
TSMC, which in January weighed in with the chip industry's largest planned layout for expansion this year, said that its revised 2015 capex will fall within a range of $10.5 billion and $11 billion.
2009-04-23 TSMC invests in R&D despite downturn
Taiwan Semiconductor Manufacturing Co. Ltd remains cautiously optimistic about the IC industry and vowed that it will continue to invest in R&D despite the downturn.
2016-04-19 TSMC growth forecast remains at 5-10% this year
The foundry attributed its downward revision to slower-than-expected growth in the worldwide smartphone market, and weak PC and tablet sales.
2014-04-25 TSMC fleshes out IC line-up with shrunk TSVs
Based on its work on chip stacks, TSMC will launch in July an enhanced version of the 16nm FinFET technology with up to 18 per cent faster data rates and lower leakage, in addition to a planned 10mm and 7mm processes.
2013-04-15 TSMC FinFET production set in 2013
Company executives detailed the new processes and how they aim to get there and also gave an update on 3D chip stacks and their on-going ramp of today's 28nm process node.
2016-01-18 TSMC CEO expects stronger Q1 after Capex boost
The world's largest foundry said it will increase its capital expenditure in 2016 to an amount ranging from $9 billion to $10 billion as it aims for a bigger share of finer geometry chips.
2015-12-17 TSMC begins work at 5nm, plans for EUV remain unclear
The foundry's initial development work at 5nm may be yet another indication that extreme ultraviolet lithography has been set back as an eventual replacement for immersion lithography.
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