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90nm process technology
The 90nm process refers to the level of CMOS process technology that was achieved sometime 2003. Process technology basically boils down to the size of the finished transistor and other components.
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2005-12-01 New mem compilers keep Moore's Law alive
Memory compilers provide accurate estimation of area, performance, timing and power consumption for thousands of memory configurations.
2003-06-10 NEC ISSP features four million usable gates
NEC Electronics Corp., NEC Electronics America Inc., and NEC Electronics GmbH have introduced the next-gen ISSP that is based on the company's 90nm technology.
2005-01-14 Magma upgrades 3D field solver
Magma released a new version of its QuickCap 3D field solver capacitance extractor with features to allow the tool to better address design problems that occur in 90nm and smaller process nodes.
2002-12-23 Magma to distribute TSMC libraries
Taiwan Semiconductor Mfg Co. (TSMC) has selected Magma Design Automation Inc. to distribute its technology libraries.
2006-02-17 KLA-Tencor unveils latest-gen optical CD metrology system
KLA-Tencor's latest-generation optical CD metrology system provides cost-effective inline CD and profile measurements of critical device structures that help enable early prediction of IC performance and yield at the 90nm and 65nm nodes.
2007-03-28 Is SMIC searching for private equity partners?
Semiconductor Manufacturing International Corp. is on the hunt for a strategic investor willing to ante up as much as $500 million for a 20 percent stake.
2002-11-18 IP TripTik needed on SoC highway
As hundreds of SoC design teams will target 90nm technologies, these SoC devices will include IP brought in from a company's own repository or from IP vendors.
2004-07-23 Intel to shift manufacturing strategy
Intel Corp., the world's largest chipmaker, is changing its manufacturing strategy, according to In-Stat/MDR.
2007-03-08 Intel to sample 128Mbit phase change memory in 1H
Intel disclosed that it is preparing to sample a 90nm 128Mbit phase change memory in the first half of 2007. Mass production could begin before the end of 2007.
2007-03-15 Intel to build 12in wafer plant in northern China
Intel Corp. has won approval to build a $2.5 billion, 12-inch wafer plant in northern China for CPU chipsets, according to a statement issued from China's National Development and Reform Commission.
2002-08-20 Intel strengthens advanced chip-making process
Intel Corp.'s 90nm process has been strengthened even further with the integration of several technology breakthroughs.
2007-07-27 Intel ships Xeon quad-core server chips
Intel said it has started shipping to OEMs its fastest quad-core Xeon server platform, formerly codenamed Caneland.
2004-12-10 Intel bullish on technology direction at analysts' meeting
Sounding anything other than a company that has had its share of missteps in recent months, outgoing Intel chief executive Craig Barrett expressed confidence and even a bit of cockiness at the company's Fall analysts' conference in New York on Tuesday (Dec. 7), predicting Intel's technology strengths would distance the semiconductor giant from its competitors.
2004-09-15 Infineon to use Hitachi read channel tech for HDDs
Infineon Technologies AG has signed a long-term license agreement with Hitachi Global Storage Technologies (Hitachi GST) on read channel technology for hard drive applications.
2006-03-15 Infineon aims for 70nm DRAMs in '06
Infineon Technologies' memory unit outlined its technology roadmap to keep pace in the competitive DRAM market.
2005-12-05 Infineon affirms move to 'fab-lite' strategy
Infineon Chairman and CEO Wolfgang Ziebart affirmed that the company will not build manufacturing capacity below the 90nm node, migrating to a "fab-lite" strategy.
2005-07-01 Implementing high-performance DSPs using low-cost FPGAs
Low-cost FPGAs are optimized to provide high area efficiency when implementing signal-processing functions
2005-01-26 IBM, Chartered extend foundry pact to 45nm node
IBM Corp. and Singapore's Chartered Semiconductor Manufacturing have signed an extension to an existing technology agreement, expanding their joint development efforts to 45nm bulk CMOS process technology, the companies said Monday (Jan. 24).
2004-10-29 Grace claims its close to 130nm process deal with U.S. IDM
Chinese foundry chip maker Grace Semiconductor Mfg Corp. said it is in the final stages of negotiating a technology transfer for a 0.13?m manufacturing process from a U.S.-based integrated device manufacturer.
2004-09-15 Fujitsu, Lattice expand foundry deal for FPGAs
Lattice Semiconductor Corp. said it will advance $125 million to Fujitsu Ltd in support of the new 300mm fab being constructed by the Japanese company in Mie.
2006-06-14 Fujitsu to market Lattice FPGAs/PLDs in Japan
Fujitsu and Lattice signed a distribution agreement in which Fujitsu Devices Inc. will be added as an authorized distributor of Lattice's FPGAs/programmable logic devices in Japan.
2008-02-12 Fujitsu tips 'smallest' RF module for Mobile WiMAX
Fujitsu says its MB86K71 is the world's smallest RF module for mobile devices, which supports all of the RF circuitry designed for Mobile WiMAX.
2005-09-23 Fujitsu rolls 65nm ASIC, SoC process
Enabling the next wave of semiconductors, Fujitsu Ltd has rolled out its 65nm process technology for advanced ASIC and system-on-a-chip (SoC) designs.
2003-07-22 Fujitsu low-power SoCs target mobile apps
Fujitsu Ltd's CS101 series of SoCs employ the company's 90nm CMOS technology, and feature up to 100M gates.
2006-01-13 Fujitsu invests $1B for 65nm production
Fujitsu is investing $1.05B in a second 300mm fab in Mie Prefecture, Japan. Volume production on both 90nm and 65nm processes is expected to start in July 2007.
2006-09-25 FPGAs include SerDes, PCS block
The new ECP2M FPGA family from Lattice Semiconductor consists of low-cost devices that offer high-speed embedded SerDes I/O plus a pre-engineered physical coding sublayer block.
2005-03-21 Fabless firms outpace IDMs in costs, gross margins
Fabless chip makers in the "core silicon space" are enjoying lower costs and much higher gross margins than their integrated device manufacturing (IDM) counterparts, according to a report from iSuppli Corp.
2003-01-09 EDA's unique opportunity in the silicon value chain
As design sizes shrink toward 90nm, a new set of problems has arisen. Signal integrity, design for test, verification, and design reuse are becoming ever more critical in addressing today's increasing design complexities.
2005-04-08 EDA development going in-house, analyst says
Citing an ominous warning for EDA vendors, Gary Smith, chief EDA analyst at Gartner Dataquest, said at the International Symposium on Physical Design (ISPD) here that design teams are increasingly developing their own EDA tools in-house.
2007-01-08 eASIC expands structured ASIC line with ARM926EJ processor
eASIC Corp. has added the ARM926EJ processor to its Nextreme 90nm product family.
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