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2007-11-16 ADS 2008 speeds communications product design
Agilent's ADS release 2008 contains productivity enhancements for faster communications product design.
2007-12-21 Watch out for these wireless trends in 2008
Top 10 trends predicted for the wireless industry in 2008 were listed by InCode, a subsidiary of VeriSign that specializes in wireless business and technology consulting
2008-01-14 Agilent to ramp 3GPP LTE test solutions
Agilent Technologies Inc. will introduce new solutions for 3GPP Long Term Evolution at the 2008 Mobile World Congress, February 11-14
2008-08-04 EDA software improves RF board design
Agilent Technologies Inc. announced shipment of its Genesys 2008.07 release, which contains improvements to the reliability of artwork masks for EM verification and RF board manufacturing
2008-05-02 Agilent tips 10x faster planar 3D EM simulator
Agilent Technologies has announced a 10x speedup of its planar 3D EM simulator, which is part of the Update 1 release of its ADS 2008 EDA software platform.
2008-08-20 3D EM simulation solution rolls for RF module design
Agilent Technologies Inc. has developed the EMDS-for-ADS, an integrated design flow solution that includes full 3D electromagnetic (EM) simulation for RF Module Design
2008-08-07 Trio collaborates on mobile TV chip for Olympics
SMIC announced that Telepath Technologies Co. Ltd successfully integrated its demodulator chip, TP3001, in a majority of mobile TV phones distributed at the 2008 Beijing Olympics
2007-06-06 Mark that calendar, June 29 is iPhone day
Apple Inc. will start selling in the U.S. the much-awaited iPhone on June 29, announcing the date on Sunday (June 3), via three TV ads heralding the gadget's large touchscreen and functionality to watch video, playback music and display photos
2008-05-08 Library tools speed development of 60GHz video nets
Agilent Technologies has introduced a WVAN Wireless Library that helps prevent unnecessary wafer spins, thus accelerating deployment of next-generation 60GHz wireless video area networks.
2008-07-17 Agilent offers first HiSIM2.4 model extraction package
Agilent Technologies Inc. releases the first commercially available HiSIM2.4 model extraction package for DC and RF parameters for advanced CMOS device models.
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