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2007-02-01 WaferSense ATS helps eliminate wafer scrap
CyberOptics claim its WaferSense ATS employs machine vision to see inside semiconductor equipment and to help avoid costly wafer mishandling, a significant cause of wafer scrap in highly automated semiconductor manufacturing plants.
2007-07-19 Digi-Key, ATS ink global distribution deal
Digi-Key and Advanced Thermal Solutions have signed a global distribution agreement, which will enable Digi-Key to address the design and production quantity thermal management needs of its customers.
2011-04-11 ATS unveils multitest-in-one thermal analysis tool
ATS says its iQ-200 laboratory instrument measures and records temperature, velocity and pressure simultaneously.
2006-08-04 ATS launches heat sinks for Freescale processors
Advanced Thermal Solutions Inc. (ATS) has added two active and passive heat sinks to its "Alaska" line of solutions to cool Freescale Semiconductor processors.
2006-02-07 Small board simultaneously measures temperature, air flow
Advanced Thermal Solutions is releasing its ISD board designed to measure air temperature and velocity from two independent sensors.
2007-01-17 Heat sinks cool high-output LEDs
ATS has introduced three heat sinks that mitigate the intensity of heat generated by high-output LEDs, thereby reducing temperature and extending product life.
2005-04-27 Heat sinks cool components in low airflow conditions
ATS has introduced a line of low profile, high performance heat sinks designed for cooling components in low airflow velocity conditions.
2006-07-25 Heat sinks cool BGA components
Advanced Thermal Solutions has introduced a low-profile, high-performance heat sink designed for cooling BGA components in low airflow velocity conditions.
2013-08-05 Designing a MOST infotainment system
The solid methodology used to build a MOST based infotainment system is close to the development process of enterprise Web services.
2006-07-17 Agilent's array tester targets ultrahigh-resolution panels
By offering 7,680 channels per test head, Agilent said its new test solution can handle today's ultrahigh-resolution panels and is prepared to test even higher resolution screens in the future.
2008-05-09 Thermal management kit offers 100 heat sink options
ATS has introduced the Thermal Management Design Kit that contains 96 of its maxiFLOW heat sinks and maxiGRIP sink attachment systems.
2009-03-16 Radio test software supports P25
Aeroflex has updated the software 3.5.1 for the 3500 series handheld radio test set, which includes new features such as Tracking Generator Option, which allows users to test and align duplexers quickly in the field.
2006-06-13 PCIe gets a version 2.0
The 2.5Gbps PCI Express interconnect is slowly shifting gears into a 2.0 version expected by the end of the year to double data rates.
2006-05-17 PCI waveform digitizers offer dual-port memory
AlazarTech's new digitizer offers OEMs the option of dual-port memory for applications in which acquisition cannot be stopped during data transfer to PC memory.
2008-10-29 PCI Express virtualizationusing a resource that isn't there
The PCI Express protocol with I/O virtualization allows multiple operating systems running simultaneously within a single computer to share PCI Express devices.
2006-08-01 PCI Express takes aim at 5Gbps
The 2.5Gbps PCI Express interconnect will slowly shift gears into a 2.0 version by yearend. The new version will rev data rates to 5Gbps.
2006-07-04 Next PCI Express to deliver 5Gbps data rate
The 2.5Gbps PCI Express interconnect is slowly shifting gears into a 2.0 version expected by the end of the year that will rev data rates to 5Gbps.
2002-09-05 LIGHTCONNECT boosts North America sales network
LIGHTCONNECT has established an office in Maryland to handle sales in eastern parts of the U.S. and in Canada.
2007-12-04 Intro to the six basic audio measurements - Part 1
Much audio testing is concerned with a small number of performance benchmarks, which we call the Big Six measurements: Level, Frequency response, THD+N, Phase, crosstalk and SNR.
2008-01-18 Heat sinks keep high-power LEDs cool
Advanced Thermal Solutions has introduced the Star series of heat sinks designed specifically for cooling higher power, surface-mount power LED packages.
2011-08-30 ESAB gets patented real-time control system
ESAB has purchased from Applied Thermal Sciences the Master Process Controller that uses sensors to enhance welding quality.
2012-02-10 Developing automatic test systems for extended duty
Know the challenges that are faced by maintenance organizations and automatic test systems providers who sustain the weapons systems programs. Also, learn how to address such concerns.
2013-12-20 CyberOptics expands WaferSense line with 450nm devices
WaferSense products are wireless, wafer-shaped, real-time measurement devices that travel through fabrication tools similar to actual wafers.
2006-03-13 Asymtek opens apps lab in China
Asymtek Inc., a provider of automated fluid dispensing technology, announced the opening of two new facilities in China.
2006-02-15 Analysis software tests playback-only audio gear
Audio Precision now offers its QuickTest application to enable the company's audio analyzers to test playback-only devices.
2003-05-07 Aircraft manufacturer adopts Teradyne test solution
Teradyne Inc. has been selected by Boeing Co. to manufacture and market a new automatic test system for its airplane avionics components.
2004-09-16 Agilent's new instruments meet U.S. DoD requirements
Agilent disclosed it will present prototypes of its microwave synthetic instruments, which are said to meet the demands of the U.S. DoD NxTest vision.
2005-08-19 Agilent microwave synthetic instruments to meet MIL demands
Extending longevity, and attempting to lower the cost of automated test, Agilent is about to roll out a family of six synthetic instruments that are all are slated for microwave apps.
2012-02-03 Advances in 3D-IC testing
Read about the design-for-3D-test architecture and implementation flow developed by researchers at Industrial Technology Research Institute based on the Synopsys test solution.
2003-03-27 90nm design flow is seen as a community effort
Yields for ICs with geometries below 100nm may not exceed 50 or 60 percent, according to Pallab Chatterjee, president of tool integrator SiliconMap and organizer of a panel at the International Symposium on Quality in Electronic Design (iSQED).
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