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2014-12-09 Reduce power SoC consumption in the interconnect
Here's a modular approach to SoC interconnect for reducing power consumption. The modular concept is different because it consists of a distributed architecture of various components
2013-08-14 NTU, STATS ChipPAC work on advanced wafer level packaging
Singapore's NTU has entered a joint research programme with STATS ChipPAC to advance solutions for next generation semiconductor packaging technologies
2012-04-17 Addressing integration concerns with SiP technologies
Learn about the benefits and drawbacks of system-in-package technologies
2002-03-04 3GIO, RapidIO interconnect camps seek common ground
The Intel-led 3GIO working group and the Motorola-backed RapidIO consortium have taken the first tentative step to forging some interoperability between their competing interconnect technologies
2004-02-24 Xilinx delivers Advanced Switching core
Xilinx said it is ready to start selling an IP core that will run the Advanced Switching standard on its high-end FPGAs
2009-10-22 Xilinx adopts ARM processors, interconnect tech
Xilinx and ARM are collaborating to enable ARM processor and interconnect technology on Xilinx FPGAs
2008-10-09 TSMC, Mentor team on advanced physical verification
TSMC and Mentor Graphics have collaborated on physical verification solutions leveraging a new feature of the Calibre nmDRC product called "Equation-Based DRC."
2004-01-28 Toshiba, Sonics team in SMART interconnect IP products
Toshiba Corp. and Sonics Inc. have expanded their business relationship with a joint technology collaboration.
2011-04-28 Packaging tool offers advanced miniaturization
Cadence has unveiled the Allegro 16.5 PCB and IC packaging technology, offering capabilities that increase both productivity and predictability across silicon, SoC and system development.
2011-05-30 NVIDIA joins IMEC's advanced CMOS scaling program
NVIDIA signed a 3-year research collaboration agreement with IMEC's advanced CMOS scaling program, enabling it to get insight about future design technology options on its next-generation products
2003-05-02 National teams with Quellan on interconnect devices
National Semiconductor Corp. and Quellan Inc. have formed a strategic alliance to jointly deliver 10Gbps interconnect solutions
2004-09-21 Molex acquires packaging supplier INCEP Technologies
Interconnection components supplier Molex Inc. has acquired INCEP Technologies Inc., in an attempt to penetrate the market for power delivery interconnect solutions
2005-08-01 Low-latency interconnect delivers value
HyperTransport technology is well-positioned for continued growth over the next five to 10 years.
2003-09-15 Darpa to fund optical interconnect research
IBM will team with Agilent Technologies to pursue fabled "terabit per second optical interconnect" technology for multiprocessing servers under a $30M effort backed by Darpa
2011-03-14 Avago fiber optic devices solve interconnect challenges
Avago expands its portfolio of 10Gb to 120Gb fiber optics solutions with embedded parallel modules and industry-standard pluggable modules to handle interconnect bandwidth challenges
2008-03-04 Advanced memory buffer is key in FB-DIMMs
The M88MB2000 advanced memory buffer is a key device in the emerging FB-DIMMs from Montage Technologies
2013-07-10 A*STAR IME consortium delve into advanced packaging
A*STAR IME and a group of semiconductor firms have teamed up to address reliability and performance issues in packaging solutions for compact sized consumer electronics and high power electronics.
2005-11-23 New QFN/DFN package from AIT
Advanced Interconnect Technologies announced the availability of a new ultra-thin QFN/DFN package, which features a thickness of 0.60mm.
2006-10-12 IDT to sell Malaysian facility to Singapore's AIT
Integrated Device Technology announced its plans to sell its Malaysian backend facility to Singapore's Advanced Interconnect Technologies.
2003-04-11 AIT upgrades assembly, test operations in Indonesia
Advanced Interconnect Technologies Inc. has announced that it will expand operations at its factory in Batam, Indonesia.
2004-06-16 Security co-processor ties to PCI Express
Will security accelerator interconnects evolve from the dominant PCI and PCI-X of today to PCI Express tomorrow?
2014-11-18 Reducing SoC power: Where should the focus be?
Typically, efforts to manage power consumption in SoC design are focused on the CPU and GPU. The SoC interconnect is one area that needs to be re-evaluated
2005-05-27 Intel, Alcatel collaborate on AdvancedTCA platforms for mobile solutions
Intel Corp. and Alcatel have signed an agreement to improve time to market of Advanced Telecom Computing Architecture (AdvancedTCA) platforms for mobile service providers
2005-06-20 First ATCA probing product?
With a product that enables connectivity for protocol analysis and traffic generation of Advanced Switching Interconnect, Agilent announces its new Advanced Telecommunications Computing Architecture probing
2010-02-19 DSPs integrate improved accelerators, interconnects
Freescale's MSC8155 DSP packs next-generation acceleration and interconnect technologies that boost overall chip performance and enhance the capabilities of broadband wireless base station equipment
2006-06-01 Choosing the best bumping option
The flip-chip packaging market has rapidly grown in recent years, bolstered by market demands for increased package performance and smaller form factors, an increase in infrastructure, and finally, the development of new substrate technologies and assembly processes
2002-12-27 AMD brings processor to mission-critical systems
Advanced Micro Devices Inc. has announced the availability of the Athlon MP processor 2400+, which is designed for intense computing apps
2007-11-07 A technical overview of RapidIO
The RapidIO protocol defines both serial and parallel PHY interfaces with multiple lane widths, giving developers the ability to trade off between latency, data rate, physical channel length and number of differential pairs used based on the needs of a particular application.
2003-04-16 Too many specifications confuse server design
There seem to be more "industry-standard" technologies available than ever before for connecting together server sub-systems, but many of these technologies overlap
2003-11-06 Startup crafts 58-Gflops computer
On the eve of the Supercomputing Conference 2003, to be held Nov. 15-21 in Phoenix, startup OctigaBay Systems Corp. will introduce a high-performance computer that melds off-the-shelf X86 processors with internally developed high-speed interconnect and reconfigurable-computing subsystems
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