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2008-05-09 Thermal management kit offers 100 heat sink options
ATS has introduced the Thermal Management Design Kit that contains 96 of its maxiFLOW heat sinks and maxiGRIP sink attachment systems
2003-03-18 Delphi, Aavid ink MoU targeting thermal apps
Delphi Harrison Thermal Systems and Aavid Thermalloy LLC have signed an expanded MoU to jointly investigate the development and manufacturing of advanced thermal solutions for the cooling of electronics.
2011-04-11 ATS unveils multitest-in-one thermal analysis tool
ATS says its iQ-200 laboratory instrument measures and records temperature, velocity and pressure simultaneously.
2003-01-27 Permlight, CPS co-develop advanced LED lighting systems
Permlight Products Inc. has entered into an exclusive strategic relationship with Ceramics Process Systems Corp. , to jointly develop semiconductor-based lighting systems.
2013-06-11 Freescale outs power solutions for RF land mobile market
The devices are intended for mobile VHF, UHF and 700-900MHz transceivers used in public safety, professional mobile radio and other harsh machine-to-machine communications environments.
2007-06-26 Tiny buck regulator ups system thermal performance
Fairchild Semiconductor's FAN2106 is the first product in a new family of TinyBuck DC/DC buck regulators that integrate an advanced analog IC, MOSFETs and a boot diode into an ultracompact MLP housing
2006-07-28 Thermal effects not an immediate concern, says TI exec
Contrary to popular belief, the impact of high temperature on a chip design is not among the most immediate concerns for advanced IC design, according to Texas Instruments' Robert Pitts
2004-05-25 STATS expands turnkey solutions with DFT capabilities
STATS has expanded its integrated turnkey solutions with DFT capabilities that will assist customers in improving testability and throughput of their devices
2013-08-07 Sematech, Silvaco to co-develop advanced modelling tools
The collaboration between Sematech and Silvaco will forward the development of advanced modelling tools for the next generation of semiconductors
2013-02-19 Paper tackles 3D IC temperature solutions
The methodology flow presented in the paper will demonstrate the link between the 3-D IC package thermal simulations with the system thermal simulation
2015-11-16 Microsoft Surface Pro 4 flaunts better thermal performance
One of the biggest criticisms of the Surface Pro 3 was its tendency for overheating, with many complaints that the top right-hand corner of the device where the CPU is found would hit high temperatures.
2007-09-13 IRC, OPTEK offer LED lighting solutions
TT electronics' IRC Advanced Film Division and Optek Technology have developed an LED microsite, showcasing their broad range of solutions to solid-state lighting challenges
2013-04-02 IME, UTAC team up for 2.5D TSI packaging solutions
United Test and Assembly Center will collaborate with A*STAR's IME to develop a 2.5D Through-Silicon-Interposer (TSI) platform for packaging solutions
2012-07-27 Fairchild load switches provide advanced protection features for mobile and consumer applications
IntelliMAX Smart Load switches offer high- and low-voltage solutions for greater system power in small form factor
2006-07-27 DC/DC buck converter improves efficiency, thermal performance
IR said its new synchronous buck converter chipset features packaging with double-sided cooling and the latest HEXFET MOSFET technology to reach higher levels of efficiency and thermal performance at the intermediate current levels
2008-07-03 Confab stresses potential thermal crisis in IC design
At the Design Automation Conference in Anaheim, California, an educational panel addressed the thermal issue in IC design. Two key questions raised were when will this issue be emerging as a crucial concern? What are the solutions to solve this potential crisis
2011-08-11 Circuit protection solutions target new vehicle trends
With electric vehicles and hybrid electric vehicles also addressing the world's energy and emissions crises, automakers and battery manufacturers are rapidly developing new materials and solutions to advance those technologies
2005-08-15 Charge pump regulator enables the design of ultra-thin solutions
Advanced Analogic Technologies released a triple-output charge pump regulator that can generate three regulated output voltages for turn-on gate drive bias (Vpos), turn-off gate voltage bias (Vneg) and logic voltage
2014-05-05 Agilent buys technology that identifies thermal problems
The electrothermal analysis technology from Gradient Design Technology enables designers to identify and correct thermal problems encountered when developing integrated circuits. The acquisition stems from a cooperative relationship between the two firms involving the integration of this technology with Agilent's ADS software
2013-10-21 3D memory improved via laser thermal anneal application
Laser thermal anneal application can enhance the current in vertical polysilicon channel devices for 3D memory, as demonstrated by Imec and Excico
2006-02-07 Small board simultaneously measures temperature, air flow
Advanced Thermal Solutions is releasing its ISD board designed to measure air temperature and velocity from two independent sensors.
2006-02-08 Heatsinks cool BGAs in low air flow
Advanced Thermal Solutions has introduced maxiFLOW heatsinks for cooling BGAs and other hot components in restricted air-flow conditions.
2007-01-17 Heat sinks cool high-output LEDs
ATS has introduced three heat sinks that mitigate the intensity of heat generated by high-output LEDs, thereby reducing temperature and extending product life.
2005-04-27 Heat sinks cool components in low airflow conditions
ATS has introduced a line of low profile, high performance heat sinks designed for cooling components in low airflow velocity conditions.
2006-07-25 Heat sinks cool BGA components
Advanced Thermal Solutions has introduced a low-profile, high-performance heat sink designed for cooling BGA components in low airflow velocity conditions.
2007-07-19 Digi-Key, ATS ink global distribution deal
Digi-Key and Advanced Thermal Solutions have signed a global distribution agreement, which will enable Digi-Key to address the design and production quantity thermal management needs of its customers.
2002-12-19 Delta Design inks strategic alliance with KryoTech
Delta Design has entered into a strategic partnership with KryoTech Inc.
2006-08-04 ATS launches heat sinks for Freescale processors
Advanced Thermal Solutions Inc. (ATS) has added two active and passive heat sinks to its "Alaska" line of solutions to cool Freescale Semiconductor processors.
2003-08-28 VIA, AVL develop memory validation program
Advanced Validation Labs (AVL), a validation and testing services company, and VIA Technologies Inc., a developer of silicon chip technologies and PC platforms solutions, have launched their DDR400 memory module validation program
2007-08-13 System management tool starts at $1.20
Actel has introduced a new reference design for embedded applications that enables intelligent system and power management implementations starting at $1.20.
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