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2015-09-17 Spot IGBT degradation through power cycling
Here is a look at an experiment in which we conducted thermal transient tests from one steady-state to another to determine cause of failure for a small sample of IGBTs
2006-10-09 RTP system eases shift to single-wafer processing
Mattson Tech's new 300mm rapid thermal processing (RTP) system is designed to address the industry's transition to single-wafer processing for applications currently predominantly run on furnaces
2006-08-14 New LEDs from Osram use ThinFilm tech
Osram has introduced the Advanced Power TOPLED line of LEDs that incorporates ThinFilm technology
2005-04-15 Honeywell offers wafer thinning materials for semiconductor production
Honeywell has announced the availability of wafer thinning materials as part of its product portfolio for semiconductor manufacturing.
2014-01-28 Global video surveillance market to log $16B revenue this year
The worldwide market for video surveillance equipment is expected to expand by more than 12 percent this year, according to IHS.
2005-06-01 Driving 10Gb Serial ATCA backplanes
The Backplane Ethernet Task Force is focused on developing three new PHYs: 1000BASE-KX, 10GBASE-KX4 and 10GBASE-KR
2007-06-25 Designing in the age of 3D systems
The optimal utilization of the third dimension requires a careful design of the overall 3D system architecture.
2006-06-01 Choosing the best bumping option
The flip-chip packaging market has rapidly grown in recent years, bolstered by market demands for increased package performance and smaller form factors, an increase in infrastructure, and finally, the development of new substrate technologies and assembly processes.
2003-02-18 CFDRC licenses Simmetrix simulation modeling suite
CFD Research Corp. has licensed several modules of Simmetrix Inc.'s simulation modeling suite.
2002-04-03 AE acquires Dressler HF Technik
Advanced Energy Ind. Inc. has acquired RF power solutions supplier Dressler HF Technik GmbH
2014-10-29 Advances in power supply packaging
Here's a look at where the power industry is going in terms of component integration and thermal management. It also covers the developments in DC/DC power converter density
2008-01-18 Heat sinks keep high-power LEDs cool
Advanced Thermal Solutions has introduced the Star series of heat sinks designed specifically for cooling higher power, surface-mount power LED packages.
2006-10-05 UMC, IME co-develop RF modeling for 90nm
United Microelectronics Corp. have partnered with Singapore's Institute of Microelectronics to jointly develop RF modeling solutions for 90nm technologies
2008-11-03 Trimming standby power supply consumption
Consumer electronics and home appliances, and in general all electronic equipment, play a key role in the reduction of the energy consumption. This requires a continuous technological improvement of all electronics products. New advanced solutions must be continuously and rapidly developed with high quality, efficiency and respect for the environment
2007-07-05 Transistors address power efficiency in portable apps
ON Semiconductor has expanded its low Vce(sat) bipolar junction transistors (BJTs) portfolio to include PNP and NPN devices that incorporate advanced silicon technology
2013-04-01 Transceiver system ready for next-gen Ethernet standard
FCI's single on-board transceiver system has a small footprint to save precious PCB real estate and offers different transceiver heat sink options to meet thermal application requirements
2007-08-31 Step-down converters simplify system designs
Advanced Analogic Technologies Inc. has introduced the AAT1112 and AAT1145 current mode step-down converters that require no external compensation components and offer designers highly compact and easy-to-implement solutions
2005-05-17 STATS ChipPAC to offer 300mm electroplated wafer bumping services
STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications
2014-12-26 SolderStar to supply Rehm with vapour phase sol'n
Rehm Thermal Systems asked SolderStar to develop a profiling unit that would fit with their recent portfolio of innovative high performance vapour phase machines
2005-09-28 Sequence Design introduces 'formal' power grid verification
Looking to build on its reputation as an established provider of IC power management technology, Sequence Design rolled out a new product focused on another thermal issueIC power grid integrity
2007-05-22 Samsung's DDR3 components pass Intel's validation
Samsung Electronics Co. Ltd has announced that 21 of its DDR3 solutions have been validated on Intel Corp.'s reference platform to work with Intel's next generation DDR3 chipsets
2009-04-30 Resonant controller ensures noise immunity
Fairchild Semiconductor has introduced the FAN7621 resonant controller that simplifies design, reduces BOM and provides advanced protection functions in LCD and PDP TVs, servers, game consoles and LED lighting applications
2007-07-18 Power input module design fits ATCA applications
SynQor releases its iQor Power Interface Module designed for applications complying with the Advanced Telecom Computing Architecture (ATCA) specifications
2007-03-27 Optek, IRC develop LED design kit for solid-state lighting
TT electronics' Optek Technology and IRC Advanced Film Division have developed a LED design kit that combines IRC's Anotherm technology and Optek's IR and high-brightness LEDs
2010-09-16 New product line for next-gen computing unveiled
ON Semiconductors' platform solutions for 2nd-gen Intel Core processors includes advanced controller ICs for CPU voltage regulation, switches for high-bandwidth communications
2006-11-21 Motion-SPM eases inverter motor drive designs
Fairchild said the high integration level and advanced packaging of its Motion-SPM devices simplify the design of small inverter motor drive applications, speed time to market and reduce total system cost
2004-09-21 Molex acquires packaging supplier INCEP Technologies
Interconnection components supplier Molex Inc. has acquired INCEP Technologies Inc., in an attempt to penetrate the market for power delivery interconnect solutions
2016-01-08 Mixed-signal IC design: Forecasts for 2016
This article will examine the key trends, challenges, and emerging solutions in mixed-signal system design enablement, focusing on mixed-signal verification
2011-08-03 MEMS module detects up to 16g acceleration
STMicroelectronics's multi-sensor module offers six degrees of freedom and targets advanced motion-sensing applications
2007-09-14 MediaTek, Apache take on 65/45nm design challenges
Apache Design Solutions announced that MediaTek has selected Apache as their EDA partner for addressing 65- and 45nm physical design challenges
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