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2007-11-16 Manage design resources for industrial apps
To better manage design resources and attain economies of scale, OEMs need solutions that enable customization of platforms with common building blocks, so that unique models may require only minor variations in components and/or firmware
2009-04-24 LEDs boast 90lm/W luminous efficacy
Osram Opto Semiconductors has released the Advanced Power TopLED Plus optimized LED designed particularly for architectural and sales lighting
2008-11-03 LED drivers promise simplified configurations
Advanced Analogic has released two 4-channel, charge pump-based LED drivers for bigger LCD screens in compact feature entry-level handsets and portable devices
2014-11-25 Japan seeks to gain tech supremacy with IoT
At the Embedded Technology 2014 last week, Japanese exhibitors, whole-heartedly embracing IoT and its technology building blocks, were busy showing solutions bridging the old and new
2005-05-11 IR MOSFET chipsets tweak dc-dc for Intel, AMD portables
IR has two new 30V DirectFET MOSFET synchronous buck converter chipsets for advanced notebook computer designs using the latest Intel and AMD processors where small size, high efficiency and improved thermal conduction are required
2005-07-12 IR chipset suits notebook computers with Intel, AMD processors
International Rectifier's IRF6621/IRF6612 synchronous buck converter chipset is optimized for 14A to 18A per phase dc-dc power conversion in advanced notebook computer designs using the latest Intel and AMD processors
2007-11-14 Infineon reveals new packaging technology
Infineon Technologies unveils a new package technology, and has tapped Advanced Semiconductor Engineering as its IC packaging partner
2005-10-14 Hot-swap ICs from Freescale cut board space by 60 percent
Two advanced, highly integrated power management ICs from Freescale Semiconductor, the MC34652 and MC34653, facilitate an easy hot-swapping solution in -48 volt backplanes for telecommunication and networking equipment. The company says these chips cut board space by 60 percent over most competing solutions
2008-05-23 High-power density promise from bus converter
Vicor's brick business unit has added the VI BRICK BCM bus converter to its new VI BRICK family that provides an advanced modular power platform for power solutions
2012-10-17 FOD8316 optocoupler features isolated gate driving
The device is an advanced 2.5A output current IGBT drive optocoupler which aims to cater to the high-power industrial applications demand for a gate driver with high performance and critical protection features
2009-05-21 Energy harvesting: ready for prime time?
Over the past 12 months, energy harvesting has undergone a rapid evolution from a mere theoretical technology to one supported by a healthy ecosystem of vendors with solutions that will be showing up in more applications, according to participants in a panel discussion at the nanoPower Forum
2010-06-23 Elpida, PTI, UMC team on 3D IC integration for 28nm
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corp. have reached a three-way cooperation to advance 3D IC integration technologies for advanced processes including 28nm
2006-08-11 Dual ULDOs tout 'smallest' MLF package
Micrel's new dual ULDOs are offered in one of the industry's smallest packages, a tiny 1.6-by-1.6mm 6-pin MLF package, making them suitable for advanced portable applications
2009-01-28 DC/DC converters transport up to 16W power
Murata Power Solutions has released the HPQ series of ultrahigh power quarter brick, isolated DC/DC converters
2008-12-03 Charger IC handles concurrent system load, charging
Advanced Analogic Technologies Inc. has released the AAT3672, a highly integrated, single-cell Li-on/polymer battery charger and system management IC that enables simultaneous battery charging and system load management
2009-10-12 Battery manager ensures safety, efficiency
Atmel's battery management solutions address safety and efficiency issues for automotive and industrial use
2003-01-08 AVL to validate ATI memory modules
ATI Technologies Inc. has selected Advanced Validation Labs to validate and test memory modules for its RADEON IGP family of integrated graphics processors
2004-06-28 AMD strengthens mobile computing with new lab in Tokyo
Advanced Micro Devices Inc. (AMD) has opened an engineering lab in its Tokyo, Japan headquarters
2004-01-26 Agere SoC reduces system cost by 50 percent
Agere Systems has announced what it claims as the industry's first single-chip controller for inkjet and thermal fax applications
2002-03-14 Aavid, Swales jointly develop cooling systems
Aavid Thermalloy, a provider of thermal management solutions technologies, and Swales Aerospace have jointly developed a loop heat pipe technology for electronic cooling applications
2012-05-16 Interconnects push LED solution upgrades
Molex has presented solderless LED array holders and other microminiature connectors that the company says can enable advanced lighting solution designs
2010-09-16 IDT supplies VRMs for fastest supercomputer
IDT announced that it supplied voltage regulator modules (VRMs) to SGI to power Altix UV, the world's current fastest supercomputer.
2008-10-24 HB LED driver enables green lighting for automotive apps
Maxim Integrated Products has released the MAX16826 programmable, four-string high-brightness (HB) LED driver for white, RGB, and RGB-plus-amber LED configurations.
2013-10-28 Do high power LEDs emit IR heat in forward manner?
Is it true that a high power LED emits no UV or IR and that any heat is generated only in the PN junction and then transferred to a heat sink?
2010-10-27 Xeon gets embedded for flight
Mercury's Xeon embedded computer houses two quad-core Jasper Forest Xeon processors in an OpenVPX module for use in high-end radar, multi-sensor electro-optical/IR and other embedded applications.
2003-01-02 Wireless ICs call on integration
Makers of ICs for Bluetooth and 802.11, or Wi-Fi, WLAN connectivity are readying a new generation of chips for volume delivery in Q1 of 2003.
2015-10-12 What you need to know about sensor fusion
Here is a look at the general concept of sensor fusion, the historical perspective, and two detailed casesinertial sensor fusion and image fusion.
2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility.
2002-12-19 VRMs meet 9.1 requirements for Xeon
Celestica Inc.'s VRM 9.1 family of dc/dc converters are specifically designed for next-gen 32-bit processors.
2009-02-19 Voltage regulators reckon energy efficiency
International Rectifier has introduced its second generation of SupIRBuck integrated point-of-load (POL) voltage regulators for energy-efficient, high-performance server, storage and netcom applications.
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