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2014-06-17 Vision-based AI boosts surveillance applications
Cost, performance and power consumption advances are now paving the way for the proliferation of embedded vision into diverse surveillance applications.
2014-09-26 Vision in wearables: Broader applications, functions
Vision processing can now take place right on your wrist or your face at price points that enable adoption by the masses. This article tackles a key factor in this burgeoning technology success story.
2014-03-14 Vicor CEO shares probable trends in power tech
Phil Davies, VP of global sales and marketing at Vicor, said that large datacom and data centres eyeing HVDC distribution, and packing power in smaller packages as forthcoming trends in 2014.
2006-11-14 VIA processors power Hitachi desktops
VIA Technologies announced that Hitachi Ltd has selected the VIA processors to power their new FLORA Se series desktop and mobile connected clients.
2010-10-15 Veeco bags HDD contracts
The company says its physical and chemical vapor deposition systems enable higher areal density for next generation thin film magnetic heads.
2015-02-13 Utilising LEDs for LCD backlighting (Part 2)
In Part 2, we will begin with a look at the market trends that have driven the evolution of LED LCDs. This will be followed by an exploration of the optical design techniques used in today's displays.
2006-06-27 UMC is getting 65nm interest
According to major silicon foundry United Microelectronics Corp., it has been getting a lot of interest in 65nm designs.
2013-03-13 Transition from analogue to digital power supplies
Know the emerging industry trend for simplicity that will allow small and medium sized industrial enterprises to make the leap to digital and take advantage of this technology.
2012-04-24 TI's motor drivers target battery-powered apps
The DRV8834, DRV8835 and DRV8836 motor drivers claim to cut power use by 80 percent and PCB space by 95 percent.
2014-08-14 TI unveils latest multiphase core voltage sol'ns
Compliant with Intel's VR12.5 and VR12 voltage regulation specifications, TI released the TPS53661, TPS53641 and TPS53631 DC/DC controllers and CSD95372B and CSD95373B NexFET smart power stages.
2009-04-23 TI ramps production in Philippine test plant
Texas Instruments Inc.'s new assembly/test facility within the Clark Freeport Zone in the Philippines is now fully operational and ramping production with the latest packaging technologies.
2014-04-23 The key to improving wearable medical electronics
An essential component of wearable technologies is the power source which usually comes in the form of a battery.
2013-02-04 Tackling the challenges of transition to DDR4
Know the key technical challenges designers face in transitioning to DDR4.
2009-03-12 Tackling FM antenna design roadblocks
As wireless usage models become more popular in portable devices, customers are demanding wire-free FM radio reception with embedded antennas. The article discusses maximizing sensitivity to improve FM reception using an embedded antenna and the methods to achieve that goal.
2008-03-31 Synchronous rectifier ups efficiency in power designs
Fairchild has rolled out a 40V breakdown DC/DC synchronous rectifier that it says enables designers to achieve higher levels of efficiency in their power designs.
2010-06-11 STT-RAM geared to displace DRAM, flash
Grandis Inc. has updated its STT-RAM roadmap with some ambitious efforts in mind: It hopes to replace DRAM, and eventually, NAND, with its next-generation MRAM.
2010-12-01 STATS ChipPAC ships 100 millionth copper wire bond interconnect semiconductor packages
STATS ChipPAC expects continued surge in use of copper wire as interconnect material
2011-04-21 STATS ChipPAC aims TSV expansion in Singapore
STATS ChipPAC is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities in Singapore.
2004-07-01 Speedy A/Ds demand stable clocks
Understanding the factors that affect converter accuracy will establish just how good a reference clock must be.
2003-08-01 Specification targets clock distribution
Multipoint low-voltage differential signaling technology will fill this need to support clock distribution for future infrastructure equipment.
2004-12-16 Space-based GPS lowers costs
Developing a satellite may be expensive, but integrating a GPS receiver may trim down costs.
2011-03-24 Solid-state lighting poised to take off
While experts believe LEDs will remain the dominant SSL technology until 2020, they insist the rate of SSL adoption will still depend on how soon the cost of ownership can be reduced.
2014-11-05 Smart energy platform integrates two Cortex M4 cores
The dual ARM Cortex -M4 architecture allows for integration of application layer, communications layers and metrology functions in a single device.
2005-07-18 SiP modules call for right blend of tech
The SiP solution offers a seemingly limitless combination of silicon, package and component technologies that simplify overall system design.
2005-05-30 Simulation software sets power designs in motion
IR's new web-based simulation tool for three-phase, variable-speed, motor drive inverter circuits simplifies recursive calculations and expands the design support for the company's iMOTION integrated design platform.
2005-06-27 Semiconductor technologies for power management (Part 3)
Understand better why ICs and discrete transistors require very different methods of fabrication.
2013-01-29 Save power in LCD TVs with LED driving techniques
New design techniques in LED driver circuits promise to deliver significant energy savings that will go a long way to helping TV manufacturers meet the tough requirements for power consumption.
2003-09-16 Redefining design for yield, manufacturability
By adopting a more design-driven approach to production, many of the yield and manufacturing issues daunting the semiconductor industry can be addressed before they even occur.
2009-03-11 R3Logic to advance 3D design flow R&D
R3Logic announced that it has created a new R&D center in Grenoble, France to develop and enhance its design tools for 3D heterogeneous system and system-in-package design.
2014-01-08 Qualcomm uncloaks Ultra HD processor for TVs, STBs
The Snapdragon 802 processor targets the latest smart TV experiences at Ultra HD resolution, including seamless decoding of Ultra HD video content, rich user interfaces and console-quality gaming.
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