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2002-09-13 Intel devices to advance digital perspective
Intel SVP Mike Fister and EVP Sean Maloney explained how a modular IT infrastructure with mixed-wired and wireless communications capabilities will generate lower operating costs and increase system flexibility.
2003-11-24 Intel commits $36M to supercomputer R&D
Intel announced during the Supercomputing 2003 conference that it will spend $36M over the next few years on R&D to fuel use of its Pentium and Itanium processors.
2005-05-18 Infineon DDR2 modules tailored for high-end desktops, servers
The customized 8GB DDR2-400 Tall registered DIMMs from Infineon require lower array voltage to store electrical charges compared to stacked DRAM.
2015-10-26 Impact of wearables, IoT on electronic design
Today's IoT and wearable products must deliver ever-increasing capabilities in smaller packages with more aerodynamic shapes. Engineers will need all the help they can get.
2011-05-26 Imec, Atrenta develop exploration flows for 3D ICs
Atrenta and Imec have co-developed a design flow for heterogeneous 3D stacked ICs.
2010-12-09 ICs seen to scale via 3D TSV
Chip scaling is becoming harder and costlier entering into the sub-20nm realm, thus, the industry is looking for new materials, structures and processes, says a technologist from Samsung.
2007-11-08 IBM-led alliance ups investment in 32nm packaging
The Common Platform alliance led by IBM plans to increase its investment in semiconductor packaging technology to pave the way to 32nm devices.
2007-09-16 High-power video projection with liquid-cooled HB LEDs
High-power/brightness LEDs are an increasingly attractive solution for projection applications due to their enhanced color range, high performance over the life of the end product and lower cost of ownership than current arc lamp technology.
2006-05-12 HEXFET MOSFETs meet small size, high efficiency requirements
International Rectifier introduced the IRF7835PbF and IRF7836PbF, 30V synchronous buck HEXFET MOSFETs for DC/DC synchronous point-of-load converters.
2006-04-12 HEXFET MOSFETs deliver optimized conduction, switching
International Rectifier introduced four SO-8 30V dual HEXFET MOSFETs for synchronous buck converter applications up to 6A.
2009-09-09 HB LED driver cuts LCD TV backlighting costs
The highly-integrated driver implements a high-performance backlight driver for LCD TVs, monitors, car displays.
2014-11-21 Grasping the significance of charge detectors
Learn about the role of charger detectors in the USB battery charging specification rev. 1.2, and understand how they keep the implementation clean and simple to use.
2015-12-07 Get 500W in converter with GaN (Part 1)
Part 1 covers brick technology, a comparison of eGaN FETs to silicon MOSFETS, a basic overview of the GaN-based eighth-brick design, and experimental results.
2008-07-08 Freescale fortifies QorIQ communications platforms
Freescale Semiconductor presents the first two product series based on its QorIQ communications platforms for next-generation multicore networking applications.
2005-10-06 Fluorine sweeps high-k defects out of the gate
Hafnium oxide, the anointed successor to silicon dioxide in the gate stack, has a new ally: fluorine.
2007-10-05 Flash LED driver suits cellphones with video recording
AnalogicTech has announced a new LED driver designed for use with high-current/high-brightness flash LEDs in mobile phones with video recording.
2005-01-26 Fairchild jams features in low-power load switches
Fairchild announced the first in a series of IntelliMAX integrated low-power load switches targeting portable battery-powered apps.
2010-08-06 Facility provides customized precision testing for LED design
OPTEK Technology’s LED test facility provides OEMs 100 percent color temperature/intensity binning.
2014-12-22 Experimental methods for PCB design and manufacturing
EMS providers are being called upon to take on the task of design of experiments, also known as experimental designs, requiring them to work with OEMS to do the necessary research and development.
2015-08-11 Examining a bi-directional supercap charger
A bi-directional average input current controlled buck-boost DC/DC supercapacitor charger/regulator utilises a switching algorithm, enabling its outputs to be regulated above, below, or equal to the input voltage.
2013-07-03 EVG unveils room-temperature debonding platform
The platform includes two new debonding processes that have been qualified for EVG's high-volume production temporary bonding/debonding systems in addition to the company's ZoneBOND technology.
2005-10-03 Energy-harvesting chips: The quest for everlasting life
Research continues in developing higher energy-density batteries, but the amount of energy available is low and finite.
2007-03-23 Emerson unveils 300W, 642W bus converters
Emerson Network Power launched two intermediate bus converters (IBCs) that can deliver high levels of output power with a conversion efficiency of 97 percent.
2015-03-05 Embedded die in substrate shows promise in processing tech
Yole Dveloppement revealed that embedding die in laminate substrates is a promising packaging principle, but it has to overcome several challenges, which include the supply chain.
2009-03-13 Ease real-time solder joint fault detection in FPGAs
Without early detection, electrical anomalies caused by solder joint faults can result in the catastrophic failure of mission-critical equipment.
2011-08-04 Dual switch flyback converter targets AIO apps
Fairchild's mWSave technology-based dual switch flyback transformer is designed for 75~230W applications and provides low power loss at light load.
2009-07-24 Dual LDOs boast miniscule form
Micrel Inc. has launched the MIC5380 and the MIC5381, part of a new family of dual voltage linear regulators offering low dropout voltage of 155mV@150mA.
2011-07-15 Dual HS-CAN transceiver simplifies car networking design
NXP’s TJA1048 is targeted at engine, body control and gateway applications that use multiple HS-CAN networks and require a low-power mode with wake-up capability via bus.
2009-12-01 Driver IC improves dimmable LED efficiency
iWatt Inc. has released the iW3610 digital LED driver IC with primary side regulation, which eliminates the need for an optocoupler.
2013-05-02 Distributed power tech for portable multi-core app processors
The solution from IDT touts a patented distributed power technology that consists of a main PMIC with communication lines for the control of IDT's add-on power sources for increased power output capability.
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