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2012-06-28 AMD APU cuts embedded apps' power use, footprint
AMD's embedded G-T16R accelerated processing unit delivers thrice the performance of the company's Geode LX processor.
2005-08-22 Advancing the set-top box
Designers need to manage multiple specifications and integrate PVR, WLAN, cable modem, telephony and a host of other technologies in order to develop set-top boxes and residential gateways for worldwide markets.
2013-04-18 Advances in capacitive touchscreen for mobiles
It is imperative to understand recent innovations that will lead to the development of truly inexpensive touchscreen products.
2012-02-03 Advances in 3D-IC testing
Read about the design-for-3D-test architecture and implementation flow developed by researchers at Industrial Technology Research Institute based on the Synopsys test solution.
2007-05-09 AC motors suit corrosive manufacturing environs
Baldor's all-stainless AC motors are suitable for use in chemical processing and manufacturing plants, as well as for outdoor applicationsespecially in hostile environments involving corrosive agents such as salt spray.
2011-09-27 A primer on 3D-IC design challenges
Know the 3D-IC design challenges such as system exploration, floorplanning, analysis, and design for test (DFT), and learn how designs will evolve as 3D-IC goes on to become a necessity for managing power, performance, form factor, and cost goals.
2010-11-11 75W GaN RF transistor delivers high peak efficiency
RF Micro Devices says GaN RF delivers superior performance ersus competing GaAs and silicon power technologies
2011-06-28 3M opens innovation center in Taiwan
3M's application laboratory in Yangmei, Taiwan will provide support for 3D ICs and ultra-thin wafer handling for the semiconductor industry.
2013-10-23 3-phase MOSFET bridge APM handles 2kW load
A three-phase bridge MOSFET automotive power module can be used to improve the system design for electrified automotive accessories.
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