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2009-06-02 Opinion: 10 IC companies in danger
The list of semiconductor companies posting banner numbers these days is short and thin. Every firm is in trouble, to some degree.
2004-02-02 Open architecture ATE tackles test woes
The basic idea behind the open architecture test system is to provide such modularization with specific focus on the use of third-party modules and test instruments.
2008-09-04 New wave of ATE consolidation emerges
Teradyne has signed an agreement to buyout fellow IC automated test equipment vendor Eagle Test Systems for approximately $250 million in cash.
2011-06-23 NEC targets U.S., European design houses with HLS tool
With CyberWorkBench, NEC hopes to serve U.S. and European design houses requiring high-level chip synthesis tools that address both data and control paths of their designs.
2011-03-17 Most Japan fabs survive 8.9 quake
Although there are few reports of damages on production facilities due to the quake, power shortages may render some of the fabs off line as the country recovers from last week's tragedy.
2005-07-21 Mixed signals seen in IC-equipment market
There are still plenty of mixed signals - and little visibility - in the chip-equipment market despite a sudden jump in Japan's fab-tool book-to-bill ratio.
2008-06-03 Maskless tools to boost ASIC throughputs
E-Shuttle Inc. is set to improve its direct-write e-beam capabilities and explore the future use of next-generation maskless tools from Mapper Lithography NV and other startups in the arena, making e-beam tools a probative technology in mainstream production fabs.
2006-07-24 Japan's fab-tool book-to-bill sees huge increase
In what could be a possible short-lived boom cycle, Japanese-based semiconductor-production equipment manufacturers experienced a huge jump in bookings for June.
2011-03-16 Japan quake raises concerns over electronics supply chain
According to analysts, the devastating earthquake that hit Japan, a key source of chips supporting CE devices, could lead to production decrease, phenomenal price swings and large near-term shortages.
2008-07-23 Is it all gloom for ATE?
The shakeout in the automatic test equipment business is over. Or is it?
2009-06-25 Intel: Fab tool market savior?
Intel Corp. continues to fund technologies and procure fab-equipment, but behind the scenes, the company is investing in some companies and brokering deals for others, reportedly including ASM International NV and NuFlare Technology Inc., sources said.
2007-11-05 Intel pushes for common platform in fabs
Intel is interested in having a common and standard "vacuum processing platform" throughout its fabs.
2010-03-22 IC forecasts: What keeps analysts bullish, worried
Although the signs are positive in the chip sector this year, there are still some concerns. Here are 10 reasons to remain bullishand worriedabout 2010.
2014-11-27 How to achieve 200-400GE network buffer speeds
Know how a serial chip-to-chip protocol, with 200-400 GE data rates and 4.5 B read/write transactions, can be used to eliminate throughput bottlenecks at the processor/external DDR memory interface.
2005-06-29 Hitachi, Tegal win fab-tool satisfaction rankings
Hitachi High-Technologies Corp. and Tegal Corp. separately received the highest ratings in their respective categories for customer satisfaction in the chip-equipment industry for 2005, according to an annual survey conducted by VLSI Research Inc.
2008-06-03 Gartner ups 2008 IC forecast to $287B
Gartner Inc. has raised its worldwide IC forecast from 3.4 percent to 4.6 percent for 2008, to reach $287 billion, up from $274 billion in 2007.
2010-01-06 Fearless IC forecasts for 2010
2010 is just beginning to unfold in the electronics industry and there is already uncertainty in the air. EE Times' Mark LaPedus offers his chip forecasts and other prediction for 2010.
2008-02-27 EU forms group to push for maskless litho at 32nm
The European Union has formed a program to push for the insertion of maskless lithography for IC manufacturing at the 32nm ''half-pitch'' node in 2009. The program is called Magicfor Maskless Lithography for IC manufacturing.
2008-08-06 eASIC jumps to 45nm, finds new foundry partner
Fabless vendor eASIC Corp. will skip the 65nm node and roll out what it calls a "zero mask charge" 45nm ASIC line.
2011-01-21 Does the fab tool business model need mending?
Fewer fabs coupled with cyclical downturns have caused massive consolidation in the fab tool industry. While some insist the industry should further consolidate to make it more efficient, others fear that fewer players could lead to higher tool costs and monopolies.
2005-03-21 Chipmos, Promos extend chip assembly, testing service deal
Chipmos Technologies Inc. (Chipmos Taiwan) has extended the duration of its agreement with Promos Technologies Inc.
2003-10-17 ChipMOS inks assembly, test pact with ProMOS
ChipMOS Technologies Inc. has signed an agreement with ProMOS Technologies Inc. to guarantee its future capacity supply of memory IC assembly and testing services to ProMOS.
2009-02-26 Chip vendors unite for e-beam initiative
The eBeam Initiative, a multi-company effort dedicated to the advancement of e-beam direct-write technology for semiconductor prototyping and low-volume manufacturing, was formally launched at the SPIE Advanced Lithography.
2003-07-21 Chip test consortium releases second Openstar spec
The Semiconductor Test Consortium announced that they have released the second draft of the specification for Openstar.
2015-05-04 Chip incubator opens start-ups for low-cost power, 2.5D stacks
Silicon Catalyst established three start-ups to provide tools, space and funding for developers of cost-effective integrated analogue power components and 2.5D stacks, and Bluetooth Low Energy ID tag.
2009-09-23 Canon litho dreams hit price roadblock
The end could be near for Canon Inc.'s lithography efforts, as the company is reportedly mulling plans to cease future, high-end scanner development, according to sources.
2009-03-10 Bad news for Japan tool, materials markets
The book-to-bill ratio for Japanese fab tool vendors was 0.55 for January, down from 0.70 in December, according to the Semiconductor Equipment Association of Japan.
2005-08-26 ATE group adds members, loses Freescale
The Semiconductor Test Consortium (STC) - the Intel-backed group that is driving an "open standard" for automatic test equipment (ATE) - has gained some new partners but it also lost a founding member in Freescale Semiconductor Inc.
2003-07-22 ATE executives sees future in consolidation
Looking across a landscape of shrinking capital expansion plans, vanishing margins and far too many clever ideas, ATE industry executives pondered consolidation at Semicon West.
2009-03-19 ASML climbs IC equipment supplier list
ASML has moved up to the No. 2 position in revenue among IC equipment suppliers in 2008, reflecting the more significant role of lithography in the semiconductor industry, according to VLSI Research Inc.
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