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2003-07-07 TSMC, Amkor partner on flip-chip packaging
Amkor Technology has developed and qualified wirebond and flip-chip packaging for devices manufactured on TSMC's advanced low-k process technologies.
2003-08-27 TriQuint, Amkor partner on flip-chip process
TriQuint Semiconductor Inc. has teamed with Amkor Technology Inc. to commercialize a low-cost flip-chip assembly process for GaAs semiconductors.
2003-01-27 TI enhances DLP technology through Amkor facility
Texas Instruments Inc. has selected Amkor Technology Inc. to provide the company with subcontractor assembly facilities that will give TI additional manufacturing capacity for its DLP technology.
2002-06-26 Simtek receives first silicon from Amkor
Simtek Corp. has received its first silicon-oxide-nitride-oxide-silicon from Amkor Technology Inc. as part of their development, licensing and product agreement.
2003-03-10 Sharp, Amkor to develop unified stacked package design
Sharp Corp. and Amkor Technology Inc. have agreed to unify the design for 3D system in package assembly that enables the stacking of very thin packages.
2004-01-22 Oki signs Amkor for contract assembly services
Electronics manufacturer Oki Electric Ind. Co. Ltd has selected Amkor Technology Inc. to assemble and test single and stacked-die chip scale packages.
2009-10-28 Nakaya, Amkor, Toshiba form assembly, test JV
Nakaya, Amkor and Toshiba will create joint venture that will provide semiconductor assembly and final testing services in Japan.
2004-05-21 IBM jettisons IC-packaging units, sells plants to Amkor
IBM Corp. has moved to jettison its chip assembly and packaging operations, announcing a major deal with Amkor Technology Inc.
2005-03-30 Credence, Amkor form strategic partnership
Credence Systems Corp. has entered into a strategic partnership with Amkor Technology Inc. to jointly address the increasing semiconductor demands of their mutual customers.
2003-03-05 Anam acquires Amkor's wafer fab business
Anam Semiconductor Inc. has purchased Amkor Technology Inc.'s wafer fabrication services business for $62 million.
2003-08-07 Amkor, UTAC forge test alliance eyeing China
Amkor Technology has announced a business alliance with United Test and Assembly Center Ltd (UTAC), a Singapore-based provider of solutions in assembly and testing of memory and mixed-signal semiconductors.
2005-07-29 Amkor, STATS ChipPAC still spilling red ink
Two major chip packaging and test vendors - Amkor and STATS ChipPAC - continue to spill red ink amid slumping demand and severe price pressures in the market.
2004-12-23 Amkor, PSi ink patent license deal
Amkor Technology Inc. and PSi Technologies Holdings Inc. have signed a broad, multiyear patent license agreement that allows PSi to practice under Amkor's portfolio of MicroLeadFrame patents and will grant Amkor access to the intellectual property being developed by PSi related to its PowerQFN technology.
2002-08-30 Amkor, PMC-Sierra begin 2G flip-chip production
Amkor Technology Inc. and PMC-Sierra have released for production its jointly developed second generation flip-chip packaging solutions.
2002-07-18 Amkor, MCT, Nextest demonstrate economical test technology
Amkor Technology Inc., Micro Component Technology Inc. and Nextest Systems Inc. have demonstrated a strip testing technology at Semicon West 2002.
2007-07-19 Amkor, IMEC sign 3D wafer-level packaging pact
Amkor has agreed to develop 3D integration technology with IMEC based on its wafer-level processing techniques.
2002-07-19 Amkor, IBM partner on flip-chip technology offerings
Amkor Technology Inc. and IBM have agreed to collaborate on the design and production of flip-chip substrates and packaging.
2002-03-15 Amkor, GSMC to jointly offer microelectronics products in China
Amkor Technology Inc. and China's Grace Semiconductor Mfg Corp. (GSMC) have signed an agreement to jointly offer supply chain products and services for customers specializing in the microelectronics in the China market.
2005-08-17 Amkor, GEM ink chip package license agreement
Amkor Technology Inc. and GEM Services Inc. have signed a broad, multi-year patent license agreement that allows GEM to practice under Amkor's portfolio of MicroLeadFrame patents.
2002-10-22 Amkor, Fujitsu forego factory outsourcing proposal
Amkor Technology Inc. and Fujitsu Ltd have ended their discussions relating to Amkor's proposed equity purchase of Fujitsu's semiconductor assembly and test operation located in Kagoshima, Japan.
2004-03-26 Amkor, Casio join forces on wafer-level packaging
Amkor Technology Inc., Casio Computer Co. Ltd and Casio Micronics Co. Ltd have established business and technology licensing agreements for assembly and test of wafer-level semiconductor packages, commonly known as WLP.
2005-04-08 Amkor, Asat sign cross-licensing agreement - again
Packaging companies Amkor Technology Inc. and Asat Holdings Ltd have entered into a multi-year cross-licensing agreement, Amkor said Wednesday (Apr. 6), a follow-on from a similar deal cut in November 2003.
2003-11-18 Amkor, ASAT ink patent cross-license agreement
Amkor Technology and ASAT Holdings have entered into a comprehensive patent cross-license agreement for their respective QFN package technologies.
2012-11-09 Amkor's CEO resigns after 15 years of service
Ken Joyce, who was appointed CEO and named to Amkor's board of directors in October 2009, will exit the company at the end of 2013.
2005-09-22 Amkor to test RF tuners using Agilent's 93000 system
Amkor Technology Inc. has obtained a 93000 RF system from Agilent Technologies Inc. to be installed at its IC test facility in Singapore.
2002-04-25 Amkor to take over Fujitsu assembly plant in Japan
Amkor Technology Inc. will take over a Fujitsu Ltd. semiconductor assembly factory as make it its second assembly operation in Japan.
2004-07-26 Amkor to take hold of Unitive
Amkor Technology Inc. has signed definitive agreements to acquire privately-held Unitive Inc., based in North Carolina (Unitive), and to obtain a majority interest of about 60 percent in Taiwan-based Unitive Semiconductor Taiwan Corp. (UST), a joint venture between Unitive and various Taiwanese investors.
2002-07-16 Amkor to sell part of stake in Anam
Amkor Technology Inc. has signed a purchase agreement with Dongbu Group selling 20 million of the former's common stock shares in Anam Semiconductor Inc.
2002-09-09 Amkor to render manufacturing services to Agilent
Amkor Technology Inc. has formed a technology development alliance and manufacturing services agreement with Agilent Technologies Inc.
2002-02-27 Amkor to purchase ball bonders from K&S
Amkor Technology has issued a letter of intent indicating its intention to purchase 200 units of Kulicke & Soffa Ind. Inc.'s Maxum ball bonders to help support its ramp to ultra-fine pitch wirebond technology.
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