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2013-07-11 Vacuum pump tweaked for Applied Materials' platforms
Edwards Group Limited's IPUP2 boasts increased tool throughput, achieving a peak pumping speed (180 m3/h) 89 per cent faster and pump down times up to 54 per cent faster than 1st generation pumps.
2008-07-04 USDC, Applied team on TFTs for next-gen displays
The U.S. Display Consortium (USDC) and has awarded Applied Materials Inc. a cost-shared contract to develop metal-oxide films for next-generation TFTs.
2003-07-21 TSMC, Applied Materials ink deal on ECP development
Taiwan Semiconductor Mfg Co. has entered into a joint development agreement with Applied Materials Inc. to develop TSMC's next-gen copper chips.
2002-10-23 Tower to produce 0.135m devices with Applied Materials
Applied Materials Inc. has received orders for chip making equipment worth more than $45 million from Tower Semiconductor Ltd.
2003-08-29 Toshiba to use Applied Materials low-k films
Toshiba has selected Applied Materials' Black Diamond and BLOk low-k dielectric films to be used for volume production of its 90nm CMOS4 process.
2009-12-11 ST chooses Applied Materials' HKMG for 28nm
HKMG is an emerging technology that allows faster switching speed while reducing device power consumption.
2005-06-08 Spansion, Applied, National join "Fab Club&quot
The Fab Owners Association, a non-profit organization set up to promote cooperative efforts between member companies and to solve common manufacturing problems, has announced that Spansion, Applied Materials and National Semiconductor have joined its ranks
2008-02-22 SOI consortium signs Applied Materials onboard
Applied Materials has joined the SOI Industry Consortium, a group aimed at accelerating silicon-on-insulator innovation into broad markets.
2005-03-21 Prepare for China fab building boom, says Applied exec
Thirty wafer fabs are set to be built in China during the next three years, most of which would use 0.25?m and 0.13?m process technologies, according to a senior executive at chip equipment maker Applied Materials Inc.
2002-03-04 Nova, Applied Materials team for copper CMP process
Nova Measuring Int. Ltd has signed a joint development agreement with Applied Materials on integrated metrology for copper CMP processing.
2003-04-21 NEC to use Applied Materials dielectric films
NEC Electronics has selected Applied Materials Inc.'s Black Diamond and BLOk (Barrier low-k) dielectric films for its UX6 chips.
2010-09-01 Micron deploys Applied Materials' E3 process control system
Micron expects E3 to improve efficiency, product quality at 300mm wafer facilities
2002-12-12 Microchip selects Applied Materials for service support
Applied Materials Inc. has announced a multi-year Total Support Package contract with Microchip Technology Inc.
2003-12-05 Meiden, Applied Materials establish center in China
Meidensha and Applied Materials have entered into a strategic relationship to provide remanufactured pre-owned chipmaking systems and related repair and maintenance services to Asia's semiconductor manufacturers.
2007-07-06 KLA, Applied face off in defect review market
Continuing on its intense competition with Applied Materials, rival KLA-Tencor is making a new bid in the defect review and classification equipment market.
2009-10-19 ITRI, Applied Materials push 3D IC dev't
Applied and ITRI will work together as members of the Stacked-System and Application Consortium
2006-01-12 Industry not ready for 450mm, says Applied
Applied Materials' president warned that the semiconductor equipment industry is not ready to move full speed ahead and develop next-gen, 450mm tools due to a funding shortfall in the overall business.
2010-11-22 Fab tool outlook mixed, says Applied CEO
Mike Splinter, chairman and CEO of Applied Materials Inc., said the company has increased its sales forecast for 2010 to between $29 billion and $30 billion.
2009-07-21 EVG, Applied ink 3D wafer bonding deal
EV Group (EVG) has partnered with Applied Materials Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in 3D IC packaging applications.
2008-06-11 Commentary: Applied's ASMI bid reads Intel
Why did Applied Materials Inc. make an unsolicited bid to acquire a chunk of ASM International NV?
2009-07-20 Applied: Innovate to keep Moore's Law alive
There is a need for new business models and alliances to optimize the utilization of IC industry resources, said Tom St. Dennis, senior VP and general manager of Applied's Silicon Systems Group
2013-09-26 Applied, Tokyo Electron to form chip mfg equipment behemoth
Applied Materials, the largest chipmaking equipment supplier, and no. 3 ranked Tokyo Electron have agreed to a merger that values the combined entity at about $29 billion.
2003-03-04 Applied, Numerical to work on litho enhancement
Applied Materials Corp. and Numerical Technologies Inc. have signed a joint development agreement for reticle enhancement technologies aimed at 193nm lithography.
2007-11-19 Applied, Elpida collaborate to raise fab productivity
Applied Materials and Elpida Memory have signed a five-year contract to utilize Applied's advanced service capabilities to reduce cost-of-ownership and improve operational efficiency at Elpida's IC fab.
2007-12-27 Applied, AMEC face off over trade secrets
Applied Materials and China fab-tool rival AMEC have agreed to disagree over a confidentially motion filed as part of a bitter legal battle between the two companies involving trade secrets.
2007-11-07 Applied's Splinter: Ecological sustainability a priority
With increased use of semiconductors in CE, chips can play a larger role in ecological sustainability, Applied Materials CEO Mike Splinter told the India Semiconductor Association.
2008-08-13 Applied wins solar service contract from Taiwan's GET
Applied Materials Inc. has signed a five-year service contract with Taiwan's Green Energy Technology Inc. of Taiwan to support its Applied SunFab Thin Film Line for solar module manufacturing.
2006-11-30 Applied to supply SMIC with 65nm capable kit
The site of Applied Materials Inc. in Rehovot, Israel, has won an order to supply Chinese foundry Semiconductor Manufacturing International Corp. with equipment for 65nm process technology fabrication.
2006-01-31 Applied to sell sites in Japan, Korea, U.S
In what appears to be a cost-cutting measure, Applied Materials said that it plans to take a charge of $212 million for selling and disposing select real estate assets.
2008-01-18 Applied to cut 7% of global workforce
Applied Materials will reduce its global workforce by approximately 1,000 positions or about 7 percent, through a combination of job elimination and attrition, as part of its global cost reduction plan.
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