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2014-12-23 Electroless copper bath improves IC substrate production
The Printoganth MV TP1 from Atotech promises to offer the highest throwing power into blind micro vias and especially into their wedges, to enable ultra-fine lines and spaces of 10/10um and below.
2013-03-26 IME consortium examines reliability of copper interconnects
The Institute of Microelectronics has launched the second phase of a research project aimed at improving reliability of semiconductor devices by tackling corrosion-related problems of copper wire bonding.
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