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2004-04-16 Zymet underfill encapsulants eyes CSP, BGA apps
Zymet has developed a reworkable underfill encapsulant that is designed for CSP and BGA encapsulation.
2004-04-21 Vate Technology to beef up its mini-BGA output
Vate Technology Corp., a testing and packaging house, is set to expand its monthly capacity for mini BGAs.
2001-06-16 UltraVia thin-film substrate for advanced BGA apps
A reliable high-routing-density substrate is needed to meet future market requirements. Thin-film build-up substrates offer unique advantages.
2003-05-05 Tyco compression contacts cut BGA electrical disturbances
Tyco Electronics' Matrix Series BGA sockets use what the company calls a compression contact technology to eliminate electrical disturbances.
2001-04-01 Solder joint reliability of BGA/CSP for mobile phones
A study of drop impact stress on solder joints verifies that stress can be checked by measuring motherboard strain, and this strain can be reduced by underfilling. This article describes the influence of drop impacts unique and common to mobile phones on the reliabilities of the BGA/CSP solder joints.
2001-04-01 Solder joint reliability of BGA/CSP for mobile phones
A study of drop impact stress on solder joints verifies that stress can be checked by measuring motherboard strain, and this strain can be reduced by underfilling. This article describes the influence of drop impacts unique and common to mobile phones on the reliabilities of the BGA/CSP solder joints.
2005-01-25 Socket preserves performance of 60W BGA devices
Ironwood has developed a new high-performance socket that enables designers to socket 60W, 1521 BGA devices without performance loss while using a minimal amount of board space.
2004-10-08 Socket combo supports 1-mm pitch, 3,528-position BGA ICs
Ironwood Electronics' new high performance BGA GHz socket combo allows 1mm pitch, 3,528-position BGA ICs to be used in socket without performance loss.
2005-07-25 Socket adapter targets BGA ICs
Ironwood launched its newest BGA socket adapter set, the LS-BGA-05 series products, that allows easy socketing of BGA ICs with different mounting configurations, and can be soldered to any through-hole pattern using conventional methods.
2010-09-02 Rugged NAND BGA available in 8GB, 16GB capacities
High-density SLC NAND solid state drive designed for high performance, reliability
2004-11-23 Replacing a PowerCap module with a reflowable BGA module
This app note demonstrates the conversion of an existing PCB design utilizing a NV SRAM PowerCap module to the equivalent NV SRAM single-piece reflowable BGA module.
2004-06-21 Replacing a powerCap module with a reflowable BGA module
This app note shows how to replace a powerCap module with a reflowable BGA module.
2003-06-27 Recommended design, Integration and Rework Guidelines for International Rectifier's iPOWIR BGA packages
This application note provides a recommended design, integration and rework guidelines for the company's iPOWIR BGA packages.
2005-02-10 Quick Lock sockets suit BGA packages
Emulation Technology has expanded its Quick Lock series to include BGA and mBGA test sockets.
2000-11-01 Profiling for successful BGA and CSP rework
This technical article discusses how to successfully profile a PCB when reworking BGA and CSPs.
2009-06-16 PCB layout recommendations for BGA packages
This application note provides a brief overview of PCB layout considerations when working with BGA packages. It outlines some of the most common problems and provides tips for avoiding them at the design stage.
2015-02-02 Optimising BGA signal routing in PCB designs
BGA packaging technology for embedded designs is steadily advancing, but signal escape routing is difficult. Know the strategies to ensure that a product is correct in terms of form, fit and function.
2014-10-08 Nikon Metrology delivers software for advanced BGA analysis
The new BGA tool provides powerful image processing, fully automated analysis and detailed reporting to inspect complex packages such as Package on Package (PoP) or dual-layered boards.
2001-06-07 Lead-free soldering for the attachment of ?BGA packages
This application note will focus on review of alternative solder alloy compositions, furnish recommendations for solder process development, and review environmental testing requirements, comparing eutectic solder to lead-free solder on a 46 I/O ?BGA package.
2005-04-22 Ironwood's 10GHz socket designed for 0.5mm pitch BGA ICs
Ironwood's new high performance socket, the SS-BGA324K-01, supports 0.5mm pitch, 12mm body, 22 x 22 array ICs without performance loss in very high-bandwidth apps.
2004-05-06 Ironwood 6.5GHz sockets support dense BGA devices
Users can socket their 0.8mm pitch, 189 ball BGA/CSP devices without performance loss with Ironwood's new 6.5GHz bandwidth sockets.
2004-02-12 IR releases power blocks in BGA packages
The iP1201 and iP1202 from International Rectifier are touted to be the industry's first dual output, two-phase dc-dc power blocks in BGA packages.
2012-10-29 Imaging BGA package at multiple depths
Understand how to come up with a slide show of acoustically visible features at increasing depths.
2002-08-28 ICSI offers ASRAMs in BGA, STSOP-1 packages
Integrated Circuit Solution Inc. has announced it has added the BGA and STSOP-1 package types to its 1Mb ASRAM products designed for use in wireless LAN applications.
2006-07-25 Heat sinks cool BGA components
Advanced Thermal Solutions has introduced a low-profile, high-performance heat sink designed for cooling BGA components in low airflow velocity conditions.
2007-03-12 Four- and six-layer, high-speed PCB design for the Spartan-3E FT256 BGA package
This application note addresses low-cost, four- to six-layer, high-volume PCB layout for a Spartan-3E FPGA in the FT256 1mm BGA package. The impact of highspeed signals and signal integrity (SI) considerations for low layer count PCB layouts is also reviewed. This application note is intended for design engineers, managers and PCB layout staff, who are already familiar with SI related design issues. It focuses on the Spartan-3E device in the FT256 package, but the information applies to the equivalent FG256 package, and the general guidelines can be used to optimize board layout for other devices and packages.
2002-09-25 FCI licenses BGA technology to Molex
FCI Asia Pte Ltd has granted Molex Inc. specific rights to utilize its BGA connector attachment technology to microprocessor sockets.
2002-08-27 FCI licenses BGA technology to Molex
FCI has agreed to license its BGA connector attachment technology to Molex Inc.
2002-07-30 Fairchild MOSFETs offered in BGA packaging
Fairchild Semiconductor has released a dual n-channel and p-channel MOSFETs with physical and electrical performance that make them suitable for Li-ion battery pack protection.
2003-02-06 Emulation Tech BGA adapter allows double duty
Emulation Technology's BGA socket emulator adapter converts a BGA production socket into an emulator adapter.
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