Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > CFD

CFD Search results

total search14 articles
2004-11-29 Upgraded tool speeds IC package analysis
Fluent's new offering may help prevent some of the packaging problems that have come to plague PCB designers.
2001-06-16 Two mysteries of PCB thermal analysis
The article addresses two of the mysteries of thermal analysis: power dissipation and thermal boundary conditions.
2014-02-26 Significance of LED thermal characterisation
Learn how improving the thermal characterisation of LEDs will help to spur on the LED lighting revolution.
2015-07-09 Manage thermal optimisation during PCB design
Learn about the development in computational fluid dynamics technology, which allows modifications to the thermal model, and thus frees up valuable engineering time for higher value activities.
2012-09-12 Future Facilities, Intel to feature server embedded thermal sensors
According to the companies, the technology will provide real-time power, airflow and CPU-utilization data to enable effective CFD analysis and IT load capacity planning and optimization.
2003-02-18 CFDRC licenses Simmetrix simulation modeling suite
CFD Research Corp. has licensed several modules of Simmetrix Inc.'s simulation modeling suite.
2006-09-27 CFA approves CF+, CompactFlash Revision 4.0
The CompactFlash Association announced the approval and availability of the CF+ and CompactFlash Specification Revision 4.0.
2014-06-10 Path Finder streamlines IC packaging across multiple PCBs
The suite features a path-finding methodology that automates optimisation and connectivity from a chip through multiple packaging variables, while targeting multiple and different PCB platforms.
2013-05-14 Lloyd's Register , A*STAR IHPC set up joint lab
The joint laboratory aims to deliver innovative technological solutions to address the challenges faced by the marine, energy and offshore sectors.
2012-10-08 How to turn waste heat into electrical energy
Here's a look at a device designed to generate multiple watts of power by turning waste heat from industrial piping into electrical energy.
2010-08-19 Film deposition technology for sub-32nm
Novellus Systems has announced its development of conformal film deposition technology for depositing 100 percent step coverage dielectric films on structures with aspect ratios of up to 4:1, a solution to sub-32nm requirements.
2008-10-14 Comment: Mentor adopts a better strategy
I have been very excited by Mentor Graphics Corp.'s acquisition of Flomerics because it represents the first time that a traditional EDA vendor has recognized and acted upon a system that is more than simply the electronic components.
2014-10-17 Boost thermal management of electronic systems
Find out how accurate compact thermal models of three-die power packages can be used to improve the thermal management of electronic systems.
2007-06-18 Applying CTMs on FPGA-based devices
This article discusses better ways to predict temperature for these faster and denser FPGA components in a system environment.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top