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2002-05-20 Virage Logic to supply embedded memories to UMC
Virage Logic will supply embedded memories for UMC's 0.135m MPU CMOS logic process that utilizes phase-shifting technology from Numerical Technologies Inc. to generate 70nm transistor gates.
2005-03-09 UMC makes Virage embedded memories using 0.18?m process
United Microelectronics Corp. (UMC) and Virage Logic Corp. have announced the availability of Virage Logic's patented non-volatile electrically alterable (NOVeA) embedded memories for production on UMC's 0.18?m CMOS logic process.
2012-09-28 ReRAM in 28nm logic process piques TSMC's interest
A research team from National Tsing-Hua University found that a contact RRAM (CRRAM) cell has been realised in a HKMG 28-nm CMOS logic process without the use of any additional masking or process steps.
2005-02-02 Realtek highlights UWB CMOS RFIC transceiver
Realtek Semiconductor Corp. has developed a compact low-power CMOS RFIC transceiver for ultra-wideband (UWB) applications
2013-02-21 Globalfoundries bolsters 55nm CMOS logic process
Globalfoundries enhanced their 55nm LPe 1V, a 55nm Low-Power Enhanced process technology platform, with qualified, next-generation memory and logic IP solutions from ARM
2004-01-14 Europe plans mega funding for nano CMOS
The European Commission (EC) has approved the first phase of a proposed multiyear collaborative research program to advance CMOS beyond the 45nm node
2009-03-27 110nm CMOS squeezes extra die per wafer
Silterra Malaysia Sdn. Bhd. has debuted a foundry-compatible copper-based 110nm CMOS logic process technology. Codenamed CL110G, the technology offers a 10 percent optical shrink for the copper-based 130nm and enables customers to squeeze extra die per wafer.
2002-04-05 Virage Logic embedded RAM employs standard logic process
Manufactured using TSMC's 0.18?m CMOS process, the Novea RAM embedded memory from Virage Logic Corp. is claimed to be the first commercially-available non-volatile embedded memory manufactured using a standard logic process.
2007-01-26 TI exits 45nm process race
Texas Instruments Inc. (TI) has decided to drop the costly business of digital logic process development and rely on foundry partners for its processes
2005-09-16 Silicon germanium process heralds fast RF
Commodity RF ICs may ride to unheard-of frequencies on the strength of a new SiGe BiCMOS process
2014-03-07 Silicon Basis lowers SRAM power via standard logic
Silicon Basis built its SRAM on a standard logic process, directing the memory to source power from the logic's voltage source
2005-05-26 Samsung licenses foundry process design tools from IBM, Chartered
Samsung Electronics Co. Ltd has licensed the 90nm "common design enablement technology" utilized by IBM and Chartered, Chartered said.
2004-04-21 PolarFab offers new robust BCD process
PolarFab now offers a BCD process that permits designers to fabricate analog and mixed-signal integrated circuits operating up to 60V
2002-09-20 ON Semiconductor logic ICs exhibit 3.6ns delay
Th ALVC and ALVCH series of CMOS logic devices exhibit a maximum delay of 3.6ns at 3V, making them suitable for high-speed applications in portable and desktop PCs, video display products, and networking
2007-04-02 Next-gen chips bridge design, process
Morris Chang of TSMC cites two strategies foundries need to develop to remain profitable in the CE era.
2014-08-06 MEMS treads logic road
The difference between MEMS and logic, and the reason for the continued control of the IDM in the MEMS domain, is that MEMS manufacturing process is fundamentally linked to design possibilities
2007-02-01 Logic chipmakers seek 32nm breakthroughs
Even as they put the finishing touches on their 45nm process technologies and tweak them for low power, leading-edge logic chipmakers are scrambling to find manufacturing breakthroughs for the 32nm node and beyond
2012-09-05 IBM, STM to create NEMS-based logic process
The goal of NEMIAC project is to develop a logic process based on nanometer-scale relays suited for embedded systems and allowing 3-D integration with CMOS.
2005-03-24 eMemory's Neobit uses pure CMOS devices as cell element
eMemory disclosed that it has made available the technology of 0.13?m Neobit programmable embedded non-volatile memory in logic process, which is advanced to higher level through low-k copper process
2011-06-28 28nm CMOS supports WLAN, Bluetooth
RFaxis rolls out its 28nm CMOS silicon multiband/multimode RF Front-end IC that supports WLAN and Bluetooth
2004-02-20 Virage to support DongbuAnam 0.13?m CMOS processes
DongbuAnam Semiconductor and Virage Logic Corp. have entered into a licensing and royalty-bearing agreement that provides for the delivery of Virage Logic's technology-optimized platforms for DongbuAnam's new 0.13?m CMOS processes
2012-08-21 Utilize wafer-scale CMOS X-ray imaging for medical apps
This imaging technology can bring key advantages in terms of performance such as high resolution, high dynamic range and low noise capabilities.
2009-12-18 TSMC unveils BCD process for LED drivers
The new technologies feature a voltage spectrum running from 12V to 60V to support multiple LED applications.
2013-05-29 TowerJazz enlists Crocus for MLU process
Crocus will make its MLU blocks, including magnetic sensors and secure embedded memories, available to TowerJazz customers for integration into their SoC designs.
2011-08-08 Tower moves SBL13 process to Israel
Specialty foundry Tower has decided to move its SBL13 process to Israel, giving way to development of their SiGe technology and sourcing capability for customers
2002-04-23 Toshiba logic ICs extend operating voltage to 1.2V
Designed to extend the battery life of portable devices, Toshiba Corp. has announced that its VCX logic family will be supporting operating voltages down to 1.2V, making them the first member of the Low Voltage Logic Alliance (LVLA) to offer a voltage range of 1.2V to 3.6V for logic devices, while maintaining the specifications set by the LVLA
2003-12-11 TI's SETMOS said to extend CMOS life
Texas Instruments Inc., together with researchers at the Swiss Federal Institute of Technology of Lausanne and the U.S Air Force Research Laboratory, have described a potential way to use single electron transistors (SETs) to perform logic functions
2012-06-15 TI describes 28nm CMOS TSV integration
A paper by TI researchers showed results indicating minimal effect on transistors within 4 microns of TSV placement.
2008-02-07 TI bares details of 45nm process
TI has revealed that its 45nm process uses strained silicon, immersion lithography and ultra-low k dielectrics to lower power and increase performance compared with its 65nm process, and double the number of chips produced on each 45nm silicon wafer
2012-07-04 The CMOS-mobile apps connection
The two biggest markets for logic chips are, of course, mobile (smartphone and tablet) and PC devices. These markets are now steering the technology direction and defining the winners and losers
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