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2002-08-22 Tower Semiconductor adopts PDF Solution technology
PDF Solutions Inc. has partnered with Tower Semiconductor Ltd on a program to enhance the yield and performance of 0.185m CMOS process technology at Tower's Fab 2.
2002-09-30 Tower licenses Motorola CMOS technology
Tower Semiconductor Ltd and Motorola's Semiconductor Products Sector have entered into an agreement for the technology transfer and licensing of 0.135m CMOS process technology.
2002-12-05 Toshiba, Sony announce breakthrough in IC process
Toshiba Corp. and Sony Corp. have announced that they have jointly developed a 65nm CMOS process technology for embedded DRAM system LSIs.
2008-06-23 Toshiba compact model ups gate density in 45nm CMOS
Toshiba Corp. has developed a new compact model for circuit design that achieves higher gate density and improved cost-performance in next-generation 45nm CMOS technology
2008-06-20 TI to boost use of proprietary process, fabs
Texas Instruments is not joining bandwagon of IC vendors shedding manufacturing facilities but would, instead, make increased use of proprietary process technologies and fabs, at least in the analog sector
2011-06-20 The suitable IC for medical devices: Bipolar or CMOS
Here's a comparison of bipolar and CMOS devices to help you decide where each is applicable
2004-05-31 Tech coalition develops ultra-thin CMOS process technology
STMicroelectronics, CEA-Leti and Aixtron have developed an advanced process technology for the creation of ultra-thin transistor-gate-insulation layers for low-power applications at the 65nm and 45nm CMOS transistor technology nodes.
2009-05-19 ST, Soitec co-develop BSI tech for CMOS image sensors
STMicroelectronics and Soitec have entered an exclusive joint cooperation to develop of 300mm wafer-level backside-illumination (BSI) technology for next-generation image sensors in consumer products
2007-01-29 ST to import CMOS, change Crolles function
STMicroelectronics CEO Carlo Bozotti told analysts that the company would align with "industry leaders" to obtain a 32nm CMOS process for use in its wafer fabs
2002-08-26 SMIC launches 8-inch wafers using 0.185m process
Semiconductor Mfg Int. Corp. has commenced production of its 8-inch wafers using 0.185m process
2005-01-19 Silterra adopts HPL IP to speed 0.13?m CMOS process
Silterra Malaysia Sdn. Bhd and HPL Technologies Inc. revealed that their collaborative work has been instrumental in reducing the development and debug time for Silterra's new 0.13?m CMOS process technology.
2011-06-30 NVM solution targets 180nm process tech
Aimed at wireless, RFID, and analog and mixed-signal SoC designs, the DesignWare AEON NVM IP is implemented in standard CMOS process technology with no additional mask or process steps required.
2002-09-27 Motorola to transfer 0.135m process to Tower
Motorola Inc.'s Semiconductor Products Sector will transfer its copper 0.135m CMOS process technology to Israel's Tower Semiconductor Ltd. as part of a technology transfer deal.
2013-07-24 MagnaChip, NNFC reach technology transfer agreement
The technology agreement transfers 0.18?m SOI RF CMOS process technology to MagnaChip, a technology optimised for use in RF switches and antenna tuning applications.
2005-02-09 Kilopass, Tower ink foundry technology deal
Kilopass Technology Inc., a provider of semiconductor non-volatile memory (NVM) IP for standard CMOS logic, has signed a foundry technology agreement with Tower Semiconductor Ltd
2016-02-03 Intel exec sees huge potential for Moore's Law post-CMOS
William Holt, GM of Intel's technology and manufacturing group, said the industry needs to keep a focus on keeping power down and reducing cost per transistor
2007-02-16 Integrate RF signal chains with CMOS
Different technology challenges face handset designers and their suppliers in the race to integrate the RF signal chain
2007-03-29 Infineon licenses 130nm CMOS tech to HSMC
Infineon Technologies has signed a memorandum of understanding with startup Hindustan Semiconductor Manufacturing Corp. to license its 130nm CMOS process technology.
2002-11-13 Infineon develops 40Gbps RF CMOS ICs
Infineon Technologies' mux/demux chipset is manufactured using a 0.13?m CMOS process and achieves a transmission rate of up to 40Gbps
2007-04-24 IBM-austriamicro project zeroes in on HV process
IBM and austriamicrosystems will jointly develop a high-voltage (HV) CMOS process technology to be used in a range of consumer, automotive, industrial and medical applications.
2008-02-07 Fujitsu debuts 77GHz CMOS-based power amp
Fujitsu Laboratories has developed a 77GHz millimeter-waveband power amp using standard 90nm CMOS process technology.
2005-07-01 First CMOS single-chip RF transceiver for UMTS applications
The SMARTi 3G transceiver from Infineon Technologies AG is claimed to be the world's first CMOS single-chip RF transceiver specifically developed for Universal Mobile Telecommunications System (UMTS) applications. This new chip supports all six frequency bands for UMTS now specified for operation in different parts of the world, including Europe, Asia, North America and Japan
2006-06-08 CMOS process tech features high-density EEPROM
Atmel announced the AT35700 high-voltage process technology with double-poly, high-density EEPROM for IC foundry customers
2007-09-04 Chartered teams with university on nanoscale CMOS R&D
Chartered and Singapore's Nanyang Technological University announced the opening of a joint R&D laboratory focused on nanoscale CMOS process technology and reliability.
2005-11-14 Atmel announces new 0.18?m RF CMOS process
Atmel Corp. announced its 0.18?m AT58900 RF CMOS process technology.
2004-12-06 Agilent proves 6.25Gbps serdes core in 90nm process
Agilent Technologies Inc. has announced that it has validated its third-generation SerDes core in a 90nm CMOS process technology, making it possible for OEMs to embed as many SerDes channels (each operating at up to 6.25Gbps) as needed onto a single ASIC chip.
2009-02-06 A/D technology is ultrafast
Fujitsu Microelectronics Europe's new ultrafast ADC IP is based on CHArge-mode Interleaved Sampler technology (CHAIS) for use in its standard 65nm CMOS process technology.
2009-03-27 110nm CMOS squeezes extra die per wafer
Silterra Malaysia Sdn. Bhd. has debuted a foundry-compatible copper-based 110nm CMOS logic process technology. Codenamed CL110G, the technology offers a 10 percent optical shrink for the copper-based 130nm and enables customers to squeeze extra die per wafer.
2008-09-05 X-Fab Sarawak all set to start 0.35?m process tech
X-Fab Silicon Foundries' Malaysian facility in Kuching, Sarawak, with its 200mm production line, now is fully qualified for volume production and second sourcing of the company's 0.35?m high-voltage process technology called XH035
2002-01-21 X-FAB adds new mixed-signal technology to its CMOS process platform
X-FAB Semiconductor Foundries AG has added a new mixed-signal technology called XC06 high-voltage process to its 0.65m mixed-signal CMOS process platform.
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