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2004-11-16 Zoran rolls out co-processor for feature-rich cellphones
Zoran rolled out last week a new co-processor for feature-rich cellphones.
2002-11-12 Xilinx, AMCC co-develop reference platform
Xilinx Inc. and Applied Micro Circuits Corp. have introduced the AMCC reference platform.
2010-07-06 WiSpry, IBM co-develop tunable RF MEMS
WiSpry Inc. and IBM are collaborating to develop MEMS process technology and manufacture its tunable RF product roadmap.
2008-05-22 Wind River, Intel co-develop automotive open source platform
Wind River Systems is collaborating with Intel Corp. to create an open source Linux platform for the automotive industry.
2011-07-15 Universal programmer integrates Vector Engine co-processor
BPM Microsystems will unveil an addition to its family of device programmers that boasts industry-topping speed and universal device support.
2006-10-05 UMC, IME co-develop RF modeling for 90nm
United Microelectronics Corp. have partnered with Singapore's Institute of Microelectronics to jointly develop RF modeling solutions for 90nm technologies.
2003-06-03 UMC, Artisan co-develop PCI-Express PHY core
Semiconductor foundry UMC and Artisan Components Inc. have agreed upon a long-term IP collaboration focused on the development of a PCI-Express PHY IP core for UMC's 0.13?m chip designs.
2002-11-22 Tyco, Valence to co-develop Li-on telecom battery
Tyco Electronics Power Systems Inc. and Valence Technology Inc. have collaborated to evaluate and develop Valence's Saphion Li-on technology as a standby power solution for the telecommunications industry.
2003-07-29 Two companies co-develop optical transmission system
Fuji Photo Film Co. Ltd and Fuji Xerox Co. Ltd have developed a commercialized high-speed optical transmission system.
2013-10-11 TU Delft, Imec co-author test flow for 3D IC optimisation
3D-COSTAR aims to optimise the test flow of 3D stacked ICs by compiling the yields and costs of design, manufacturing packaging and logistics.
2003-06-09 TT electronics, BAE co-develop next-gen sensors
TT electronics plc has formed a strategic partnership with BAE Systems, to jointly develop and manufacture next-gen automotive sensor modules.
2009-05-08 Trio to co-develop NAND controllers
Hynix Semiconductor Inc, Numonyx B.V. and Phison Electronics Corp. have signed a collaboration agreement to jointly develop controllers for the next generation of managed-NAND solutions based on the newly released JEDEC eMMC 4.4 industry specification.
2004-04-01 Transaction-based method supports co-verification
This paper describes how engineers doing SoC verification can be more efficient by using a single, reconfigurable verification system, applications and a unified methodology.
2004-04-01 Transaction-based method supports co-verification
This paper describes how engineers doing SoC verification can be more efficient by using a single, reconfigurable verification system, applications and a unified methodology.
2003-06-13 Toshiba, SanDisk co-develop NAND cell architecture
Toshiba and SanDisk have announced the development of a high density NAND flash memory cell structure that allows fabrication of 4Gb NAND flash devices.
2003-02-03 Toshiba, Elixent to co-develop reconfigurable SoCs
Elixent Ltd and Toshiba Corp. have agreed to jointly develop a SoC platform that integrates Elixent's D-Fabrix reconfigurable algorithm processing array with Toshiba's MeP configurable processor core.
2008-06-17 Toshiba doubles 2025 CO2 emission reduction target
Toshiba Corp. has revised its goal to contribute to global CO2 emission reductions that more than doubles its initial target and takes it up to 117.7 million tons a year by 2025.
2003-01-23 TI, SLE to co-develop complex ASICs for high-end markets
Texas Instruments Inc. and Silicon Logic Engineering Inc. have agreed to jointly develop complex ASICs for TI customers in the wireless/wireline infrastructure and computing markets.
2006-10-19 TI, Mistral Software co-develop virtual CD changer ref design
Texas Instruments Inc. and Mistral Software Ltd are launching a virtual CD changer (VCDC) reference design for next-generation A/V applications.
2006-09-25 TI, ADEL co-develop fingerprint ID processor
Shenzhen IDEAL Microelectronics Co. Ltd and Texas Instruments Inc. announced that they have jointly developed fingerprint identification processor ramped to volume production.
2014-08-06 Things unsaid about the new Fujitsu-Panasonic Co.
The announcement last week revealed a few details of the new fabless chip companyincluding its CEO, its ratio of voting rights, and the number of employees.
2003-11-20 TEL, Clariant co-establish unique suppression process
Tokyo Electron Ltd has announced that it will begin sales of a process resulting from joint development with Clariant KK.
2002-12-11 Tegal, STMicroelectronics co-develop etch process
Tegal Corp. has completed the first phase of a joint development project with IC manufacturer STMicroelectronics.
2008-09-30 Tech groups explore co-polymer lithography
Several entities including IBM Corp. and Intel Corp. are looking into a new technology called co-polymer lithography in an effort to extend Moore's Law.
2015-12-03 Tech co.'s enable interactive content delivery in Jakarta's taxis
Microsoft, NEC, Intel and Acer products and services have come together in an interactive taxi entertainment system in Jakarta. The interactivity feature is claimed to be the first of its kind in Asia.
2007-12-24 Synthetic fuel recipe mixes reclaimed CO2, water, sunlight
Sandia National Laboratories of the U.S. Department of Energy is building a reactor that would use reclaimed carbon dioxide emissions to create renewable synthetic fuel by combining the CO2 with water.
2007-11-09 Synopsys, UMC co-develop 65nm reference flow
Synopsys and UMC have co-developed a 65nm hierarchical, multivoltage RTL-to-GDSII reference design flow.
2006-09-22 Synopsys, Nikon co-develop 45nm solutions
Synopsys and Nikon have tied up to develop and deliver advanced lithography software models and DFM-enabled lithography manufacturing solutions for 45nm and below.
2004-06-24 Synopsys tips system-level co-verification
Synopsys Inc. and embedded virtual-platform startup Virtio are jointly developing a system-level hardware-software co-verification solution that will allow designers to work from correlated models, the companies said.
2012-05-25 Synopsys assigns co-CEO to current CEO de Geus
Synopsys promoted Chi-Foon Chan as co-CEO and will share the responsibility of managing the company with Aart de Geus.
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