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2007-11-22 CEVA, ROHM co-develop Bluetooth 2.0+EDR ref design
CEVA Inc. and ROHM Co. Ltd have partnered to offer a complete reference design platform for Bluetooth 2.0+EDR
2009-06-01 CEVA, mimoOn team on LTE baseband solution
CEVA Inc. and mimoOn GmbH have partnered to offer mimoOn's mi!MobilePHY advanced LTE software on CEVA's newest DSP core, the CEVA-XC
2010-02-17 ArrayComm, CEVA co-develop LTE solution
ArrayComm LLC and CEVA Inc. will work toward the implementation of ArrayComm's full LTE eNodeB PHY on the CEVA-XC DSP core
2009-06-09 Analysis: How CEVA defies economic crunch
Despite the current economic downturn, DSP core intellectual property supplier, CEVA Inc. has a story with a happyand surprisingending
2009-02-13 DSP architecture aims at 4G
Ceva Inc. has started sampling to select customers CEVA-XC, the programmable DSP architecture that supports full transceiver processing for multiple air interfaces in software, targeting 4G terminals and infrastructure.
2012-02-16 SDK targets multimode software-based modems
The CEVA-XC323 DSP enables real-time application software development and system verification for LTE, LTE-Advanced, HSPA+, TD-SCDMA, WiFi and DTV demodulation
2008-09-08 Analyst expects more 3G baseband tie-ups
Further consolidation is expected among suppliers of UMTS/HSPA baseband chips. However, the possibilities are limited with Infineon and Icera now the only independent sources for the parts, aside from Qualcomm.
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