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2007-01-15 Xilinx puts up R&D team in Singapore
To assist in the development of its next-generation 45nm platform FPGA family, Xilinx Inc. has established an R&D team in its Asia-Pacific headquarters
2008-02-06 Will EUV litho ever cross over from R&D to production
The procurement of an R&D EUV lithography tool from Nikon has reportedly been put off by Intel, raising more questions about the viability of EUV for mass chip production.
2005-07-07 Vitesse to set up R&D in Hyderabad, India
Vitesse Semiconductor Corp. (Camarillo, Calif.), a vendor of high-speed interface chips, is to set up an Indian subsidiary firm, Vitesse Semiconductor (India) Pvt. Ltd, to conduct chip R&D at its center in Hyderabad.
2008-10-10 SEMI implores EU initiatives to boost chip market
Amid the seemingly dwindling role of Europe in the global IC industry, SEMI industry association urges initiatives from the EU and the national governments to promote the region's chip industry
2006-03-31 Japan reloads chip R&D effort
Japan's semiconductor industry is launching a renewed five-year R&D effort dubbed the Asuka II Project focusing on 45nm and 32nm technologies
2006-05-16 Japan extends chip R&D
The Japan Semiconductor Industry Association has launched its Asuka II project, a new five-year effort to build chips in geometries as fine as 32nm.
2008-07-17 Is chip R&D facing a dead end?
The IC industry still pours billions of dollars annually into R&D. But in recent years, as costs have skyrocketed, chipmakers have been outsourcing more of their R&D requirements to consortia, silicon foundries and third-party vendors
2011-09-30 Intel, IBM invest $4.4B in R&D facility
Intel and IBM are leading the development of a chip R&D center in New York that focuses on next-generation ICs and process technologies.
2007-02-19 Intel's 80-core chip crunches 1Tflop at 3.2GHz
Intel's 80-core chip crunches 1 trillion flops when running at a 3.2GHz clock speed and consumes 62W, to yield a record 16Gflops/W
2004-11-19 Fairchild establishes chip R&D labs in China
Fairchild Semiconductor has signed a strategic agreement with Tsinghua University in Beijing, China.
2008-09-01 Chip R&D treads shaky ground
Amid continued debate on whether semiconductor R&D is an endangered species or is successfully evolving to adapt to changing realities, Intermolecular Inc. and Semiconductor Research Corp. braved the debacle, with each announcing their own R&D initiatives. Intermolecular reported on a memory R&D pilot line, while SRC described emerging programs in analog, energy, medical and multicore
2013-02-08 Chip R&D spending beats weak market with 7% growth
IC Insights revealed that semiconductor firms' R&D spending reached $53 billion last year that climbed to 16.7 per cent of total semiconductor sales
2009-02-04 Analysis: What's in store for IBM's chip unit
IBM Corp.'s recent move to implement job cuts within its semiconductor unit follows a dramatic slump in sales, product setbacks and numerous false starts in the sector.
2013-03-19 ZTE spent over $1B for R&D in 2012
Chinese telecom firm ZTE has shelled out more than $4 billion in R&D over the past four years, spending heavily on cross-licensing IP
2008-10-31 Ziptronix heralds 3-D chip stacking technique
Ziptronix unveiled details of its patented Direct Bond Interconnect (DBI) technology, which employs a low-temperature process for 3-D chip stacking without thermal compression
2012-12-24 XLamp MK-R breaks 200 lumen LED barrier
Cree's latest product line leverages the the SC3 Technology next-generation LED platform to deliver up to 200 lumens-per-watt (at 1 W, 25C) LEDs.
2009-03-11 Xi'an HTDZ rises as China's R&D hotbed
Having pinned many of its plans for industrial transformation on its electronics and information technology industries, China has become an R&D hotbed among domestic and foreign companies alike
2008-08-13 World's first 3D chip technology surfaces
The world's first 3D chip process is ready for licensing from the fabless semiconductor design house BeSang
2005-12-05 Wirewound chip inductors pack performance in small package
Taiyo Yuden offers a new wirewound chip inductor series that is said to simplify designs, reduce part count and lower BOM costs by combining two devices into a single 3218-size package
2003-04-16 WEDC Flash memory offers simultaneous R/W operation
The W72M64XV-XBX 2Mx64, 3.3V Flash memory device from White Electronic Designs Corp. allows simultaneous R/W operation
2005-08-16 Water-filled wafers streamline chip cooling
Researchers develop a chip-cooling process that hopes to replace bulky, bolt-on metal towers used in microprocessors
2013-07-29 Vishay Precision Group debuts foil resistor flip-chip
VPG's FRFC 0805 ultra-high-precision Z1-Foil flip-chip resistor noise-free and provides ESD protection of 25kV or more for increased reliability
2003-02-05 Vishay chip resistors provide tight tolerance
Vishay Intertechnology has announced a new family of commercial thin-film chip resistors intended for measurement and control apps
2014-05-05 Vietnam R&D centres produce MEMS pressure sensor
The pressure sensor chip fabricated using MEMS technology is the first of its kind in the country, embodying years of collaborative work between two local R&D centres. Integrated with an SG V8-01 MCU, the chip can be customised to meet size and measurement requirements in applications including water measurement and storage.
2008-03-03 Ultralow-cost phones ring in chip opportunities
The growth of the ULC handset market is changing the dynamics of the handset business. Traditionally, a handset manufacturer would rely exclusively on one vendor to supply chips for all its phones but ULC phones are changing this model.
2011-12-15 TSMC pushes thru with 3D chip
The semicon firm claims its approach will be simpler, cheaper and more reliable, focusing on creating TSVs early in the process, then adding packaging capabilities to its fabs.
2007-06-04 TSMC partners with foundry R&D firm
TSMC is collaborating with R&D foundry SVTC Technologies in an attempt to fast-track new ideas in chip design and manufacturing from concept through to mass production.
2011-01-18 TSMC is among chip industry's biggest R&D spenders in 2010
TSMC has joined the ranks of the semiconductor industry's top R&D spenders in 2010. Analysts attribute TSMC's increased R&D spending to the success of the fabless-foundry model and the increase in IDMs migrating to fab-lite models
2011-04-11 TSMC enters chip-packaging arena
TSMC will soon open a bumping facility and offer silicon interposers and TSV technologies for 3D chips, but will remain focused on the foundry market and will not compete against subcontractors.
2010-11-23 True single-chip motor controller integrates digital, analog and power
High-performing motor drives for equipment may now be realized more quickly, utilizing a complete motor-control system on a chip designed by STMicroelectronics. The 'digital SPIN', or dSPIN, integrates all the necessary digital control, analog measurement, and power electronic circuitry for controlling stepper motors using ST's advanced BCD fabrication process
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