Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > Clear Shape

Clear Shape Search results

?
?
total search90 articles
2007-01-19 Clear Shape, STARC to develop DFM flow
Clear Shape Technologies Inc. announced a partnership with STARC to jointly develop, validate and deploy a variability-aware DFM flow.
2006-11-28 Clear Shape solution promises fast DFM hotspot detection
Clear Shape Technologies has announced InShape, said to be the first model-based full-chip Design Manufacturability Checker that predicts accurate silicon shapes, providing designers the ability to do fast, accurate DFM hotspot detection of catastrophic failures.
2006-12-04 Clear Shape offers electrical DFM analysis solution
Clear Shape Technologies has announced OutPerform, said to be the first complete and silicon-correlated electrical DFM analysis and optimization product to enable designers using sub-90nm processes to control the impact of lithography, mask, etch, RET, OPC and CMP effects on their chip parameters.
2007-08-21 Cadence acquires DFM firm Clear Shape
Cadence Design has acquired Clear Shape Technologies, a design for manufacturing technology firm specializing in design-side solutions to minimize yield loss for advanced semiconductor ICs.
2002-10-16 Smart-phone vision slowly taking shape
Samsung's licensing of Series 60 software from Nokia may have a profound impact on the future of data-centric cellphones.
2014-06-30 NV memory: Significance of filament size and shape
Many presenters in VLSI 2014 are seeking to improve performance and increase the understanding of ReRAM/RRAM operation. However, there is still no clear winner when it comes to material or memory type
2008-05-30 Mature devices shape Rolly's dancing feet
The Consumer Electronics Show in January was rocked by the "dancing" MP3 playerSony Rolly.
2014-04-22 FPGAs must shape up to accelerate growth
The rocketing ASIC mask-set and NRE costs have not yielded a surge of FPGA designs, but have rather driven engineers to resort to older technology nodes to mitigate the cost issues. Considering this and the standing Moore's Law concern, the FPGA outlook does not appear so bright.
2005-12-01 Manufacturing moves into design flow
null
2007-02-27 EDA 'troublemakers' debate at DVCon
Confronted with provocative questions, DVCon EDA vendor representatives debated topics such as low-power standards, Cadence Design Systems' Skill language, and outsourcing to India.
2011-04-07 See through force sensing material for touchscreens
The QTC Clear force sensing material developed by Peratech aims to replace current resistive touch screen technologies or enhance capacitive ones to create solutions with more features such as 3D input
2005-06-13 Intel, KLA-Tencor back DFM startup
The world's largest semiconductor manufacturer and one of the largest semiconductor equipment manufacturers have taken interest-and financial positions-in Clear Shape Technologies Inc., a design-for-manufacture (DFM) software startup.
2008-10-24 Analysis: NXP strives to survive lashes of economic downfall
NXP Semiconductors officials would be the first to admit that the automotive and multimarket IC vendor is in rather poor shape
2014-07-30 Accelerate ADAS dev't with radar signal analysis
Radar allows fast and clear-cut measurement of the velocity and distance of multiple objects under any weather conditions, making it an enabling solution for automated driving
2007-07-16 TSMC pulls curtains off 45nm design process
Taiwan Semiconductor Manufacturing Co. Ltd unveiled its latest and most ambitious design methodology for IC production at the challenging 45nm node.
2007-07-23 Reconfigurable logic IP rolls for 65nm, 45nm nodes
Lightspeed Logic tips a new generation of its Reconfigurable Logic IP for the 65nm and 45nm process nodes.
2007-06-01 IC designers favor less complex DFM
During the IEEE Electronic Design Process workshop, IC design experts point out that current approaches to design-for-manufacturing (DFM) may be yielding too little for the amount of effort and cost involved.
2006-11-22 EDA panel to discuss business in India
With the goal of providing an overview of the pitfalls and opportunities of doing business in India today, the EDAC and Silicon Valley Bank are co-sponsoring a panel on "How to do business in India."
2007-02-16 EDA growth to continue this year
The EDA industry grew faster than expected in 2006 and is up for another good year, thanks to a healthy IC industry, an insatiable CE market and a move to 65nm and 45nm technologies.
2006-12-18 Visionary sees rich opportunities in multicore
Intel Corp.'s chief technology officer, Justin Rattner talked about Intel's embrace of the multicore solution and its impact on the current computing platform.
2016-03-21 TSMC unveils silicon plans
TSMC will enable silicon interposers larger than 1,200mm21.5x the reticle sizeat 7nm to enable giant 2.5-D stacks of logic and memory for the next gen of Cowos- chip on wafer on substrate.
2012-07-04 The CMOS-mobile apps connection
The two biggest markets for logic chips are, of course, mobile (smartphone and tablet) and PC devices. These markets are now steering the technology direction and defining the winners and losers.
2014-05-02 Thailand faces hurdles in boosting engineering competency
Not enough graduating engineers are entering the technical workforce in Thailand because industry focus is mostly on low-value-added manufacturing, which is thwarting the country's efforts to expand its economy.
2012-10-23 TCAD eases FinFET design and variability analysis
FinFET is the first fundamental change in transistor architecture since the time MOSFET replaced bipolar transistor as the transistor of choice for logic applications.
2007-07-02 Tap capacitive sensor UI in next-gen CE devices
A more efficient and reliable alternative to resistive touchscreens is a thin, transparent, capacitive sensor touchscreen that embedded users can place over any viewable surface for input and navigation.
2003-03-14 Taking a different road to the same destination
Professor Shin Dong-Wook of Hanyang University changed his career to teaching so that he can do more creative research into optical communication.
2011-06-15 Study shows global attitudes, approaches to cloud computing
AMD's global study reveals that while cloud computing is maturing rapidly, adopters have radically different attitudes, approaches, concerns and maturity levels depending on business environment.
2005-07-01 Stirring Intel through wireless territory
Kevin Kahn tells how the evolution of transistor density from thousands to billions exemplifies Intel's growth.
2004-12-15 Spectrum analyzer spans time, frequency, modulation domains simultaneously
Tektronix's new RSA3408A spectrum analyzer debuts at a time when RF systems are racing up the curve in complexity and scope.
2013-03-22 Space and time trade-offs in advanced computing
Here's an examination of real world trade-offs of time and space, and their impact on our modern mobile computing model. Along the way, we touch on relativistic physics, computer science and science fiction, all in an entertaining and informative look at the continuum.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top