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2002-06-13 Malibu Technologies to utilize Cookson's stencil printer
Malibu Technologies, a manufacturer of advanced avionic systems, has selected Cookson Electronics Equipment's MPM AccuFlex stencil printer for its production line.
2002-08-29 GlobalTRONICS 2002 to highlight Asian electronics future
GlobalTRONICS 2002 will be held on September 3 - 6, 2002, at the Singapore Expo Hall.
2006-07-10 Cookson, Microbonds to align technology roadmaps
Cookson Electronics and Microbonds partner to align the technology roadmaps of Microbonds' insulated wire bonding technology with Cookson's molding compounds.
2003-07-31 Cookson restructures product portfolio
Cookson Electronics Group has announced that it is exiting and selling its equipment business.
2003-08-13 Cookson obtains licenses for GE laminates
Cookson Electronics Inc. has entered into a license agreement with GE Electromaterials, a business component of GE Plastics.
2006-05-25 Solder paste allows high print speeds
Cookson Electronics Assembly Materials launched the Alpha OM-338 PT, a lead-free solder paste.
2006-03-09 Solder flux designed for tin-lead, Pb-free processes
Cookson Electronics Assembly Materials has launched the ALPHA EF-6100 low-solids wave solder flux.
2004-08-18 New wave solder alloy delivers quality cost-effectively
Cookson introduced its Alpha Vaculoy SACX307 lead-free wave solder alloy that "cost-effectively" delivers high yield and fast throughput
2002-04-24 Assembleon, Speedline to provide integrated line solutions
Assembleon and Cookson Electronics' Speedline Technologies are forming an alliance that merges Assembleon's pick-and-place systems and processes and Speedline's expertise in equipment, systems and processes.
2007-11-06 DVD group takes another shot at copy ban
The DVD Copy Control Association will put up for a vote to make changes to its bylaws that would explicitly forbid OEMs from selling systems that make copies of movies, even for secure internal storage.
2007-05-16 Solder paste with SACX alloy delivers high throughput
Cookson Electronics Assembly Materials adds to its offering the new ALPHA OM-350 Pb-free solder paste with SACX alloy developed by the Cookson Electronics' R&D group.
2010-08-19 FCI, CESP sign polymer collar tech agreement
FlipChip International has announced the signing of a patent license agreement with Cookson Electronics covering the application of polymer collar technology to enhance the drop-shock and thermal cycling reliability of area array packages, particularly wafer level packages used for handheld devices.
2008-01-17 Ecosystem control is key in high-def DVD war
Warner Bros.' switch from the HD DVD camp to Blu-ray Disc underscores that the high-def DVD format battle lies not only on the technology but taking control of the ecosystem.
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