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2007-01-18 ST remains committed to Crolles Alliance
STMicroelectronics has restated its strong commitment to technology alliances with partners and confirms the continuation of its technology development at Crolles
2004-08-19 European alliance grows for 45nm gate stack push
Collaborative research is cranking up in Europe, as France's CEA Laboratory of Electronics and Information Technologies (LETI) has gathered partners in a project to develop a 45nm-and-beyond CMOS gate stack with a high-k insulator and metal gate electrodes.
2007-01-29 ST to import CMOS, change Crolles function
STMicroelectronics CEO Carlo Bozotti told analysts that the company would align with "industry leaders" to obtain a 32nm CMOS process for use in its wafer fabs.
2002-04-17 Motorola joins Philips, STMicro, TSMC alliance
Motorola Inc. has joined Philips and STMicroelectronics, in conjunction with TSMC, in a five-year alliance to provide 90nm to 32nm chip technologies on 300mm wafers
2007-11-08 IBM-led alliance ups investment in 32nm packaging
The Common Platform alliance led by IBM plans to increase its investment in semiconductor packaging technology to pave the way to 32nm devices
2007-06-26 Freescale eases out of Crolles2 alliance
Freescale announced it would terminate all IC manufacturing activities within the Crolles2 alliance, resulting in the company's complete withdrawal from Crolles research and manufacturing site.
2007-02-19 Crolles2 continues work despite alliance issues
The Crolles2 alliance continues to work diligently to ramp up its 65nm process and complete qualification of 45nm despite the loss of some long-term partners in the technology-sharing arrangement
2005-02-03 Crolles2 alliance pools CMOS process efforts
The Crolles2 alliance partners Freescale Semiconductor, Philips and STMicroelectronics have extended the scope of their joint semiconductor activities to include R&D related to wafer testing and packaging, in addition to the original development of sub 100nm CMOS process technologies
2007-01-18 NXP withdrawal threatens ST's game plan
NXP's confirmation that it is pulling out of the Crolles semiconductor R&D alliance, is a problem for STMicroelectronics NV and could mean the end of the alliance.
2007-01-26 ST, ARM challenged by TI shift
Texas Instruments' decision to end leading-edge process development at the 45nm manufacturing node and rely on foundries thereafter, is set to have important implications for European electronics firms.
2007-11-16 NXP gains from tactical fab-lite route
NXP Semiconductors' Frans van Houten, president and CEO, talks about fab-lite and the key developments since the company moved out from under the wing of Philips.
2007-03-16 IDM firms go for 'fab lite'
The unraveling of the Crolles2 Alliance, coupled with Texas Instruments' decision to use foundry partners for its future process technology, had observers wondering whether the entire semiconductor industry was about to go fabless
2008-07-14 France pledges support for Crolles3 project
Aiming to foster innovation in microelectronics in the Grenoble area, France has agreed to provide subsidies to a new alliance between STMicroelectronics NV, IBM Corp. and the CEA
2004-12-13 STMicro keynoter sings praises of transaction level modeling
Philippe Magarshack, group vice president of central R&D at STMicroelectronics, made the 20km journey down the mountain from Crolles to provide a keynote presentation to the IP-SOC 2004 conference, which opened here today
2007-01-29 TSMC sticking with Crolles2
Taiwan Semiconductor Manufacturing Co. said it will remain a member of the troubled Crolles2 Allianceat least in the short term
2009-07-22 ST, CEA-LETI launch Nano2012 program
STMicroelectronics and CEA-LETI, the French Laboratory for Electronics & Information Technology have announced the formal launch of the Nano2012 Research and Development program at ST's site at Crolles
2007-01-25 IBM not interested in joining Crolles2
IBM Corp. said Tuesday that it has no interest in joining the Crolles2 Alliance, which could be a major blow for the technology R&D partnership
2005-06-27 Philips Semiconductors CEO sets out platform for the future
Six months after taking charge of Philips Semiconductors as President and CEO, Frans van Houten, has survived the inaugural phase of his leadership with a smile.
2007-02-23 NXP expects declining sales in Q1
NXP Semiconductors said in an interim statement that it expects a sequential fall in sales in the range of 7-13 percent during Q1of 2007 compared to Q4 of 2006.
2004-08-12 Japan's TEL selected for European 'gate-stack' project
Chip equipment vendor Tokyo Electron Ltd (TEL) has signed an agreement with France's CEA LETI (Laboratory of Electronics and Information Technologies) to develop a CMOS gate stack that includes a high-k insulator and metal gate materials and deposition steps for 45nm and lower manufacturing process nodes.
2006-07-17 They're not the Valleyand that's the point
Silicon Valley is no longer the end of the rainbow for companies in search of R&D talent, advanced research opportunities, submicron-process expertise or applications development prowess.
2006-06-02 Symposium to mull 45nm challenges
Technologists attending the 2006 Symposium on VLSI Technology in mid-June will hear about multiple facets of 45nm processes
2004-12-21 STMicro has full 65nm IC, offers 65nm design platform
STMicroelectronics said Dec. 16 that it has completed the design, and tape-out, of a complex IC that demonstrates its 65nm manufacturing process technology.
2007-06-15 ST unveils low-power 45nm CMOS platform
STMicroelectronics unveiled details of its 45nm CMOS design platform for next-generation SoC product development for low-power, wireless and portable consumer applications.
2006-05-30 ST unveils 'first' 90nm SoC for HDDs
STMicroelectronics announced it is manufacturing HDD SoC devices in 90nm technology, reportedly the first in the market.
2007-07-12 ST to shut down U.S. manufacturing operations
Over the next two or three years, ST will wind down operations at its older wafer fabs in Texas and Arizona, and move these to less-expensive plants abroad.
2008-01-25 ST to maximize Crolles2 wafer capacity
Alain Dutheil, ST's COO, noted that the total capacity of Crolles2 was 2,500 wafers, adding that this could be raised to 2,800 wafers.
2010-06-09 ST readies 20nm tape out in 2012
STMicroelectronics NV chief technology officer Jean-Marc Chery announced the company will be ready to tape out designs using a 20nm CMOS low-power (LP) process technology in Q4 2012.
2006-01-18 Philips scouting merger partner for chip unit
Royal Philips Electronics has confirmed it wishes to pursue a merger for Philips Semiconductors, but remained quiet about potential partners.
2006-01-13 Philips exec downplays ST as merger candidate
Without committing Philips Semiconductors one way or another, CEO Frans van Houten downplayed the prospects of fellow European chip company STMicroelectronics as a potential merger partner for the group he leads.
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