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2007-01-29 TSMC sticking with Crolles2
Taiwan Semiconductor Manufacturing Co. said it will remain a member of the troubled Crolles2 Allianceat least in the short term.
2008-01-25 ST to maximize Crolles2 wafer capacity
Alain Dutheil, ST's COO, noted that the total capacity of Crolles2 was 2,500 wafers, adding that this could be raised to 2,800 wafers
2007-01-18 ST remains committed to Crolles Alliance
STMicroelectronics has restated its strong commitment to technology alliances with partners and confirms the continuation of its technology development at Crolles.
2007-01-17 NXP to sever ties with Crolles2 Alliance
NXP Semiconductors announced that it will not extend its current cooperation in the Crolles2 Alliance beyond the initial term expiring at the end of 2007.
2007-02-15 No new partners for Crolles2
There is no news to report at the Colles2 Alliance in terms of new partnerships within the group, according to Joel Hartmann, director of the R&D chip-making organization
2002-04-17 Motorola joins Philips, STMicro, TSMC alliance
Motorola Inc. has joined Philips and STMicroelectronics, in conjunction with TSMC, in a five-year alliance to provide 90nm to 32nm chip technologies on 300mm wafers
2007-01-25 IBM not interested in joining Crolles2
IBM Corp. said Tuesday that it has no interest in joining the Crolles2 Alliance, which could be a major blow for the technology R&D partnership.
2007-06-26 Freescale eases out of Crolles2 alliance
Freescale announced it would terminate all IC manufacturing activities within the Crolles2 alliance, resulting in the company's complete withdrawal from Crolles research and manufacturing site.
2004-08-19 European alliance grows for 45nm gate stack push
Collaborative research is cranking up in Europe, as France's CEA Laboratory of Electronics and Information Technologies (LETI) has gathered partners in a project to develop a 45nm-and-beyond CMOS gate stack with a high-k insulator and metal gate electrodes.
2005-04-13 Crolles2 partners extend joint R&D to include sharing of SoC IP blocks
Crolles2 Alliance partners STMicroelectronics, Philips Semiconductor and Freescale Semiconductor are planning to extend the R&D program to include the creation and validation of high-level system-on-chip (SoC) intellectual property (IP) blocks.
2007-02-19 Crolles2 continues work despite alliance issues
The Crolles2 alliance continues to work diligently to ramp up its 65nm process and complete qualification of 45nm despite the loss of some long-term partners in the technology-sharing arrangement.
2005-02-03 Crolles2 alliance pools CMOS process efforts
The Crolles2 alliance partners Freescale Semiconductor, Philips and STMicroelectronics have extended the scope of their joint semiconductor activities to include R&D related to wafer testing and packaging, in addition to the original development of sub 100nm CMOS process technologies.
2006-06-15 Crolles2 adopts KLA-Tencor DUV brightfield system
KLA-Tencor announced that the Crolles2 Alliance has adopted its 2800 broadband DUV brightfield system.
2008-05-02 ST invites Russia's Sitronics into Crolles2
Russia's Sitronics JSC is invited to join the Crolles2 technology alliance, Jean-Marc Chaumont, a VP at STMicroelectronics, told the Russian press.
2003-03-04 Tech collaboration launch R&D center in France
The Crolles2 Alliance - consisting of STMicroelectronics, Royal Philips Electronics, and Motorola Inc. - has opened its R&D center near Grenoble, France.
2007-01-29 ST to import CMOS, change Crolles function
STMicroelectronics CEO Carlo Bozotti told analysts that the company would align with "industry leaders" to obtain a 32nm CMOS process for use in its wafer fabs.
2007-01-18 NXP withdrawal threatens ST's game plan
NXP's confirmation that it is pulling out of the Crolles semiconductor R&D alliance, is a problem for STMicroelectronics NV and could mean the end of the alliance
2007-11-16 NXP gains from tactical fab-lite route
NXP Semiconductors' Frans van Houten, president and CEO, talks about fab-lite and the key developments since the company moved out from under the wing of Philips.
2007-03-16 IDM firms go for 'fab lite'
The unraveling of the Crolles2 Alliance, coupled with Texas Instruments' decision to use foundry partners for its future process technology, had observers wondering whether the entire semiconductor industry was about to go fabless.
2008-07-14 France pledges support for Crolles3 project
Aiming to foster innovation in microelectronics in the Grenoble area, France has agreed to provide subsidies to a new alliance between STMicroelectronics NV, IBM Corp. and the CEA
2005-09-16 Developing macrocell libraries in CMOS
The Crolles2 Alliance brings resources together to develop macrocell libraries in 90nm and 65nm CMOS technologies
2006-07-14 Toshiba, SanDisk name flash-memory JV
Moving to expand its ties, Toshiba and SanDisk blessed and gave a new name its previously-announced NAND flash-memory fab venture.
2004-12-21 STMicro has full 65nm IC, offers 65nm design platform
STMicroelectronics said Dec. 16 that it has completed the design, and tape-out, of a complex IC that demonstrates its 65nm manufacturing process technology.
2007-06-15 ST unveils low-power 45nm CMOS platform
STMicroelectronics unveiled details of its 45nm CMOS design platform for next-generation SoC product development for low-power, wireless and portable consumer applications.
2006-05-30 ST unveils 'first' 90nm SoC for HDDs
STMicroelectronics announced it is manufacturing HDD SoC devices in 90nm technology, reportedly the first in the market.
2007-07-12 ST to shut down U.S. manufacturing operations
Over the next two or three years, ST will wind down operations at its older wafer fabs in Texas and Arizona, and move these to less-expensive plants abroad.
2005-07-19 Speakers eye design-manufacturing link
Viable system-on-chip (SoC) business models require an integration of design and manufacturing, along with new types of businesses and alliances, according to several speakers at the Multi-Processor SoC (MPSoC) forum.
2004-05-14 Philips claims new 90nm chip is 'right-first-time'
Philips Semiconductors has achieved what it claims is right-first-time silicon at its 90nm CMOS production lines in France and Taiwan.
2008-04-22 NXP steps out of Philips' shadow
NXP has instituted a major reorganization plandubbed Business Renewal Strategythat is fast reshaping NXP into the antithesis of the company established by Philips Electronics NV.
2007-02-01 Logic chipmakers seek 32nm breakthroughs
Even as they put the finishing touches on their 45nm process technologies and tweak them for low power, leading-edge logic chipmakers are scrambling to find manufacturing breakthroughs for the 32nm node and beyond.
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