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2007-01-29	TSMC sticking with Crolles2 Taiwan Semiconductor Manufacturing Co. said it will remain a member of the troubled Crolles2 Alliance—at least in the short term.
2008-01-25	ST to maximize Crolles2 wafer capacity Alain Dutheil, ST's COO, noted that the total capacity of Crolles2 was 2,500 wafers, adding that this could be raised to 2,800 wafers.
2008-05-02	ST invites Russia's Sitronics into Crolles2 Russia's Sitronics JSC is invited to join the Crolles2 technology alliance, Jean-Marc Chaumont, a VP at STMicroelectronics, told the Russian press.
2007-01-17	NXP to sever ties with Crolles2 Alliance NXP Semiconductors announced that it will not extend its current cooperation in the Crolles2 Alliance beyond the initial term expiring at the end of 2007.
2007-02-15	No new partners for Crolles2 There is no news to report at the Colles2 Alliance in terms of new partnerships within the group, according to Joel Hartmann, director of the R&D chip-making organization.
2007-01-25	IBM not interested in joining Crolles2 IBM Corp. said Tuesday that it has no interest in joining the Crolles2 Alliance, which could be a major blow for the technology R&D partnership.
2007-06-26	Freescale eases out of Crolles2 alliance Freescale announced it would terminate all IC manufacturing activities within the Crolles2 alliance, resulting in the company's complete withdrawal from Crolles research and manufacturing site.
2005-04-13	Crolles2 partners extend joint R&D to include sharing of SoC IP blocks Crolles2 Alliance partners STMicroelectronics, Philips Semiconductor and Freescale Semiconductor are planning to extend the R&D program to include the creation and validation of high-level system-on-chip (SoC) intellectual property (IP) blocks.
2007-02-19	Crolles2 continues work despite alliance issues The Crolles2 alliance continues to work diligently to ramp up its 65nm process and complete qualification of 45nm despite the loss of some long-term partners in the technology-sharing arrangement.
2005-02-03	Crolles2 alliance pools CMOS process efforts The Crolles2 alliance partners Freescale Semiconductor, Philips and STMicroelectronics have extended the scope of their joint semiconductor activities to include R&D related to wafer testing and packaging, in addition to the original development of sub 100nm CMOS process technologies.
2006-06-15	Crolles2 adopts KLA-Tencor DUV brightfield system KLA-Tencor announced that the Crolles2 Alliance has adopted its 2800 broadband DUV brightfield system.
2003-03-04	Tech collaboration launch R&D center in France The Crolles2 Alliance - consisting of STMicroelectronics, Royal Philips Electronics, and Motorola Inc. - has opened its R&D center near Grenoble, France.
2007-01-29	ST to import CMOS, change Crolles function STMicroelectronics CEO Carlo Bozotti told analysts that the company would align with "industry leaders" to obtain a 32nm CMOS process for use in its wafer fabs.
2005-03-01	Philips rolls out ARM9 family-based 32bit MCUs Philips introduced what it claims as the industry's first 90nm ARM9 family-based 32bit microcontroller family.
2007-11-16	NXP gains from tactical fab-lite route NXP Semiconductors' Frans van Houten, president and CEO, talks about fab-lite and the key developments since the company moved out from under the wing of Philips.
2007-03-16	IDM firms go for 'fab lite' The unraveling of the Crolles2 Alliance, coupled with Texas Instruments' decision to use foundry partners for its future process technology, had observers wondering whether the entire semiconductor industry was about to go fabless.
2005-09-16	Developing macrocell libraries in CMOS The Crolles2 Alliance brings resources together to develop macrocell libraries in 90nm and 65nm CMOS technologies
2008-05-30	ST's fab targets volume ramp production STMicroelectronics NV earmarked $500 million in capital expenditure to take its Crolles2 wafer fab manufacturing target of around 5,000 wafers per week to meet its full-building capacity.
2004-10-19	TSMC, Freescale to develop 65nm SOI technology Taiwan Semiconductor Mfg Co. (TSMC) and Freescale Semiconductor Inc. have signed an agreement to jointly develop a next-generation silicon-on-insulator (SOI) transistor front-end technology targeted for the 65nm advanced CMOS process node.
2006-07-14	Toshiba, SanDisk name flash-memory JV Moving to expand its ties, Toshiba and SanDisk blessed and gave a new name its previously-announced NAND flash-memory fab venture.
2004-03-11	Three chip giants form European technology project Europe's three largest semiconductor companies - Infineon, Philips and STMicroelectronics - are teaming up with a network of European technology research laboratories to kick off a new CMOS logic technology development project called NanoCMOS.
2009-03-03	Striving for wireless glory St-Ericsson is vying for second in the wireless chip business. It's looking to increase its odds by making the most of a rich portfolio inherited from its three parents.
2004-12-21	STMicro has full 65nm IC, offers 65nm design platform STMicroelectronics said Dec. 16 that it has completed the design, and tape-out, of a complex IC that demonstrates its 65nm manufacturing process technology.
2006-01-30	ST unveils WiMAX modem solution STMicroelectronics, a supplier of SoC products for the wireless market, announced its turnkey solution for 802.16e base-station modems.
2007-06-15	ST unveils low-power 45nm CMOS platform STMicroelectronics unveiled details of its 45nm CMOS design platform for next-generation SoC product development for low-power, wireless and portable consumer applications.
2006-05-30	ST unveils 'first' 90nm SoC for HDDs STMicroelectronics announced it is manufacturing HDD SoC devices in 90nm technology, reportedly the first in the market.
2007-07-12	ST to shut down U.S. manufacturing operations Over the next two or three years, ST will wind down operations at its older wafer fabs in Texas and Arizona, and move these to less-expensive plants abroad.
2008-06-05	ST strives to zero in on more markets STMicroelectronics is gearing toward high-value applications by renewing its efforts in creating analog ICs, MEMS, power semiconductors and proprietary processes fit for energy, healthcare, automotive electronics and multimedia.
2007-01-18	ST remains committed to Crolles Alliance STMicroelectronics has restated its strong commitment to technology alliances with partners and confirms the continuation of its technology development at Crolles.
2005-07-19	Speakers eye design-manufacturing link Viable system-on-chip (SoC) business models require an integration of design and manufacturing, along with new types of businesses and alliances, according to several speakers at the Multi-Processor SoC (MPSoC) forum.