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2008-10-31 Ziptronix heralds 3-D chip stacking technique
Ziptronix unveiled details of its patented Direct Bond Interconnect (DBI) technology, which employs a low-temperature process for 3-D chip stacking without thermal compression.
2010-05-04 Real-time oscilloscopes achieve up to 60GHz
LeCroy's Digital Bandwidth Interleave (DBI) techniques can produce low-noise digital oscilloscopes with true analog bandwidths up to 60GHz.
2014-05-28 Wafer-to-wafer bonding pulls off sub-micron accuracy
The sub-micron accuracy was achieved using Ziptronix's technology and EVG's equipment. This approach can be used to manufacture fine-pitch 3D ICs for stacked memory and SoCs, and image sensors.
2010-02-24 Toshiba: Mobile ICs need to keep pace with market
The biggest challenge for mobile chipset vendors is the speed at which this market is moving, said Deepak Prakash of Toshiba America Electronic Components Inc.
2007-11-26 TFT LCD controller supports WQVGA
Renesas Technology Corp. has released the R61517, a single-chip LCD controller-driver that supports amorphous WQVGA (240 x 432 pixels) size TFT color LCD modules.
2011-10-13 Sony, Ziptronix team up on image sensors
Sony has been licensed to use Ziptronix's oxide bonding technology for backside illumination imaging sensors.
2005-11-07 Samsung ships 256Mb, GDDR4 device for testing
Samsung Electronics shipped a GDDR4, 256Mb device to major graphics card manufacturers for testing.
2005-10-28 Samsung develops ultra-fast GDDR4 graphics memory
Samsung Electronics Co. Ltd has developed what it touts as the industry's fastest computer graphics memory. The GDDR4 memory can process 10GB of gaming and video images per second.
2014-08-27 LPDDR4 spec doubles memory throughput
JEDEC's JESD209-4 implements a two-channel architecture that delivers 16bit per channel, resulting in twice the I/O data rate of LPDDR3 while reducing power required to transmit huge amount of data.
2012-05-09 LeCroy launches 65GHz oscilloscope on the road to 100GHz
LeCroy pushes its LabMaster 10 Zi oscilloscope line from 60GHz to 65GHz, on its way to the 2013 release of its 100GHz real-time bandwidth oscilloscope.
2011-08-24 JEDEC announces DDR4 standard specs
The DDR4 memory chip standard will include three data width offerings, differential signaling, data masking and a new termination scheme, says JEDEC.
2005-02-14 iPAQ-hosted handheld works as RF spectrum analyzer
BVS' latest BumbleBee product continues the nomadic RF test trend, once again leveraging the power of a PDA, this time running the Pocket PC 2003 OS.
2011-01-10 Internal pentaband PCB antenna has omnidirectional pattern
Laird Technologies' Revie Prime internal pentaband PCB antenna offers 824MHz to 960MHz & 1710MHz to 2170MHz multi-band operation. Omnidirectional pattern assists limitless wireless applications.
2009-12-22 InP front-end drives 16GHz in oscilloscopes
Agilent Technologies offers an InP front-end chipset that aims to deliver oscilloscopes that deliver true analog bandwidths greater than 16GHz.
2008-02-11 GDDR5 gears for bandwidth-hungry graphics
The GDDR5 technology is targeted to become the next predominant graphics DRAM standard and is eyed to boost memory bandwidth of graphics applications to a new dimension.
2010-02-25 Camera bridge ICs enable high-speed interface to mobiles
TAEC is offering three new bridge chips for handsets that provide high-speed serial interfaces between a phone's baseband or application processor and the display or integrated camera.
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