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| 2008-10-20 | GeForce 9300 backs multiple video processors Intel and AMD will be releasing CPUs in late 2009 that have embedded graphics cores that will reduce space and power while enhancing graphics for some notebook computers. |
| 2008-05-27 | GDDR5 eyes next-gen graphics controllers Rivals Advanced Micro Devices Inc. and Nvidia Corp. are expected to ship high-speed for next-generation graphics controllers as early as June, delivering a whopping 4Gbit/s per pin, scaling to as much as 7Gbit/s per pin. |
| 2006-08-04 | Freescale processors with dual e500 CPU scale to 1.5GHz Freescale said its new MPC8572 PowerQUICC III processors are based on an SoC platform and feature dual e500 CPU cores scaling to 1.5GHz. |
| 2011-03-09 | Freescale i.MX53 line jumpstarts development Freescale's new i.MX53 multimedia products and development solutions help customers design products for a broad range of markets, from consumer apps to industrial devices. |
| 2008-07-08 | Freescale fortifies QorIQ communications platforms Freescale Semiconductor presents the first two product series based on its QorIQ communications platforms for next-generation multicore networking applications. |
| 2009-10-27 | FPGAs with 11.3Gbit/s transceivers suit OTN apps The chips meet the bandwidth needs for framer, MAC, bridging and switching apps for 100GbE and 100-Gigabit OTN. |
| 2012-01-03 | FPGAs in the era of silicon convergence Altera continues, at 28nm and beyond, to seek process, device, and circuit innovations with their foundry partner, ensuring continued technology leadership at the silicon and circuit level. |
| 2012-07-02 | FPGA kit targets high bandwidth apps The Kintex-7 FPGA Connectivity Kit helps increase our customers' productivity by offering a TRD that removes much of the tedious work customers would otherwise have to do on their own. |
| 2014-04-15 | FPGA breaks high-density, power-hungry barrier The ECP5 FPGAs from Lattice Semiconductor feature a very compact form factor with high functional density, offering up to 85K LUTs in 10mmx10 mm, 0.5mm pitch package with SERDES. |
| 2014-01-16 | FP7 FlexTiles 3D SoC project to run on dual FPGA board Sundance Multiprocessor Technology has developed a dual FPGA board as the prototyping platform for the European Union's FP7 FlexTiles 3D SoC project. |
| 2009-12-28 | Forecast: Good, bad signs for 2010 electronics biz 2009 started off bad, but the year currently seeing some positive signs. Heading into 2010, there are both good and bad signs in the marketplace. |
| 2014-08-06 | Flash-backed DRAM rides PCIe 3.0 bus The Flashtec card from PCM claims to offer better performance than flash-based SSD without its endurance issues, delivering 10 million IOPS when used as additional system memory. |
| 2014-08-12 | Flash Summit drives memory innovation The biggest takeaway of the Flash Memory Summit was on the breadth and depth of work to turn solid-state drives into processing nodes for big data centres. |
| 2013-11-21 | Flash memory architecture targets high-performance apps Diablo Technologies has struck two significant strategic alliances that will see its flash memory architecture find its way into a low-latency electronic trading platform while collaborating with SanDisk on ULLtraDIMM (ULL) technology for servers. |
| 2007-08-31 | First Stratix III FPGA chip ships ahead of schedule Altera Corp. has started shipping EP3SL150, the first member of its 65nm Stratix III FPGA family today, a month ahead of schedule. |
| 2012-09-11 | Falling PC OEM demand saps DRAM contract price Because of the weak global economy, overall PC shipment rate has been adjusted to -2.5 percent, with falling PC demand leading DRAM inventory levels to reach to 8-12 weeks. |
| 2009-03-26 | Fab tools, anyone? A new report from Needham & Co. LL claims that the bottom is in sight for semiconductor equipment makers. |
| 2011-02-04 | Fab firms' focus on 450mm could disrupt supply chain Analysts fear there is not enough 300mm capacity today and 450mm plants under construction may not start mass production until 2017 or 2018, a scenario that could trigger disruptions in the IC supply chain. |
| 2014-05-05 | Exploring Samsung 2x nm LPDDR3 DRAM Know some of the challenges faced by memory makers as they strive for sub-20 nm devices. |
| 2015-03-05 | Examining the advances in mobile storage We cannot fully predict the types of architectures that future mobile and storage products will have. However, the possibilities enabled by technologies under development today are exciting. |
| 2012-07-20 | Examining Google's Nexus 7 tablet UBM TechInsights tore down Google's Nexus 7 tablet and found a few new chip vendors not normally found in high-end consumer devices. |
| 2013-01-21 | Examine soft-core processors for embedded systems Here's a closer look at four soft-core processors to see which one would be most suitable for your platform. |
| 2014-12-04 | End of DDR marks surge of 3D, TSV-based memory Several DRAM memory architectures based on 3D layer stacking and TSV have evolved to accommodate increasing memory requirements spearheaded by Samsung, Hynix and Micron. |
| 2014-07-10 | Emulator runs pre-silicon verification of memory SoCs The Veloce2 from Mentor Graphics is enables verification engineers to develop and stress test software and hardware on SoCs using HMC, LPDDR4, and eMMC 5.0. |
| 2012-02-13 | Embedded SoC touts 120GHz of 64bit compute The 48-core 2.5GHz OCTEON III MIPS64 processors are designed for enterprise, data center and service provider infrastructures. |
| 2011-05-09 | Embedded SBC targets graphics-intensive SFF apps Kontron has introduced its new embedded SBC with AMD Embedded G-Series suited for graphics-intensive small form factor applications. |
| 2011-03-31 | Embedded box PCs offer configurable interface Kontron's Embedded Box PCs are developed to operate in tough environment conditions and are ideal for industrial applications. |
| 2011-02-10 | Embedded board touts Intel Core i7 Data Modul's ECM-QM57 embedded board is based on Intel's 32nm process technology and features a two-chip platform integrating the Northbridge chip with the CPU. |
| 2009-11-11 | Elpida, ProMOS ink DRAM foundry deal Elpida will provide DRAM process technologies to ProMOS, while ProMOS will provide manufacturing capacity to Elpida. |
| 2010-11-08 | Elpida, Intermolecular grow R&D partnership Elpida Memory Inc. has signed another R&D agreement with research partner Intermolecular Inc. focusing on manufacturing process integration in the 30nm to 40nm nodes. |
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