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2011-10-12 Consortium to develop hybrid memory standard
Micron and Samsung aim to develop a memory standard that combines DRAM and logic processes in a single unit.
2014-03-13 Consortium releases HMC specification update
HMCC's update acknowledges existing industry nomenclature by migrating the associated channel model from SR to VSR, while the USR definition also increases performance from 10Gb/s up to 15Gb/s.
2011-05-03 Conduction cooled, single-board computer debuts
Emerson Network Power launched a conduction cooled variant of its CPCI7203 3U CompactPCI blade.
2012-06-08 Computer-on-modules target intelligent embedded systems
Kontron's COM Express basic COMe-bIP# modules are available in Type 2 and Type 6 pin-outs with numerous different processors for long-term availability,
2010-04-07 CompactPCI SBC delivers dual-core performance
GE Intelligent Platforms has launched the IMP3A 3U CompactPCI single-board computer (SBC) featuring the latest dual-core QorIQ processor technology from Freescale.
2010-06-11 CompactPCI board achieves up to 3.33GHz clock speed
From Kontron comes the CP6002 6U CompactPCI processor board based on the latest Intel Corei7 mobile processor technology.
2010-07-27 CompactPCI blades integrate Intel Core i7, QM57
Adlink Technology's cPCI-6510 series features 32nm Intel Core i7 processor with a 2.53GHz clock speed and the Mobile Intel QM57 Platform Controller Hub.
2010-05-13 Comms processors pack up to 32 cores
Cavium Networks is expanding its Octeon II family with two new members that upgrade and double the number of cores available on the communications processors to 32.
2014-07-17 CommAgility intros AMC based on Virtex-7 FPGAs
The AMC-V7 is intended for LTE wireless front-end systems requiring multiple 10G CPRI links at up to rate option 8, as well as various high-performance FPGA applications.
2009-11-13 Coming soon: x86 core with integrated graphics
Advanced Micro Devices has provided rough outlines of two new x86 cores as well as its first 32nm Fusion chips that integrate x86 and graphics cores.
2010-08-02 Combo motherboard supports 45nm Intel multi-core processor
Gigabyte Technology launches their latest motherboard, Gigabyte GA-G41M-Combo motherboard for the latest 45nm Intel multi-core processor.
2014-08-05 Combo module integrates SSD, DRAM in single device
The Combo SDIMM from Apacer is available in two SSD options, including M.2 NGFF and CFast memory card, both supporting SATA 3.0 (6Gb/s) interface.
2011-12-01 COM Express uses 17W of power
The Kontron microETXexpress-PV operates from -40C to 85C and targets harsh environments found in transportation and military applications.
2012-05-08 COM Express modules use improved Intel 7-series chipset
The first products of these module families are equipped with the quad-core IntelCore i7-3615QE processor with 45W thermal dissipation power (TDP) and the Intel Core i7-3612QE processor (35W TDP).
2010-01-19 COM Express module supports Intel Core i7/i5
The COM Express Type 2 module is based on the Mobile Intel QM57 Express chipset, and is designed for high-level processing.
2009-11-27 COM Express module handles high-end graphics
From Congatec comes the conga-CS45 COM Express compact module that features Intel GS45 chipset, which improves performance with a smaller footprint and lower power consumption.
2010-06-03 COM Express module achieves up to 23,366 MIPS
congatec's latest low-power congatec-AG COM Express modules feature Intel processors in a compact form.
2015-02-18 Cogent introduces Marvell quad-core 1.6GHz micro-server
Cogent Computer Systems announces its ARMv6/7-based micro-server on a module, the CSB1726, designed for Linux-based networking and storage applications.
2012-08-15 Cloud computing to drive global memory IC market
GBI Research revealed that despite suffering from significant oversupply problems, the global memory IC market will be driven on by data centers and the advent of cloud computing.
2008-02-18 Choosing DDR memory power supply IC
DDR memory has specific power supply voltage requirements. Norman Chan and WS Wong of Freescale Semiconductor espouse that designers use a DDR memory power supply IC to ensure compliance with the standards and maximize battery run-time of portable devices.
2013-03-28 Car SoCs aimed at multimedia, navigation systems
Renesas' R-Car Series can deliver more than 25,000 DMIPS and is powered by the ARM CortexA-15 quad-core configuration running an additional ARM CortexA-7 quad-core.
2009-07-29 Can Taiwan DRAM vendors stay independent?
Taiwan's DRAM industry is scrambling to find new ways to survive amid the horrific memory downturn.
2011-09-28 Cadence releases expanded verification IP portfolio
The new protocol and memory model verification IP (VIP) will accelerate the adoption of the latest mobile standards, says Cadence.
2014-05-20 Cadence PHY IP scales up DDR4 speed up to 3200Mbit/s
The technology is built on TSMC's 16nm FinFET process, and implements architectural innovations such as 4x clocking, multi-band power isolation, and I/O with slew rate control.
2014-05-16 Cadence jumps on 28nm FD-SOI train with IP offerings
Cadence announces the availability of IP solutions on 28nm FD-SOI process as well as support for PCI Express 4.0 architecture.
2011-12-20 Buck converter supports 4.5-38V input voltage
The LTC3876 is a high-efficiency dual output synchronous step-down DC/DC controller with switching frequency programmable up to 2MHz.
2009-12-22 Broadcom gears 40nm for HD handsets
Broadcom Corp. announced it is sampling its first 40nm chip, a cellphone media processor capable of recording full 1080-progressive high-definition video.
2014-01-15 Brightest open hardware stars are in China
"If you can't hack it, you don't own it," said Andrew 'Bunnie' Huang in an interview with EE Times' Caleb Kraft.
2013-09-11 Box PC built with multiple I/O, antenna inputs
Equipped with four PCI Express Mini Card slots that control up to eight SIM cards and a GPS interface, the BL50W can implement virtually any wireless function including WLAN, GSM, HSDPA, EDGE and LTE.
2009-02-13 Battle commences in 50nm DRAM arena
Samsung and Hynix, two of the industry's DRAM leaders, have already begun migrating their production of major products to the 50nm class process node. Latest analysis on both 1Gbit DDR2 SDRAM parts from Samsung and Hynix revealed very interesting trends from the two Korean rivals.
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