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| 2011-03-07 | TI video processors offer thrice HD performance Texas Instruments' TMS320DM8168 and TMS320DM8148 DaVinci digital media processors offer 1,080p60 fps video streams, display and analytics capabilities for life-like video communications. |
| 2011-11-08 | TI exec discusses Omap future TI sees the future of mobile applications processors as capable of handling neuro, fuzzy-based and even humanistic intelligence. |
| 2007-07-25 | The skinny on quad-core processors: A buyer's guide Quad-core processing has become bargain country after Intel announced deep price cuts for its quad-core chips, putting AMD under pressure to tag its upcoming quad-core processors competitively when they come out. |
| 2011-10-14 | The move toward 3D chips Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization. |
| 2009-01-29 | The bad stuff impacting DDR timing budgets and ways to avoid 'em Why bother with a DDR "PHY" when some SSTL I/O's with potentially a DLL or PLL slapped together with glue logic will do the trick of interfacing to an SDRAM? |
| 2007-07-31 | Tech extending Opteron systems' memory footprint underway AMD is working with IC makers to develop a technology that's expected to extend the total memory footprint in future Opteron processor-based systems. |
| 2015-04-16 | Teardown: Galaxy S6 Edge exceeds build cost of iPhone 6 Plus According to the latest teardown from IHS, the Samsung Galaxy S6 Edge smartphone has a manufacturing cost amounting to $5.60 while the iPhone 6 Plus only costs $4.01 to build. |
| 2010-08-06 | Synopsys, GlobalFoundries collaborate on 28nm Designware PHY IP Synopsys Inc. and GlobalFoundries Inc. have agreed to collaborate on the development of a DesignWare interface PHY IP for use on a 28nm process. |
| 2015-02-12 | Synopsys rolls out DDR Explorer for memory sub-systems Using DDR Explorer, designers can analyse their DDR memory sub-system and optimise their architecture to increase efficiency by up to 20 per cent, while achieving 10 times faster turnaround time. |
| 2008-11-13 | Stratix III FPGAs power ASIC prototyping board The Dini Group has selected Altera Corp.'s Stratix III EP3SL340 FPGA, featuring 340K logic elements (LEs), in its DN7020K10, the industry's largest single-board FPGA-based prototyping engine. |
| 2008-01-24 | Stratix III FPGA features 340K logic elements Altera says it has developed the industry's highest-density FPGA, the EP3SL340, which features 340,000 logic elements. |
| 2010-04-21 | Stratix FPGAs deliver up to 1.6Tbit/s serial switching Altera Corp.'s 28nm high-end Stratix V FPGAs will offer up to 1.6Tbit/s of serial switching capability, 1.1 million logic elements and 53Mbit embedded memory. |
| 2012-02-16 | Storage, networking server for mission critical apps The FS3100 from Kontron can capture, process and analyze massive amounts of data across telecom and carrier cloud computing environments. |
| 2010-01-13 | STB chip brings convergence to TVs The HD chips provide the end user with 3D HDTV user experience enabled by unprecedented CPU performance. |
| 2006-11-21 | Standalone driver rolls for small BLDC motors Freescale Semiconductor's standalone MC34929 is suited to driving small three-phase brushless DC motors in consumer, portable and office equipment. |
| 2011-01-21 | ST samples STB decoder chips for content protection tech STMicroelectronics announces that it is the "first" to sample STB decoder chips supporting for next-generation security and content protection technologies that include the NDS VideoGuard Security Kernel and DVB-CSA3 descrambler system. |
| 2011-07-13 | ST platform receives Adobe AIR verification The successful porting of Adobe AIR to the STi7108-based platform has proven that the platform is able to produce rich Internet applications and games for consumer equipment manufacturers. |
| 2014-04-15 | SSDs' lustre bound to fade quickly The growing demand for solid state drives can be attributed to their speed and non-volatility. However, a cost-efficient upgrade of the system is limited to the addition of flash memories and scaling back DRAM requirements. |
| 2008-06-27 | Spansion readies DRAM alternative in datacenters Spansion has rolled out a new class of memory that is intended to replace DRAMs and solve the energy consumption crisis in the datacenters. |
| 2013-11-21 | Sony PS4 teardown shows near breakeven point on hardware cost With the PlayStation 4, Sony produced a design whose costs are starting out lower than its price tag—paving the way for the company to quickly attain profitability on hardware sales, said IHS. |
| 2011-10-03 | SoCs drive high-end automotive displays The SH7769 enables 3D graphics meter displays and enhances video input and display output. |
| 2014-02-12 | SNIA facilitates quick adoption of NVDIMM A memory module that combines a volatile DRAM and non-volatile flash allows transfer of data within the DRAM to the flash during a power failure, and back when normal conditions resume. |
| 2014-08-25 | SmartPlay to offer design services to Intel Custom Foundry The design services company focused in digital, analogue, wireless software and system design revealed that it is ready to offer design services to customers of Intel Custom Foundry. |
| 2015-01-29 | SMART Modular develops first DDR4 Mini-DIMMs SMART Modular Technologies, in partnership with Molex, plans to release Mini-DIMMs that will use a DDR4 vertical-mount 288-pin socket with secure latches. |
| 2010-08-26 | Smart memory chips may replace TCAMs, DRAMs Huawei Technologies presented its work on a first-gen smart memory packing 32MB, consuming 60W that can eventually replace TCAMs and DRAMs. The device is still under verification. |
| 2014-04-10 | Six hot tech trends emerge in high-speed memory While DDR4 comes first to mind in consideration of the latest developments in high-speed memory, several others including embedded DRAM and SRAM cells make the top six list. |
| 2010-09-09 | Single-chip 4K format conversion reference design launched Altera is set to demonstrate the industry's first single-chip 4K, format conversion reference design with integrated serial digital interface (SDI) in Amsterdam this week. |
| 2007-09-17 | Simplify DDR validation with SI methods As DDR memory technology evolves, DDR signal integrity becomes more challenginghence, it is essential to use a proper probing method to obtain the best result. |
| 2015-03-18 | Signal/power integrity device targets high-speed PCB design The HyperLynx SI/PI tool from Mentor Graphics offers tools for pre- and post-layout signal integrity, timing, crosstalk and power integrity analysis to eliminate design re-spins. |
| 2011-05-11 | SHB ideal for high-speed data transfers Adlink has introduced the NuPRO-E340, a PICMG 1.3 system host board (SHB) that targets industrial applications that require high-speed data transfers and high computing power. |
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