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2004-10-15	STMicro teams with Chinese firm on digital TV software STMicroelectronics has signed an agreement to form a joint venture with HDIC, a company of Shanghai Jiaotong University, which develops technologies for digital TV.
2003-09-26	STMicro announces advancement in light-emitting silicon STMicroelectronics has disclosed advances they have achieved in the field of light-emitting silicon technology.
2005-09-14	STB decoder implements SVP tech STMicroelectronics unveiled its first silicon devices to implement Secure Video Processor (SVP) technology, the next generation open specification for the protection of digital video content.
2002-08-26	STATS EBGA package offers more I/O STATS Ltd. has launched the EBGA Multi-Tier package that offers higher I/O and multiple wire bonding zones for power, ground, and signal connection.
2002-05-28	STATS develops thermally-enhanced PBGA ST Assembly Test Services Ltd has introduced an enhanced version of its Plastic Ball Grid Array package called Exposed Drop in Heat Spreader Plastic Ball Grid Array (XDPBGA).
2010-12-15	STATS ChipPac flip chip biz grows over 50% Semicon test and packaging provider STATS ChipPAC announced its flip chip business grew more than 50 percent in 2010. The company shipped more than 250 million flip chip packaging units.
2011-04-21	STATS ChipPAC aims TSV expansion in Singapore STATS ChipPAC is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities in Singapore.
2006-11-15	Startup pushes 10Gbps signals 1.5m Startup Banpil Photonics Inc. claimed it has demonstrated a way to send 10Gbps signals 1.5m across a standard pc-board without using power-hogging techniques to amplify the signal.
2014-10-27	Start 'em young: Engaging future engineers in science, technology Many initiatives are underway to engage the next generation of engineers and innovators in science and technology.
2006-10-19	ST, Nanotron team-up for location networks STMicroelectronics and Nanotron Technologies have joined forces to develop complete designs for wireless control and sensor networks targeted at the real time location systems market.
2010-04-05	ST develops MEMS sensor for glaucoma treatment STMicroelectronics will develop and supply a wireless MEMS sensor that acts as a transducer, antenna and mechanical support for additional read-out electronics in a platform developed by Sensimed.
2013-04-04	Spreadtrum rolls out dual-core 1.2GHz smartphone chipset Spreadtrum's SC8825, which supports dual-mode TD-SCDMA/HSPA and the SC6825, which supports EDGE/GPRS/GSM, are based on a highly efficient multi-core architecture.
2003-01-23	Spreadtrum enhances wireless IC solutions with ARM core Fabless semiconductor company Spreadtrum Communications Inc. has licensed ARM Ltd's ARM7TDMI microprocessor core.
2015-02-16	Spreadtrum chipset integrates Tizen OS The Tizen operating system is now integrated with the Samsung Z1, Spreadtrum confirms in a news release. The Z1 runs the Tizen 2.3 OS and integrates Spreadtrum's SC7727S mobile chipset platform.
2014-08-12	Spintronics to optimise electronic devices Unlike other concepts that harness electrons, spin current can transfer information without causing heat from the electric charge, which is a serious problem for current semiconductor devices.
2006-09-27	Sony reorganizes electronics biz Effective Oct. 1, Sony Corp. will realign certain key executive responsibilities in its electronics business as a competitive strategy.
2009-01-12	Sony CEO stays positive despite economic crisis Sony Corp. CEO Howard Stringer cheerfully depicted the current worldwide economic crisis as a temporary "challenge" that will eventually succumb to—among other forces—the "innovative" power of the CE industry.
2006-07-13	Solution improves efficiency of CMOS image sensors Silecs said its series of advanced optical coatings were designed specifically to improve the reliability and optical efficiency of CMOS image sensors.
2010-09-09	SoloPower's flexible CIGS modules win UL certification Flexible CIGS modules pass UL1703 test for PV module manufacturing safety
2006-12-22	SOG LCD module delivers high-definition images The new 3.5-inch SOG LCD module by NEC LCD Technologies features a QHD array of 960 x 540 pixels.
2014-12-19	SMIC makes Snapdragon 410 processor in 28nm process This represents an important step for SMIC in their 28nm process maturity as they become one of the first Chinese foundries to produce high-performance, low-power mobile processors.
2015-08-14	SMIC launches 28nm mobile phone chips SMIC, China's largest semiconductor foundry, marks a new era of advanced mobile phone chip manufacturing with the successful adoption of its 28nm process technology into mainstream smartphones.
2014-04-21	SMIC deploys full set of ESD protection device Including documents, software, and risk management services, the solution targets to manage ESD risk and implement the whole chip ESD design
2006-12-19	SK Telecom, Staccato partner on UWB mobile services Staccato Communications and Korea's SK Telecom unveiled plans for the global delivery of UWB wireless PAN mobile phone services.
2006-11-08	SK Telecom invests in Wavesat WiMAX chip specialist Wavesat has completed what it says is a "significant" round of funding led by South Korean network supplier SK Telecom that should take the company to profitability.
2013-10-31	SK Hynix turns to BeSang for 3D IC tech SK Hynix has licensed BeSang's 3D IC process that uses a low-temperature process to build multi-layer 3D integrated circuits one layer at a time using traditional vias.
2013-08-05	Sitara processor added to Geppetto design platform Gumstix revealed that its Geppetto-designed boards now feature a TI Sitara AM3354 processor running at 720MHz with 256Mb of DDR2 RAM onboard.
2010-10-25	SiP device supports automotive LIN networking Atmel unveiled a new SiP solution for LIN automotive networking applications, the ATA6614.
2011-06-03	Singapore's ASTAR to develop 16Kbit RRAM The development of a 16Kbit RRAM prototype and memory controller is being pursued under a strategic partnership between ASTAR's Data Storage Institute (DSI) in Singapore and 4DS Inc.
2015-10-12	Singapore tests drone for mail delivery The battery-operated drone, which is designed for use in dense urban landscapes, can carry a payload of up to half a kilogramme, fly at a height of up to 45m and travel a distance of 2.3km.