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Detailed Thermal Model Search results

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2014-10-17 Boost thermal management of electronic systems
Find out how accurate compact thermal models of three-die power packages can be used to improve the thermal management of electronic systems
2006-12-13 Vishay offers thermal models for optocouplers, SSRs
Vishay Intertechnology is now providing detailed thermal characteristics for its newly released optocouplers and SSRs that have a total power dissipation of 200mW and higher
2004-10-19 Integrated thermal designer analyzes complex ICs
PTD v2.0 from Harvard Thermal works with the Encore package-design system from Synopsys to automatically create highly-detailed thermal models at the component level
2014-02-26 Significance of LED thermal characterisation
Learn how improving the thermal characterisation of LEDs will help to spur on the LED lighting revolution
2007-02-02 Engineers stress thermal impact on designs
With increasing chip speed and density, designers are struggling to keep their cool while facing thermal challenges in all designschips, boards, modules and systems
2005-06-16 Philips makes predicting power ICs' thermal performance easier
Philips disclosed that it will provide thermal models of its power semiconductors to help its customers accurately predict the thermal performance of their devices
2006-06-16 Analog analysis tool works with flow
Gradient Design Automation Inc. recently launched CircuitFire, which is said to be the first 3D thermal analysis tool for analog and mixed-signal ICs that's integrated directly into the design flow
2007-06-18 Applying CTMs on FPGA-based devices
This article discusses better ways to predict temperature for these faster and denser FPGA components in a system environment.
2015-09-17 Spot IGBT degradation through power cycling
Here is a look at an experiment in which we conducted thermal transient tests from one steady-state to another to determine cause of failure for a small sample of IGBTs
2015-10-12 What you need to know about sensor fusion
Here is a look at the general concept of sensor fusion, the historical perspective, and two detailed casesinertial sensor fusion and image fusion
2015-07-23 What will drive 5G to the next level?
NYU Wireless has spent years creating mmW channel modes. Nevertheless, detailed system designs and improved architectures must be developed before mmW products can enter the market in a real way
2012-11-20 Impact of crystal electrodes on PCM (Part 1)
Part 1 tackles the seeded-bridge model that allows the novel use of elevated-temperature data-retention results to explore the set parameters of PCM devices
2015-12-24 Recent revelations on non-volatile memory conduction
There is a continuing work at IBM Zurich that has just provided us with new and important insights into non-volatile memory, as well as an intriguing mystery. Read this to learn more.
2011-12-15 Prototyping: Virtual vs physical
Simulating and analyzing the products in software during the design process provides significant time-to-market and quality advantages over older practices of producing multiple physical prototypes and testing them in the lab.
2005-08-25 Protecting the HDMI interface
HDMI combines a high-speed unidirectional TMDS data link with low speed, bi-directional control and status links and configuration protocols in a single user-friendly high-performance connector.
2014-01-23 Optimise CMOS for MEMS-based frequency control
CMEMS fabrication process can be used to fabricate both micro-electromechanical and CMOS electronic devices on a single die.
2006-11-01 MEMS resonator operates at 5.1MHz
The SiT0100 MEMS resonator from SiTime measures 0.8(H)-by-0.6(W)-by-0.15(T)mm, and is compatible with standard semiconductor packaging for SIP and MCM.
2012-01-16 Integrate power mgmt functions for energy harvesting
Learn about the functional blocks needed for this role in a harvesting design.
2013-05-03 Infineon outs Hall sensors in small SOT23 package
The TLE496x series boasts the lowest energy consumption and the smallest space requirements aimed at automotive and industrial applications.
2002-08-21 Fulcrum IC heats asynchronous design debate
A coolly tantalizing alternative to the latest approaches to blazing IC performance is expected to cut this week's sweltering heat at the Hot Chips conference.
2015-11-16 Examining metal eFuses
Here is a look at two electrically blown fuse structures (eFuse) used in metal gate logic processes. The first eFuse structure that we look at is made by Intel and the second by TSMC.
2013-01-07 Effects of burn-in on power supply reliability
Here's an examination of the impact of burn-in testing on power supply reliability and performance.
2008-08-01 Developing a green product development strategy
One of the most difficult steps in the initiation of a green product development strategy is where to get started. The green knowledge base for product development is widely distributed and not readily available within the organization, in the design or process teams.
2013-02-01 An assessment of PCB layout tools
The selection of the right tool for the layout should be at the forefront of PCB layout planning and must never be ignored.
2015-03-20 200W DC-DC converters aimed at 12V, 5V telecom apps
The AVO200 series from Artesyn claims to provide telecom and networking equipment manufacturers up to 94.5 per cent efficiency for communications installations.
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