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2012-04-26 Toshiba to relocate Thai assembly plant
The new facility will replace facilities at the Bangkadi Industrial Park in Pathumthani and will be located at the Industrial Park in Prachinburi about 90 miles northeast of Bangkok.
2008-10-30 Toshiba readies 43nm SLC NAND flash
Toshiba has developed a new line-up of 43nm single-level cell NAND flash memory products available in densities ranging from 512Mbit to 64Gbit.
2012-05-16 Toshiba invests in LED tech developer
Bridgelux has revealed that that Japan's Toshiba has made an equity investment in the firm.
2010-11-12 Top semiconductor suppliers show strong growth
IC Insights preliminary ranking reveals that No. 2 ranked Samsung is expected to gain ground on Intel Corp.
2009-07-09 Top 10 industry issues
Here are the top 10 looming issues that the semiconductor capital equipment industry is facing.
2009-06-15 Top 10 electronics blunders
Every once in awhile, electronics firms or individuals who work for them do something that makes everyone else in the industry scratch their heads and, perhaps, wince. These are actions and decisions thatwhile they may seem perfectly logical to those making the decisionsdon't really add up in the minds of most people.
2005-10-19 Tool suite 'lays foundation' for extending TCAD to DFM
Synopsys introduced early this week a new TCAD tool suite that integrates features of former TMA and ISE products as well as adding new capabilities that enable TCAD to be used in the manufacturing space.
2006-11-01 Tool reduces need for immersion at 45nm
Invarium Inc. offers patterning-synthesis software promising, among other things, to limit the number of advanced layers that will require immersion at 45nm. This will allow customers to get more mileage out of existing lithography equipment.
2006-12-01 Tool compresses mask data files in Mebes format
SoftJin Technologies Pte Ltd introduced a software product said to compress mask data files in Mebes format by a factor of five to 15, reducing file sizes and associated data transfer times.
2011-08-19 TI: OMAP isn't up for grabs
TI, through an official statement made via e-mail, clarified that they are not selling their OMAP multimedia applications processor line.
2012-04-25 TI: 2012 is 'a good year for growth'
The company reported Q1 sales of $3.12 billion, down nine percent from the previous quarter and down eight percent YoY but reported orders of $3.24 billion in Q1, up 13 percent QoQ.
2006-10-19 TI, Mistral team up on virtual CD changer ref design
Texas Instruments and India's Mistral Software recently introduced a virtual CD changer reference design built on TI's Aureus audio digital DSPs.
2011-07-28 TI's quake-damaged fabs resume operations
TI has reported that its Miho and Aizu-wakamatsu fabs have resumed their operations.
2011-04-25 TI's OMAP chief lists top 11 tablet features
Stressing the importance of user experience, EE Times identifies 11 features that tablets sold in 2011-2012 should offer, among them, multiple OS, HD videoconferencing and computational photography.
2007-03-07 TI upgrades Code Composer IDE
Texas Instruments Inc. rolled out version 3.3 of its Code Composer Studio Platinum IDE, which promises to raise multiprocessor support and analysis features to a higher level to meet the evolving needs of embedded system development.
2005-11-24 TI to sell sensor, RFID division, says analyst
Texas Instruments has reached an agreement to sell its Sensors & Controls division, according to Tristan Gerra, an analyst with R.W. Baird.
2012-09-28 TI shifting OMAP tech towards embedded apps
Facing stiff competition from Qualcomm and Nvidia, TI's executives stated that the market has become less attractive due to market leaders Apple and Samsung using internally designed processors.
2008-10-22 TI seeks to dispose portion of mobile baseband unit
TI is in negotiations with undisclosed potential buyers of its merchant baseband IC business, but would continue to support some of its custom baseband customers.
2012-01-25 TI plans fab closure, ends 2011 in the black
The company disclosed vibrant sales for 4Q11 and plans to close two older chip fabs in the next 18 months.
2011-03-17 TI Japan fabs down
Production at TI's earthquake-damaged Miho, Japan fab will be restarted in stages, beginning with several lines in May, with full production by July at the earliest.
2005-09-21 TI Fellow predicts 'third-wave' of DSP innovation
A new wave of DSP-based innovation is just around the corner, according to Gene Frantz, a principal Fellow at Texas Instruments Inc.
2012-11-15 TI drops 1,700 workers in OMAP realignment
A month after detailing plans to retarget its R&D for its OMAP line on embedded markets, Texas Instruments has announced it will cut about 1,700 jobs.
2012-06-15 TI describes 28nm CMOS TSV integration
A paper by TI researchers showed results indicating minimal effect on transistors within 4 microns of TSV placement.
2012-07-25 TI customers delay new orders
The decline in new orders began in June and has continued into July, cutting into the company's order backlog for Q3.
2011-04-06 TI buys National Semiconductor
TI has signed a merger agreement to procure National Semi for $6.5 billion in cash.
2012-06-28 TI bets on China for MCU design
TI's facility in China is not there just to support existing MCU products. Rather, it actually executes some MCU product line development from China.
2011-10-13 Thailand fabs close due to flooding
Massive floods in Thailand have forced companies located at the Rojana Industrial Park to suspend their operations.
2005-06-01 Templeton advocates more dynamic collaborative design
ARM president Mark Templeton told a group of EDA executives and chip designers that interoperability and collaborative design can ultimately be of great benefit to the industry as a whole.
2005-07-18 Technology shrinks will continue, panelists say
Despite daunting economic and technical challenges, the semiconductor industry will continue to aggressively shrink the line widths of leading-edge devices for the foreseeable future, according the majority of semiconductor equipment executives who took part in a panel discussion at the Semicon West tradeshow here.
2010-11-15 Teardown: Kinect Xbox 360 add on has PrimeSense, Marvell, TI, ST parts
a teardown analysis performed by UBM TechInsights of Microsoft Corp.'s Kinect motion-gaming add on for its Xbox 360 found chips made by PrimeSense, Marvell, TI and STMicroelectronics.
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