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2012-09-27 US Judge rules that Rambus shredded evidence
Rambus destruction of records will limit the royalties that it can collect off its patents in the SK Hynix suit.
2009-09-30 Update: 10 companies in trouble
This is an updated version of 10 companies in trouble. Some companies have been removed since the last version, others remain. Still others have been added to the mix.
2011-09-15 Upcoming Windows OS supports ARM, x86
Microsoft's Windows 8 touts compatibility with various processors that include Snapdragon, OMAP and Tegra.
2008-10-02 Unlocked iPhones land in Hong Kong
Apple is offering in Hong Kong a carrier-independent, "unlocked" iPhone that can be used with each customer's wireless operator of choice.
2010-08-09 United Microelectronics hits max capacity
UMC announced hitting a record high in wafer shipments and producing at maximum capacity for Q2 2010. 65nm shipments drove the company's growth.
2012-07-03 UMC looks to catch up with competitors with IBM deal
UMC looks to drastically improve its position with 20nm low power process with FinFET development license from IBM.
2012-08-24 UMC board votes to close Japan fab
Declining customer demand and bleak Japanese economy led to UMC's decision to shut down its fab in the country.
2011-09-02 U.S. stops AT&T's T-Mobile acquisition
Citing free competition as its main objective, the U.S. Justice Department filed an antitrust suit against AT&T's proposed acquisition of T-Mobile.
2005-07-21 U.S. still dominates in electronic design, according to iSuppli
The U.S. remains the leader in worldwide electronic system design, but China is rising fast, according to data from iSuppli Corp.'s new Design Influence Tool (DIT).
2006-07-20 U.S. seeks to change rules on China exports
The U.S. Department of Commerce is seeking to change the rules regarding high-tech exports to China, some of which are intended to make it easier to sell semiconductor equipment into its growing IC market.
2011-12-30 Two big China fabs merge
Hua Hong and Grace entered into a legally binding agreement to effect a merger between the two companies on September 13, 2011.
2007-02-01 TV-on-a-chip simplifies entire DTV design
Broadcom Corp. rolled out a "television-on-a-chip" that the company calls the first digital HDTV silicon solution to support full 1,080p display resolution.
2009-12-03 TV receiver supports analog, digital broadcasts
From Fresco Microchip Inc. comes a single-chip solution that supports universal analog audio and video demodulation as well as digital IF processing for global terrestrial and cable TV markets.
2009-06-22 TV IC revenue to reach $13.9B despite Q1 dip
According to iSuppli, revenue from semiconductors used in televisions is projected to increase to $13.9 billion in 2013, up from $9 billion in 2008.
2010-07-22 TSMC, ARM agree on long-term collaboration
TSMC and ARM signed a long-term strategic agreement to achieve optimized Systems-On-Chip (SoCs).
2012-04-20 TSMC shifts from multiple to single-only process at 20nm
Shang-yi Chiang, EVP at TSMC, said the firm might also offer an 18nm or 16nm process node after 20nm if lithography technology is not available to make 14-nm devices cost effectively.
2005-06-13 TSMC releases reference design flow for 65nm processes
Taiwan Semiconductor Mfg Co. Ltd has released version 6.0 of its reference flow, the sequence of EDA tools that the world's largest foundry recommends for its 65nm manufacturing processes.
2011-01-18 TSMC is among chip industry's biggest R&D spenders in 2010
TSMC has joined the ranks of the semiconductor industry's top R&D spenders in 2010. Analysts attribute TSMC's increased R&D spending to the success of the fabless-foundry model and the increase in IDMs migrating to fab-lite models
2009-01-23 TSMC denies layoff plans
Foundry giant Taiwan Semiconductor Manufacturing Co. Ltd has no plans to reduce staff as the result of the economic slump, according to a company spokesman.
2012-04-20 TSMC CEO: Issues with 28nm cap is over
Morris Chang, chair and CEO of foundry firm admitted problems with the 28nm node, but said the problems were related to capacity, not yield.
2012-05-03 TriQuint slashes workforce
'We are rightsizing our factories in Florida and Costa Rica as we transition to [wafer-level packaging] and away from commodity duplexers toward a higher-value mix of products,' said Ralph Quinsey, TriQuint's president and CEO
2012-04-10 Trident to sell DTV biz to Sigma
Sigma Designs said it finalized a deal to acquire Trident Microsystems' digital television business for $21 million.
2007-01-01 Transmitter ICs enable PC's shift to HDMI
Silicon Image rolled out a pair of VastLane HDMI transmitters that provide PC manufacturers with a single-chip solution for driving digital output to PC monitors and HDTVs.
2007-06-18 Transcoder chip converts MPEG-2 to H.264
Promising relief for bandwidth-constrained professional broadcast and video applications, LSI Logic Corp. has introduced a high-definition MPEG-2-to-H.264 transcoder chip.
2009-05-19 Trade group skeptical on Taiwan DRAM venture
The Taiwanese government plan to consolidate the island's DRAM industry around the state-backed Taiwan Memory Co. (TMC) remains unclear and could do more harm than good, according to a report released May 14 by a U.S.-Taiwan lobbying group.
2009-08-19 Trade group remains dubious of Taiwan DRAM plans
Despite the launch of Taiwan Memory Co. (TMC) and its subsequent investment in Japan's Elpida Memory, broader issues of consolidation and high levels of debt among Taiwan's DRAM players remain unresolved.
2012-05-07 Trade group delves into 'on-shoring' in electronics
Electronics firms have for years been shifting manufacturing operations to emerging economies in Asia and elsewhere where wages are lower and labor laws less rigorous.
2012-01-06 Toumaz forms wireless spinout
According to Toumaz, its board of directors created the spinout in order to strengthen the focus of the company's healthcare and semiconductor divisions.
2009-01-09 Tough '09 awaits fab-tool, materials sector
Based on the early returns, the fab-tool and electronic materials markets are off to a rough start in 2009. And don't expect the market to improve, prompting the possible acceleration of a shake-out in the sector.
2010-02-24 Toshiba: Mobile ICs need to keep pace with market
The biggest challenge for mobile chipset vendors is the speed at which this market is moving, said Deepak Prakash of Toshiba America Electronic Components Inc.
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