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2009-11-25 Sematech expands, muses fabless push
Sematech is looking at ways to bring fabless companies into the fold and is hoping to expand its collaborative efforts with fab tool makers,
2014-03-20 Samsung announces prod'n of 20nm-based 4Gb DDR3 memory
A key element of the latest design and manufacturing technology by Samsung is a modified double patterning and atomic layer deposition that allows for continued scaling.
2003-09-11 Researchers reflect on maskless lithos
An invitation-only workshop has kicked off last September 8, to explore a form of maskless lithography based on arrays of micromirrors
2009-09-10 R&D consortia help drive IC equipment growth
Semiconductor equipment R&D spending is set to be slashed, with an $8 billion decline seen over the next five years, according to market tracker Gartner.
2014-02-17 Quantum photolithography writes 1nm lines at industry speed
An experiment headed by Storex CEO Eugen Pavel was conducted using a proprietary photoresist material that functions as a nanolens, enabling a very high resolution at the centre of the beam.
2014-12-15 Probing the macroeconomics side of Moore's Law
The author believes that the entire economic structure that was supposed to lead to next-generation manufacturing technologies like 450mm wafers and EUV lithography is on the verge of coming apart.
2009-03-02 Panelists skeptical on next-gen litho
Experts debated and sparred over the future of patterning during a panel discussion at the SPIE Advanced Lithography conference
2009-09-24 Otellini: Intel to make more SoCs than PC CPUs
Chip giant Intel Corp. will someday ship more SoC devices than PC processors, according to CEO Paul Otellini's keynote at the Intel Developer Forum.
2012-08-09 Nikon, Intel to develop 450mm wafer steppers
The Japanese firm is going to work with Intel to develop the next generation semiconductor manufacturing equipment capable of handling 450mm wafers that Nikon plans to commercialize by 2018.
2010-03-01 Nikon updates litho roadmap
Nikon outlined its lithography roadmap and devised a new lens for its latest 193nm immersion scanner and revised its roadmap for extreme ultraviolet (EUV) lithography.
2010-06-25 Nikon stays optimistic amid losses
Nikon formulated a three-year medium term management plan that will run from fiscal 2011 to 2013. One of the goals is to bring the fab tool business back in the black.
2010-03-03 Nanoimprint still awaits takeoff in HDDs
While nanoimprint has not cracked mainstream production in semiconductor fabs, as some had hoped at one time, the technology has been delayed in perhaps its biggest potential market: HDDs.
2010-03-11 Long road still to e-beam direct-write litho
While multiple development efforts on e-beam direct-write lithography have reported progress, a one prominent lithography researcher claims production tools are still a minimum of five years away
2009-03-06 Litho woes: R&D gap, downturn
It was a triple-whammy for lithographers at the SPIE Advanced Lithography conference as the industry continues to be plagued by an R&D gap, technology delays, and, of course, the lousy economy
2007-04-16 Litho woes weigh down semicon industry
The lithography world has suddenly turned upside-down as the industry gets socked by a double whammy: The window of opportunity is slowly closing on EUV lithography for IC production, but the most likely alternativea version of 193nm immersionis proving expensive.
2008-07-16 Litho options falling behind process needs
Who killed high-index lithography, and was politics the cause? These questions remain for chipmakers looking for a route to next-gen manufacturing in a shifting lithography landscape
2011-06-27 KLA joins Sematech's litho defect reduction program
Upon joining the Sematech program, KLA will collaborate with the consortium's engineers on such areas as defect source identification and elimination, and EUV manufacturability and extendibility
2009-06-25 Intel: Fab tool market savior?
Intel Corp. continues to fund technologies and procure fab-equipment, but behind the scenes, the company is investing in some companies and brokering deals for others, reportedly including ASM International NV and NuFlare Technology Inc., sources said.
2004-03-02 Intel, Media Lario join forces in optical component R&D
Intel Corp. and Media Lario Int. S.A. have entered into an agreement regarding development of optical components for EUV lithography.
2008-12-12 Intel widens lead in high-k/metal gate race
Intel is expected to extend it s its lead over Advanced Micro Devices, IBM and other microprocessor vendors in the high-k/metal-gate race at next week's International Electron Devices Meeting.
2009-06-23 Intel scales down 193nm litho to 15nm
Intel claims that it has pushed 193nm immersion lithography down to 15nmat least in the lab
2012-07-11 Intel purchases ASML shares to dev't 450mm wafer
Intel has agreed to take a 15 percent stake in ASML Holding NV to accelerate the development of 450mm wafers and extreme ultraviolet lithography
2014-09-12 Intel plans to extend Moore's Law to 7nm
Chipmakers generally don't expect the much-delayed extreme ultraviolet lithography in time for 10nm chips, but many still hold out hopes it could be ready for a 7nm generation
2003-05-28 Intel drops 157 litho from roadmap
Intel dropped a bomb on the lithography industry when it said it has removed the 157nm lithography generation from its tech roadmap
2015-08-24 Intel CEO finds IoT road too narrow
Brian Krzanich talked about the 3D Xpoint memory chips co-designed with Micron, the outlook for Moore's Law and EUV lithography, China and the pending $16.7 billion deal to acquire Altera.
2013-05-30 Institute for Nanolithography planned for Amsterdam
ASML, the Foundation for Fundamental Research on Matter, UvA, the VU University Amsterdam and the Netherlands Organisation for Scientific Research teamed up to establish the institute.
2012-02-15 Initiative updates e-beam roadmap
Electron-beam technologies such as mask process correction and others are being guided by initiative members to facilitate a working ecosystem.
2002-11-14 Infineon demonstrates breakthrough in chip structures
Infineon Technologies has announced that its researchers have demonstrated the patterning of thin dielectric films on silicon wafers utilizing a resist mask patterned by Extreme Ultraviolet Lithography
2013-12-18 Industry collaboration seen to ease advanced-node issues
In theory, increased industry collaboration in research areas such as materials and better EUV sources would help address unrelenting schedule pressures, noted a Globalfoundries executive
2011-10-13 Imec, ASML deal offers advanced litho tech
The five-year collaboration will allow ASML to install its 193nm immersion lithography tool at Imec, speeding up its work on EUV lithography.
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