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2012-02-14 Imec rolls 300mm directed self-assembly process line
The fab-compatible patterning solution can pave the way for scaling EUV lithography to production level, pushing the boundaries of 193nm tech.
2012-03-08 Imec rolls 14nm process development kit
Claiming an industry first, the PDK is targeted at next-generation technologies such as FinFET and EUV lithography.
2015-07-13 IBM surpasses Intel with 7nm node tech
IBM Research claims to have perfected the extreme ultra-violet (EUV) lithography and using silicon-germanium channels for its finned field-effect transistors (FinFETs).
2007-02-27 IBM pushes for immersion at 22nm
IBM outlined last week its lithography roadmap, saying that it would extend 193nm immersion lithography down to the 22nm node for logic production
2008-09-19 IBM pushes 'computational scaling' for 22nm
Amid probable delays with extreme ultraviolet (EUV) lithography, IBM Corp. plans to extend 193nm immersion and move towards what the company calls "computational scaling" technology for the 22nm node and perhaps beyond.
2006-10-03 IBM 'fab club' narrows options for 32nm
IBM's process-development partners did not disclose the exact details about its 32nm technology, but it did provide a glimpse of possible candidates for the "common platform" at that node.
2010-01-05 Grand challenges to to niggling nettles in 2010
EE Times editors list nettlesome issues they'd most like to see electronics engineers sort out next year ranging from grand challenges of engineering to niggling nettles of consumer gadgetry.
2016-02-12 GlobalFoundries, SUNY Poly open advanced patterning centre
The $500 million, five-year programme will accelerate the introduction of EUV lithography technologies into manufacturing to expedite next generation chip technology.
2013-03-20 Globalfoundries, ASML to deliver 28nm, 20nm tape-outs
The firms teamed up to offer high volume computational lithography capabilities for 28nm and 20nm tape-outs, while also accelerating the development of future nodes including EUV lithography.
2011-05-24 FUJIFILM joins SEMATECH's resist center
FUJIFILM has joined SEMATECH's Resist Materials and Development Center to further enhance the technology on image development and testing imaging materials for EUV sensitivity
2010-09-22 Forecast: all leading-edge designs will require e-beam
D2S Inc. CEO Aki Fujimora discusses the role of electron beam lithography in the future of semiconductor manufacturing
2009-07-22 Fab tool collaboration: Mission impossible?
Will the day come when rival fab tool vendors will throw out the rule book and collaborate with each other on new equipment R&D projectsjust to help the industry keep pace on Moore's Law?
2003-02-11 Exitech to use Brooks-PRI handling systems
Exitech Ltd has purchased two of Brooks-PRI Automation Inc.'s Gemini Express 5000 vacuum handling systems, including supervisory level software for controlling the systems.
2012-09-21 EMI partnership adds SK Hynix in metrology research
The EUVL Mask Infrastructure (EMI) partnership was launched by Sematech adds SK Hynix to to bolster its attempts in tackling infrastructure gaps for EUV lithography in mask metrology.
2011-03-07 Directed self-assembly gains steam
Despite its inherent defects, DSA could have applications in areas such as flash memory production where the regular structure of circuits and cost sensitivity of the market may make it attractive.
2015-04-28 Did Intel buy EUVs from ASML Holdings?
ASML touts selling 15 extreme ultraviolet lithography systems to a U.S.-based customer per news release. Sources agree deal could be with Intel and a long-term deal to be delivered until 2017
2013-04-02 Designers will jump hurdles to succeed at 14nm node
Chip designers face a number of challenges at 14nm because scaling issues were not addressed by earlier generations, according to experts at the International Symposium on Physical Systems.
2009-03-04 Deconstructing source-mask optimization tech
The SPIE Advanced Lithography conference witnessed a war of words among vendors developing source mask optimization tools in hopes of extending 193nm immersion lithography to the 22nm node
2009-09-23 Canon litho dreams hit price roadblock
The end could be near for Canon Inc.'s lithography efforts, as the company is reportedly mulling plans to cease future, high-end scanner development, according to sources
2010-03-16 Canon litho dreams hinge on nanoimprint
An analyst believes that Canon's 'great white hope' in lithography rests with an undisclosed relationship with nanoimprint lithography vendor Molecular Imprints Inc
2015-10-09 Cadence, Imec announce 5nm test chip tapeout
Imec and Cadence optimised design rules, libraries and place-and-route technology to obtain optimal power, performance and area (PPA) scaling via Cadence Innovus Implementation System.
2005-12-14 ASML, Nikon tie in litho share race
Preliminary data indicates that ASML will retain the lead in revenues with a 53.2 percent share of the $4.8 billion market for new lithography tools, up from a 50.3 percent share in 2004, according to The Information Network
2005-10-18 ASML's EUVL alpha tool shipments slip to Q2
European lithography equipment vendor ASML Holdings NV now expects to ship its two alpha extreme ultraviolet lithography (EUVL) tools in the second quarter of 2006, the company said. This is a change from previous expectations that the tools would ship in the first quarter
2012-04-03 ASML dominates litho market
ASML was responsible for 57 percent of the lithography tools shipped last year, with Nikon accounting for 28 percent and Canon 15 percent
2005-09-21 Applied says no plans to enter litho
For years, the fab-tool industry has speculated that Applied Materials Inc. would enter one of the few equipment markets it does not have an offering: lithography
2010-01-27 Analyst: Is Moore's Law slowing down?
An analyst cited that the 450mm fabs and extreme ultraviolet (EUV) lithography delays may be a possible sign that Moore's Law is in danger of slowing down.
2009-08-07 Analyst: GlobalFoundries trumps TSMC on tech
Startup GlobalFoundries might be not a leader in terms of volume, but in any case, it is a leader in terms of technology, finds Gartner analyst Bob Johnson.
2012-06-13 20nm is a different playing field, says exec
According to Synopsys Inc.'s Saleem Haider, the requirement for lithography double patterning on many layers makes moving to the 20nm node a major undertaking that will require customers to invest in new design tool sets
2010-03-01 TSMC takes on 40nm yields, high-k, litho issues
At the TSMC Japan Executive Forum in Yokohama, Shang-Yi Chiang, senior VP of R&D at TSMC, addressed several issues about the silicon foundry giant.
2010-06-28 Stanford top engineer weighs in on CMOS outlook
EE Times recently sat down with James Plummer, dean of Stanford's school of engineering, for a wide ranging interview on the outlook for CMOS, engineering, education and globalization.
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