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2003-02-07 Shipley opens R&D facility for microelectronic materials
Shipley Co. L.L.C. has opened its Advanced Technology Center in Marlborough, Massachusetts.
2008-02-29 Sematech launches nanoimprint litho program
Sematech has started a development program in nanoimprint lithography, a move that's expected to be a major boost in this arena
2009-08-20 SanDisk CEO offers NAND forecast
SanDisk Corp. founder, chairman and CEO Eli Harari warned that the NAND industry is at the "crossroads," as there is a "disconnect" between future capacity requirements and demand.
2013-10-09 Researchers unravel new source of extreme UV light
Scientists blasted a 30?m droplet of tin with a high-powered laser 6,000 times a second and found that 30 per cent of the EUV emission came from behind the part of the droplet that was struck by the laser
2015-04-22 Moore's law and 5G: Out with old, in with the new?
In order for 5G to happen, there needs to be a collective effort to shy away from 20nm CMOS and Moore's law and look toward next generation technology for increased speed and lower power.
2011-03-04 JSR, IBM launch self-assembly litho structure
Targeted at the sub-20nm half-pitch node, the new DSA technology enables phase separation, resulting in good profiles and more flexible use in both logic and memory applications.
2011-04-28 Japanese light source providers part ways
Dissolving their partnership, Komatsu Ltd will acquire Ushio Inc.'s shares in Gigaphoton, thus making the light source venture its wholly owned subsidiary.
2003-06-16 Infineon moves forward on 157nm research
Infineon Technologies AG and Clariant Corp. are collaborating to develop photoresists for the 157nm technology.
2002-10-11 IMEC to establish 300mm silicon research foundry
IMEC has laid its plans of setting up a 300mm silicon research platform initiative to perform advanced process research at least "two generations ahead of manufacturing."
2010-08-23 Harari: Reflections before retirement
In an interview with EE Times, Eli Harari, founder, chairman and chief executive of SanDisk Corp., provides insight about lithography, NAND and the post-NAND era
2010-03-24 Execs weigh in on right path for litho
Was EUV the wrong bet for the industry? If so, what should it be working on instead? And who will benefit in the long run? Litho experts and executives give their opinions on these hot questions
2010-01-14 Exec lists roadblocks to fab tool recovery
At SEMI's Industry Strategy Symposium (ISS), Norm Armour, VP and general manager for Fab 2 at foundry upstart GlobalFoundries Inc. listed some challenges for tool vendors.
2006-02-20 EUVL achieves 'cleaning milestone'
Sematech North researchers working on extreme ultraviolet lithography (EUVL) claims to have achieved an important breakthrough in the complex process of cleaning mask blanks
2013-06-05 DRAM market begins to rebound
The industry value for 2013 is estimated to grow 27.2 per cent YoY reaching around $25.2 billion.
2014-07-01 Chip industry to face hurdles brought by 20nm tech
Executives from two capital equipment firms said chip vendors face the challenges brought by higher costs and complexities due to tighter margins, new processes and materials at 20nm and beyond.
2008-12-01 ASML reveals 22nm litho road map
Company executives claim that ASML is prepared to ship its next-gen immersion lithography system next year and its EUV system by 2010.
2010-09-29 Are Japan litho companies on the way out?
Japanese lithography equipment makers look set to fall further behind market leader ASML Holding NV, according to analysts with investment broker Nomura
2010-03-22 Analyst offers peak into Intel 22nm litho roadmap
Arete Research analyst at Jagadish Iyer said Intel's 22nm node will require 45 "litho layers," of which 55 percent will need immersion.
2002-08-01 Tabletop system generates extreme-UV laser light
A small, inexpensive tabletop laser system that can produce coherent EUV laser light has been built by a research team at the University of Colorado
2002-01-09 Veeco, Photronics partner in next-generation photomasks
Veeco Instruments Inc. and Photronics Inc. have formed a strategic relationship focused on developing manufacturing technologies for fabrication of enhanced reticles and next-generation lithography masks
2007-08-24 Litho blocks NAND scaling, says Micron exec
One of the biggest roadblocks to NAND scaling is lithography, said Frankie Roohparvar, VP of NAND development at Micron Technology
2005-07-08 Intel, Corning codevelop ultraviolet photomask substrates
Intel Corp. and Corning Inc. have entered into an agreement to develop ultra low thermal expansion ULE glass photomask substrates required for Extreme Ultraviolet (EUV) lithography technology.
2003-09-11 Modeling tools aid in immersion litho quest
A German company is fielding modeling tools that can help chip makers assess the promise of immersion lithography
2014-10-17 TSMC raising capex to $10B for FinFET ramp-up
The company will increase its 2015 capex from the $9.6 billion slated for this year. TSMC is raising the stakes with Samsung, both aiming to win FinFET orders from Apple and Qualcomm for the fast-growing smartphone and tablet segments of the electronics business.
2011-05-17 TSMC expands R&D efforts with Sematech affiliation
TSMC is now one of the core members of Sematech. This will accelerate the improvement of R&D and manufacturing solutions in leading edge technologies.
2016-01-18 TSMC CEO expects stronger Q1 after Capex boost
The world's largest foundry said it will increase its capital expenditure in 2016 to an amount ranging from $9 billion to $10 billion as it aims for a bigger share of finer geometry chips.
2008-06-23 Toppan, IBM extend photomask partnership to 22nm
Toppan Printing Co. Ltd and IBM Corp. have entered a new development agreement on the last phase of 32nm and all phases of 22nm photomask process development.
2009-07-09 Top 10 industry issues
Here are the top 10 looming issues that the semiconductor capital equipment industry is facing.
2014-01-23 Semiconductor industry feels ripple effect of Intel's troubles
The need for Intel to cut costs in many areas, even investment in future process technology will impact the semiconductor market significantly.
2014-10-17 Samsung to build $14.7B IC fab
In order to maintain leadership in memory IC sales and support new markets, Samsung is building a new wafer fab in South Korea, estimated at $14.7 billion.
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