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2013-06-06 Fraunhofer, EV Group work on direct wafer bonding for solar cells
Fraunhofer ISE collaborated with EV Group to develop equipment and process technology to enable electrically conductive and optically transparent direct wafer bonds at room temperature.
2003-11-20 EV Group made strategic supplier by DALSA
EV Group has been selected by Dalsa Semiconductor as the strategic supplier for MEMS wafer bonding and thick polymer lithography production equipment.
2014-01-27 Samsung SDI, China to enter EV battery joint venture
Samsung SDI, an affiliate of Samsung Electronics Co Ltd, will invest $600 million in the factory in Shaanxi province, and in other electric car battery-related businesses over the next five years.
2011-11-10 Qualcomm buys its way to EV wireless charging
The firm acquired HaloIPT and its electric vehicle wireless charging capability based on a technology called inductive power transfer.
2013-08-22 Korean researchers develop foldable, compact EV
The team at KAIST said the micro electric car can be used either as a personal car or part of the public transit system to connect major transportation routes within a city.
2011-07-11 Green eMotion study to ramp up EV adoption
Green eMotion is an EU project which contributes to the development of the existing standards for electromobility interfaces.
2013-05-09 Next-Gen EVG120 supports coating, developing apps
The EVG120 resist processing system features a new robot with dual arms for fast wafer swapping and additional processing chambers, which result in enhanced throughput and overall productivity.
2003-10-22 IMEC, EVG partner on packaging, bonding techniques
Inter-university MicroElectronics Center (IMEC) and EV Group (EVG) have signed a joint development agreement on wafer-level packaging and MEMS wafer bonding.
2013-07-03 EVG unveils room-temperature debonding platform
The platform includes two new debonding processes that have been qualified for EVG's high-volume production temporary bonding/debonding systems in addition to the company's ZoneBOND technology.
2013-12-05 EVG unveils full-field UV nanoimprint lithography system
Featuring an integrated soft stamp/template fabrication capability, the EVG720 system enables throughputs of more than 60 wafers per hour with the lowest cost of ownership, stated the firm.
2014-12-03 EVG unlocks nanoimprint lithography hub for photonics apps
The Nanoimprint Lithography NILPhotonics Competence Centre aims to help customers assess the technology and equipment for nanoimprint lithography (NIL) in the field of photonics.
2003-05-27 EVG system ensures precise bond alignment
The EV Group has released the EVG850 temporary bonding and debonding system that offers reliable backside processing of thin and fragile wafers.
2003-12-22 EVG equipment deployed in Beijing's Tsinghua-Foxconn Nanotechnology Center
EV Group (EVG), a manufacturer of MEMS and semiconductor wafer processing equipment, has successfully installed several advanced wafer processing tools at Tsinghua-Foxconn Nanotechnology Center at National Tsinghua University (NTHU), located in Beijing.
2010-11-29 Tesla Motors taps Infineon for power chips
Tesla Motors Inc. is sourcing power chips from Infineon, according to a report by Bloomberg.
2009-01-19 Ultrathin wafer bonding system installed in Taiwan lab
EV Group (EVG) has installed an EVG 500 series wafer-bonding system at Brewer Science Inc.'s Taiwan applications lab.
2011-06-07 Partnership aims hi-tech MEMS production process
EV Group announced that it is partnering with the Industrial Technology Research Institute to deliver advanced manufacturing techniques for next-generation MEMS devices.
2010-07-13 EVG, IME join hands on 3D IC integration
EV Group and Singapore's Institute of Microelectronics (IME) signed a two-year agreement to cooperate on developing 3D IC integration technologies.
2009-07-21 EVG, Applied ink 3D wafer bonding deal
EV Group (EVG) has partnered with Applied Materials Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in 3D IC packaging applications.
2011-07-14 Bonding system targets 450mm SOI wafers
EV Group has released a bonding system for 450mm-diameter wafers manufactured from silicon-on-insulator substrates.
2013-07-10 A*STAR IME consortium delve into advanced packaging
A*STAR IME and a group of semiconductor firms have teamed up to address reliability and performance issues in packaging solutions for compact sized consumer electronics and high power electronics
2008-02-13 Qualcomm enables global connectivity in HP notebooks
Hewlett Packard has incorporated Qualcomm's Gobi global mobile Internet technology in select 2008 HP business notebooks to enable high-speed connectivity on 3G UMTS HSPA/EV-DO networks with a single wireless solution
2010-01-15 Li-ion batteries power plug-in HEVs
Hitachi Ltd and Hitachi Vehicle Energy Ltd. have developed Li-ion batteries for plug-in hybrid electric vehicles, a first for the Hitachi Group
2009-11-26 HSPA success in APEJ paves way for LTE
IDC expects a select group of 3G operators to pioneer investment in LTE, seen as the all-IP migration path to 4G
2009-02-17 Gobi2000 module supports 5.76Mbit/s uplink
Qualcomm Inc. has launched its second-generation embedded Gobi module, delivering multi-mode 3G mobile Internet access on either High-Speed Packet Access (HSPA) or CDMA2000 EV-DO networks in markets around the world
2011-04-15 Freescale, Fuji jointly develop IGBTs for EVs, HEVs
By adding Fuji IGBT products to its portfolio, Freescale will be able to offer all major electronic components of EV systems, including MCUs, analog gate drivers and battery-monitoring ICs
2009-06-08 CDMA2000 boosts 3G services in China
According to the CDMA Development Group (CDG), new 3G wireless voice and mobile broadband service offerings in China are poised to rapidly replace fixed-line solutions, exemplified by subscriber adoption of China Telecom's CDMA2000 1X and EV-DO Revision A (Rev. A) mobile broadband services.
2011-05-20 U.S., Japan businesses collaborate on smart grid project
A group of U.S. and Japan companies have been selected as contractors of a world-leading smart grid project in Maui, Hawaii Island
2014-05-28 Wafer-to-wafer bonding pulls off sub-micron accuracy
The sub-micron accuracy was achieved using Ziptronix's technology and EVG's equipment. This approach can be used to manufacture fine-pitch 3D ICs for stacked memory and SoCs, and image sensors.
2005-06-15 VLSI releases IC-equipment customer satisfaction rankings
Tegal Corp. and Varian Semiconductor Equipment Associates Inc. are among the winners in terms of customer satisfaction within the chip-equipment industry for 2005, according to an annual survey conducted by VLSI Research Inc. (See below for ranking tables).
2009-02-03 U.S. Army invests in flexible electronics R&D
The U.S. Army has committed to sponsor an additional five years of R&D at Arizona State University's (ASU) Flexible Display Center.
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