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2006-07-25 Heat sinks cool BGA components
Advanced Thermal Solutions has introduced a low-profile, high-performance heat sink designed for cooling BGA components in low airflow velocity conditions.
2011-12-08 Silicide process offers 2 pretreatment types
Ulvac's ENTRONTM-EX2 W300 CVD-Ni/CVD-Co film formation system for the silicide process is not only for silicide apps but for MEMS with NI and Co films as well.
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