Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > FEI Co.

FEI Co. Search results

?
?
total search23 articles
2003-01-15 Veeco, FEI terminate merger agreement
Veeco Instruments Inc. and FEI Co. have mutually decided not to pursue the merger agreement both companies entered in July 2002.
2002-12-19 Veeco, FEI reviews conditions of merger
Veeco Instruments Inc. and FEI Co. have announced that they will not be able to complete their previously announced merger by December 31, 2002.
2002-12-20 Stanford advanced nano facility to house FEI systems
Stanford University has established an advanced nanocharacterization facility in collaboration with FEI Co.
2002-06-20 Silicon Laboratories installs FEI's circuit edit system
Silicon Laboratories Inc. has installed FEI Co.'s Vectra 986 circuit edit system. Silicon Labs will use the system to edit prototype devices while reducing overall cost and preserving critical time-to-market advantages.
2004-08-09 FEI, Zyvex ink strategic alliance deal
FEI Co. and Zyvex Corp. have signed an agreement to provide real-world solutions for electrical/IC probing applications.
2002-09-17 FEI to deliver edit systems to Taiwan, North America
FEI Co. has received the first two orders for its Vectra 986+ circuit edit system from a U.S.-based semiconductor manufacturer and a Taiwan-based semiconductor service lab.
2005-07-13 FEI to close plant, lowers guidance
Communications semiconductor supplier FEI Co. has decided to restructure and consolidate its operations, including closing its facility in Peabody, MA.
2003-07-17 FEI metrology system speeds-up chip development
The CLM-3D is an in-fab fully automated DualBeam metrology system designed for rapid process development of new chip technologies below 130nm.
2004-06-30 FEI launches European NanoPort
FEI Co. has opened its enhanced Eindhoven campus and NanoPort product and applications center.
2011-06-16 FEI ion beam cuts imaging time for MEMs, 3D chips
The Vion PFIB tool can cut the time to image MEMS and 3D chip features by 20x, from more than 10hrs to under 40mins for TSVs, revealing in minutes chip features ranging in size from 30nm to 1mm.
2003-10-14 FEI breaks ground at new headquarters
Nanotechnology company FEI Co. has opened its new HQ and "World Campus", consolidating its local Oregon operations at one site and providing room for expansion.
2008-07-07 FEI buys wireless audio IP license for UWB
Focus Enhancements Inc. has entered into an agreement to purchase certain intellectual property rights for a prototype wireless audio product chipset, which features 2ms latency and scalability up to 16 channels.
2003-07-21 Silicon debug tools lengthen their reach
Credence Systems and FEI have unveiled new products and acquisition this week that could assist design teams with leading-edge ICs
2006-12-05 New microscope enables atomic-scale wafer analysis
FEI will unveil a family of transmission electron microscopes (TEM) that it says will enable atomic-scale imaging and analysis of semiconductor wafers
2006-08-07 Motorola stops radio patent infringement in China
Motorola announced that it has reached agreement with Quanzhou Fei Jie Electronic, also known as Linton, for the company to immediately end production of its LT-2188/3188 radios
2005-08-03 Sub-angstrom microscope targets nanotechnology
FEI Co. unveiled the new device at the Microscopy & Microanalysis conference this week in Honolulu. FEI claims its commercial instrument resolves at the sub-angstrom scale for the first time.
2002-04-22 Shaanxi Yinhe targets power cable production in China
Shaanxi Yinhe Yuandong Power Cable Co. Ltd has disclosed its plans to install a high-voltage cable production line, in a bid to become the largest power cable production base in mainland China
2010-08-05 SEM offers high beam current, low vacuum capability
The series of ultra-high resolution scanning electron microscopes are designed to provide nanometer-scale resolution and ultra-precise analysis on a wide range of samples.
2007-01-05 Philips posts gains, losses due to corporate disposals
The wind-down corporate investments at Royal Philips Electronics has led to both one-time gains and losses at the company that it plans to account for in its Q4 2006 results.
2009-01-14 Wireless power consortium pursues standard
A new global initiative to drive convenience in electronics charging was launched at the first Wireless Power Consortium conference at Hong Kong Science Park. The Wireless Power Consortium pursues a standard for a universal wireless power charging.
2014-07-15 Porous silicon oxide improves memory prod'n
Researchers from Rice University developed what they say is a breakthrough silicon oxide technology aimed at high-density, next-generation computer memory that is one step closer to mass production.
2008-09-25 IBM opens gates of 300mm fab
Up until recently, IBM Corp. and its secretive chip unit refused to reveal any information about its semiconductor operations.
2007-01-24 Chipmakers to curb equipment shopping spree in '07
Coming off a near-record year in 2006, the semiconductor equipment industry may be entering rougher waters in 2007, analysts said at the recent Industry Strategy Symposium.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top