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Flip Chips What is flip chip? Search results

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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
total search178 articles
2007-10-11 Thermal pillar copper tech helps cool flip-chips
Nextreme claims to have solved the overheating problem with modern flip-chips with its thermal copper pillar bumps, which can either help cool chips, or can be used in reverse to generate energy from waste heat.
2001-07-16 Reworking CSPs, ?BGAs and flip-chips
Rework of CSPs and flip-chip is required to achieve systems that are reliable, repeatable and cost effective
2005-01-03 Jetting of flux for flip chips
In flip chip assembly, the jetting of liquid flux material onto the substrate has advantages over the dipping of the attached balls into flux
2010-06-04 IPAD 500?m Flip Chip: package description and recommendations for use
This application note provides package and usage recommendation information for 500?m pitch Flip Chips.
2007-11-30 Indian startup seeks funds for ATMP facility for flip-chips
India-based semiconductor manufacturing startup SemIndia is in talks to raise $100 million to help launch operations.
2006-06-02 Assembling high-Pb DS2761 flip-chips in a Pb-Free assembly flow
This application note details the Pb-free assembly process used for DS2761 flip-chip die, and the reliability stresses encountered after the assembly
2005-06-08 Assembling high-lead (Pb) DS2502 flip-chips in a Pb-free assembly flow
This app note details the Pb-free assembly process used, and the reliability stresses encountered after the assembly.
2007-07-10 Understanding flip-chip and chip-scale package technologies and their applications
This article first defines the terms "flip chip" and "chip-scale package" and explains the technical development of wafer-level packaging (WLP) technology
2010-07-09 TI turns to pillar flip-chip for 45-/40nm node
Texas Instruments Inc. is embracing an emerging technology called fine-pitch copper pillar flip-chip packages for devices at the 45-/40nm node and below
2011-10-14 The move toward 3D chips
Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization
2005-06-09 ST Micro balances line capacitance, attenuation in new chips
The two new low-capacitance EMI-filter and electrostatic-discharge protection chips from STMicroelectronics are designed to suppress EMI/RFI noise in sensitive, high-volume equipment
2004-10-29 SDK blue LED features flip chip structure
Showa Denko K.K. announced that it has developed a blue LED based on gallium nitride.
2008-01-04 Ralink tips low power, 'smallest' 802.11n chips
Ralink has released new 802.11n single chips, the RT3080 that enables Wi-Fi in handheld/mobile devices and the RT3070, claimed to be the smallest 802.11n USB single chip
2007-09-19 PLX, Mellanox field Express Gen2 chips
PLX Technology debuted its first family of Express 2.0 switches, and Mellanox Technologies announced Infiniband and 10GbE adapter cards using the interconnect onSept. 17.
2005-11-29 New LED chips from SDK
Showa Denko K.K. launched gallium-nitride-based near ultraviolet and green LED chips for use in general white lighting and backlighting of large LCD screens
2016-02-15 How to prevent latchup in CMOS chips
Latchup becomes a real problem when you try to power up and down different sections of your design to save power. Find out how to address this issue.
2016-04-25 Guard against latchup in CMOS chips
Find out how to deal with latchup, which becomes a real problem when you try to power up and down different sections of your design to save power.
2006-01-25 Flip-Stack packaging supports wirebond-to-flip-chip transition
Amkor announced the Flip-Stack package solution that is specifically designed to support emerging transition from wirebond to flip chip interconnect for high-performance DSPs, ASICs and RF chips.
2008-02-25 Flip Ultra camcorder delivers ode to clean design
When engineers at Pure Digital Inc. sat down a couple of years back to lay out their next project, they had many of the typical design criteria in mind: low cost, high quality, size, ease of use and low power.
2014-11-06 Enhance SoC efficiency with multi-bit flip-flops
Here's a look at the architecture of multi-bit flip-flops, its merits and drawbacks. It also tackles the results of its implementation in a particular design and the various areas of concern
2010-02-23 DLP chips enable nHD pico projectors for handsets
Texas Instruments Inc. has launched its latest digital light processor (DLP) chip that will enable nHD resolution pico projector modules for the smallest of mobile phones.
2007-11-01 Chips address lighting challenge
Portable electronic devices today require additional power circuits to drive auxiliary RGB status lights and to backlight the keypad, making lighting a major power management challenge.
2003-07-02 Vitesse to make communication chips
Vitesse Semiconductor will work with BAE Systems and the University of Illinois Urbana Champain to fulfill a $6M contract from Darpa to develop advanced manufacturing processes and communication ICs.
2007-02-15 Infineon chips support both DVB-H, DVB-T
Infineon has announced two highly integrated, power-efficient DVB-H/T chip solutions.
2003-04-03 FEI offers system to modify 90nm chips
The company has announced the development of a new focused ion beam system capable of accessing and rewiring the metal stacks on 90nm ICs.
2004-03-16 Precision jetting allows closer component placement
One of the limitations on the close placement of components has been the space requirements for underfilling flip-chips, BGAs, and CSPs; and Asymtek's new developed solution makes it unnecessary to insert the needle between components.
2011-08-29 Placement system touts high-speed die bonding
Single machine solution eases IC manufacturing with die bonding speeds at 3,500cph per head at 25?m.
2004-05-17 Jetting permits closer component placement
Jetting sharply differs from conventional needle dispensing that has been used to underfill flip-chips, BGAs, CSPs and to dispense fluids for die attach and other apps.
2003-09-05 Chip package venture established in Jiangyin
Jiangsu Changjiang Electronics Technology Co. Ltd has set up a joint venture, named Jiangyin Changjiang Electronics, with Singapore-based APS Inc. in Jiangyin.
2002-04-24 Assembleon, Speedline to provide integrated line solutions
Assembleon and Cookson Electronics' Speedline Technologies are forming an alliance that merges Assembleon's pick-and-place systems and processes and Speedline's expertise in equipment, systems and processes.
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